Keith R. Cook

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures including carrier wafers and attached devi...
- Patent number 10,128,142
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and methods of us...
- Patent number 9,472,518
- Issue date Oct 18, 2016
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming trench isolation in the fabrication of integrate...
- Patent number 8,349,699
- Issue date Jan 8, 2013
- Micron Technology, Inc.
- Robert D. Patraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming trench isolation in the fabrication of integrate...
- Patent number 8,012,847
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- Robert D. Patraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,939,948
- Issue date May 10, 2011
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,528,064
- Issue date May 5, 2009
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure for two-transistor DRAM memory cell and method...
- Patent number 7,488,664
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Keith Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming trench isolation in the fabrication of integrate...
- Patent number 7,387,940
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,282,433
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming protective segments of material, and etch stops
- Patent number 6,653,241
- Issue date Nov 25, 2003
- Micron Technology, Inc.
- Mark E. Jost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming protective segments of material, and etch stops
- Patent number 6,620,734
- Issue date Sep 16, 2003
- Micron Technology, Inc.
- Mark E. Jost
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...
- Publication number 20170011948
- Publication date Jan 12, 2017
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...
- Publication number 20150287687
- Publication date Oct 8, 2015
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Trench Isolation in the Fabrication of Integrate...
- Publication number 20110300689
- Publication date Dec 8, 2011
- Micron Technology, Inc.
- Robert D. Patraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...
- Publication number 20090179330
- Publication date Jul 16, 2009
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...
- Publication number 20080032494
- Publication date Feb 7, 2008
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor structure for two-transistor dram memory cell and method...
- Publication number 20070034928
- Publication date Feb 15, 2007
- Micron Technology, Inc.
- Keith Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming trench isolation in the fabrication of integrate...
- Publication number 20060223279
- Publication date Oct 5, 2006
- Micron Technology, Inc.
- Robert D. Patraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures with bond-pads and methods of forming bump...
- Publication number 20060151880
- Publication date Jul 13, 2006
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming trench isolation in the fabrication of integrate...
- Publication number 20060046426
- Publication date Mar 2, 2006
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PROTECTIVE SEQMENTS OF MATERIAL, AND ETCH STOPS
- Publication number 20030176070
- Publication date Sep 18, 2003
- Mark E. Jost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PROTECTIVE SEGMENTS OF MATERIAL, AND ETCH STOPS
- Publication number 20030176076
- Publication date Sep 18, 2003
- Mark E. Jost
- H01 - BASIC ELECTRIC ELEMENTS

Keith R. Cook

Person

Patents Grantslast 30 patents

Semiconductor structures including carrier wafers and attached devi...

Semiconductor structures including carrier wafers and methods of us...

Methods of forming trench isolation in the fabrication of integrate...

Methods of forming trench isolation in the fabrication of integrate...

Interconnect structures with bond-pads and methods of forming bump...

Interconnect structures with bond-pads and methods of forming bump...

Capacitor structure for two-transistor DRAM memory cell and method...

Methods of forming trench isolation in the fabrication of integrate...

Interconnect structures with bond-pads and methods of forming bump...

Methods of forming protective segments of material, and etch stops

Methods of forming protective segments of material, and etch stops

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...

SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...

Methods of Forming Trench Isolation in the Fabrication of Integrate...

INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...

INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...

Capacitor structure for two-transistor dram memory cell and method...

Methods of forming trench isolation in the fabrication of integrate...

Interconnect structures with bond-pads and methods of forming bump...

Methods of forming trench isolation in the fabrication of integrate...

METHODS OF FORMING PROTECTIVE SEQMENTS OF MATERIAL, AND ETCH STOPS

METHODS OF FORMING PROTECTIVE SEGMENTS OF MATERIAL, AND ETCH STOPS