Keith T. Kwietniak

Person

Highland Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating silicon carriers with conductive through-vi...
- Patent number 7,863,189
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Veeraraghaven S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to generate porous organic dielectric
- Patent number 7,101,784
- Issue date Sep 5, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep filled vias
- Patent number 7,060,624
- Issue date Jun 13, 2006
- International Business Machines Corporation
- Panayotis Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroplating on resistive substrates
- Patent number 6,974,531
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to generate porous organic dielectric
- Patent number 6,921,978
- Issue date Jul 26, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling additives in copper plating baths
- Patent number 6,592,747
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Grant
Method of improving contact reliability for electroplating
- Patent number 6,331,237
- Issue date Dec 18, 2001
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flip-Chip interconnections using lead-free solders
- Patent number 6,224,690
- Issue date May 1, 2001
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layers for electroplated SnPb eutectic solder joints
- Patent number 5,937,320
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plating method
- Publication number 20090095634
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FABRICATING SILICON CARRIERS WITH CONDUCTIVE THROUGH-VI...
- Publication number 20080164573
- Publication date Jul 10, 2008
- Veeraraghaven S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20070034526
- Publication date Feb 15, 2007
- Natsuki Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for direct plating on resistive liners
- Publication number 20060163055
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Philippe M. Vereecken
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050241946
- Publication date Nov 3, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20050199502
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method to generate porous organic dielectric
- Publication number 20050200024
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating apparatus and plating method
- Publication number 20050061659
- Publication date Mar 24, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Deep filled vias
- Publication number 20050037608
- Publication date Feb 17, 2005
- IBM
- Panayotis Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD TO GENERATE POROUS ORGANIC DIELECTRIC
- Publication number 20040224494
- Publication date Nov 11, 2004
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for forming uniformly thick anodized films on...
- Publication number 20040077140
- Publication date Apr 22, 2004
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20040069648
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of controlling additives in copper plating baths
- Publication number 20030000850
- Publication date Jan 2, 2003
- Wilma Jean Horkans
- G01 - MEASURING TESTING
Information Patent Application
Method of improving contact reliability for electroplating
- Publication number 20020027082
- Publication date Mar 7, 2002
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Keith T. Kwietniak

Person

Patents Grantslast 30 patents

Methods for fabricating silicon carriers with conductive through-vi...

Void-free damascene copper deposition process and means of monitori...

Plating apparatus and plating method

Plating method and plating apparatus

Electroplated copper interconnection structure, process for making...

Method to generate porous organic dielectric

Deep filled vias

Method for electroplating on resistive substrates

Method to generate porous organic dielectric

Method of controlling additives in copper plating baths

Method of improving contact reliability for electroplating

Flip-Chip interconnections using lead-free solders

Barrier layers for electroplated SnPb eutectic solder joints

Patents Applicationslast 30 patents

Plating method

METHODS FOR FABRICATING SILICON CARRIERS WITH CONDUCTIVE THROUGH-VI...

Electrolytic processing apparatus and method

Apparatus for direct plating on resistive liners

Plating apparatus and plating method

Method for electroplating on resistive substrates

Method to generate porous organic dielectric

Plating apparatus and plating method

Deep filled vias

Void-free damascene copper deposition process and means of monitori...

METHOD TO GENERATE POROUS ORGANIC DIELECTRIC

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Apparatus and method for forming uniformly thick anodized films on...

Method for electroplating on resistive substrates

Method of controlling additives in copper plating baths

Method of improving contact reliability for electroplating