Kelly Porter LOFGREEN

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture including thermoelectric cooler structures
- Patent number 11,756,856
- Issue date Sep 12, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annular silicon-embedded thermoelectric cooling devices for localiz...
- Patent number 11,694,942
- Issue date Jul 4, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric coolers combined with phase-change material in integ...
- Patent number 11,676,883
- Issue date Jun 13, 2023
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integrated thermoelectric cooler
- Patent number 11,658,095
- Issue date May 23, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal TIM with STIM-like performance with no BSM and BGA com...
- Patent number 11,551,994
- Issue date Jan 10, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a thermoelectric cooler to reduce heat transfer between heat-...
- Patent number 11,462,457
- Issue date Oct 4, 2022
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foam composite
- Patent number 10,651,108
- Issue date May 12, 2020
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronics package with an integrated heat spreader having in...
- Patent number 10,461,011
- Issue date Oct 29, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming serpentine thermal interface material and struct...
- Patent number 9,418,912
- Issue date Aug 16, 2016
- Intel Corporation
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods of forming serpentine thermal interface material and struct...
- Patent number 9,230,877
- Issue date Jan 5, 2016
- Intel Corporation
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220397726
- Publication date Dec 15, 2022
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20220201889
- Publication date Jun 23, 2022
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED LIQUID METAL THERMAL INTERFACE MATERIALS
- Publication number 20210125896
- Publication date Apr 29, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATED THERMOELECTRIC COOLER
- Publication number 20200312742
- Publication date Oct 1, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...
- Publication number 20200294884
- Publication date Sep 17, 2020
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY
- Publication number 20200146183
- Publication date May 7, 2020
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...
- Publication number 20200126888
- Publication date Apr 23, 2020
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES
- Publication number 20200105639
- Publication date Apr 2, 2020
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL TIM WITH STIM-LIKE PERFORMANCE WITH NO BSM AND BGA COM...
- Publication number 20200098661
- Publication date Mar 26, 2020
- Intel Corporation
- Kelly LOFGREEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-...
- Publication number 20200098664
- Publication date Mar 26, 2020
- Intel Corporation
- Krishna Vasanth VALAVALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEALED THERMAL INTERFACE CAVITY WITH LOW...
- Publication number 20190393118
- Publication date Dec 26, 2019
- Intel Corporation
- Brandon M. RAWLINGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH AN INTEGRATED HEAT SPREADER
- Publication number 20190198416
- Publication date Jun 27, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...
- Publication number 20180068926
- Publication date Mar 8, 2018
- Intel Corporation
- JAN KRAJNIAK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FOAM COMPOSITE
- Publication number 20180005917
- Publication date Jan 4, 2018
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS
- Publication number 20170186667
- Publication date Jun 29, 2017
- Intel Corporation
- Arnab Choudhury
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC COOLER HAVING A SOLDERLESS ELECTRODE
- Publication number 20170179000
- Publication date Jun 22, 2017
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...
- Publication number 20160079141
- Publication date Mar 17, 2016
- Intel Corporation
- Patrick Nardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE TECHNIQUES AND CONFIGURATIONS
- Publication number 20140354314
- Publication date Dec 4, 2014
- Hitesh Arora
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL CONTROL OF DEVICE USING FLUID COOLANT
- Publication number 20140262129
- Publication date Sep 18, 2014
- Zhihua LI
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...
- Publication number 20140177166
- Publication date Jun 26, 2014
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Copper-elastomer hybrid thermal interface material to cool under-su...
- Publication number 20080160330
- Publication date Jul 3, 2008
- David Song
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Kelly Porter LOFGREEN

Person

Patents Grantslast 30 patents

Thermal interface structures for integrated circuit packages

Integrated heat spreader (IHS) with heating element

Package architecture including thermoelectric cooler structures

Annular silicon-embedded thermoelectric cooling devices for localiz...

Thermoelectric coolers combined with phase-change material in integ...

Bump integrated thermoelectric cooler

Liquid metal TIM with STIM-like performance with no BSM and BGA com...

Using a thermoelectric cooler to reduce heat transfer between heat-...

Conformable heat sink interface with a high thermal conductivity

Foam composite

Microelectronics package with an integrated heat spreader having in...

Methods of forming serpentine thermal interface material and struct...

Methods of forming serpentine thermal interface material and struct...

Patents Applicationslast 30 patents

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

FILLED LIQUID METAL THERMAL INTERFACE MATERIALS

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

BUMP INTEGRATED THERMOELECTRIC COOLER

THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...

CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY

ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZ...

PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES

LIQUID METAL TIM WITH STIM-LIKE PERFORMANCE WITH NO BSM AND BGA COM...

USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-...

SEMICONDUCTOR PACKAGE WITH SEALED THERMAL INTERFACE CAVITY WITH LOW...

MICROELECTRONICS PACKAGE WITH AN INTEGRATED HEAT SPREADER

ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...

FOAM COMPOSITE

COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS

THERMOELECTRIC COOLER HAVING A SOLDERLESS ELECTRODE

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...

THERMAL INTERFACE TECHNIQUES AND CONFIGURATIONS

THERMAL CONTROL OF DEVICE USING FLUID COOLANT

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...

Copper-elastomer hybrid thermal interface material to cool under-su...