Ken Brown

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic integrated lens compatible with wafer processing
- Patent number 11,894,474
- Issue date Feb 6, 2024
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling layer to reduce underfill stress in semiconductor devices
- Patent number 11,715,928
- Issue date Aug 1, 2023
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Grant
Multiple tier array capacitor
- Patent number 6,532,143
- Issue date Mar 11, 2003
- Intel Corporation
- David G. Figueroa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit testing apparatus
- Patent number 4,632,485
- Issue date Dec 30, 1986
- Kenneth C. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Process for generating conductive patterns
- Patent number 4,454,167
- Issue date Jun 12, 1984
- Beckman Instruments, Inc.
- Anthony J. Bernot
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Gas discharge display device sealing method for reducing gas contam...
- Patent number 4,407,658
- Issue date Oct 4, 1983
- Beckman Instruments, Inc.
- Anthony J. Bernot
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...
- Publication number 20230318247
- Publication date Oct 5, 2023
- Intel Corporation
- Eleanor Patricia Paras RABADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
- Publication number 20220404474
- Publication date Dec 22, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- G02 - OPTICS
Information Patent Application
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE
- Publication number 20220390562
- Publication date Dec 8, 2022
- Guiyun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
INTEGRATED PHOTONICS AND PROCESSOR PACKAGE WITH REDISTRIBUTION LAYE...
- Publication number 20210407909
- Publication date Dec 30, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER
- Publication number 20210288035
- Publication date Sep 16, 2021
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING
- Publication number 20210074866
- Publication date Mar 11, 2021
- Intel Corporation
- Priyanka DOBRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
- Publication number 20210066882
- Publication date Mar 4, 2021
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Application
Multiple tier array capacitor and methods of fabrication therefor
- Publication number 20020085334
- Publication date Jul 4, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Active bridge enabled co-packaged photonic transceiver

Silicon photonic integrated lens compatible with wafer processing

Decoupling layer to reduce underfill stress in semiconductor devices

Multiple tier array capacitor

Electrical circuit testing apparatus

Process for generating conductive patterns

Gas discharge display device sealing method for reducing gas contam...

Patents Applicationslast 30 patents

PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...

SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS

ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

INTEGRATED PHOTONICS AND PROCESSOR PACKAGE WITH REDISTRIBUTION LAYE...

ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING

DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES

Multiple tier array capacitor and methods of fabrication therefor