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Ken Okutani
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Tachikawa, JP
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Patents Grants
last 30 patents
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Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,189,636
Issue date
Mar 13, 2007
Renesas Technology Corp.
Kazuhito Ichinose
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device with a metallization structure
Patent number
7,088,001
Issue date
Aug 8, 2006
Hitachi, Ltd.
Hiroshi Ashihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing same
Patent number
6,897,570
Issue date
May 24, 2005
Renesas Technology, Corporation
Takashi Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a multilayer metallization structure with n...
Patent number
6,764,945
Issue date
Jul 20, 2004
Renesas Technology Corp.
Hiroshi Ashihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing semiconductor devices
Patent number
5,135,608
Issue date
Aug 4, 1992
Hitachi, Ltd.
Ken Okutani
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIODE ELEMENT AND DISPLAY APPARATUS USING SAME AS ELECTRON SOURCE
Publication number
20070182312
Publication date
Aug 9, 2007
Masakazu Sagawa
B82 - NANO-TECHNOLOGY
Information
Patent Application
Semiconductor integrated circuit device with a metallization structure
Publication number
20040207095
Publication date
Oct 21, 2004
Hiroshi Ashihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20040121591
Publication date
Jun 24, 2004
Kazuhito Ichinose
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing same
Publication number
20030230809
Publication date
Dec 18, 2003
Hitachi, Ltd
Takashi Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor integrated circuit device and...
Publication number
20020127852
Publication date
Sep 12, 2002
Kazuya Kawakami
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor integrated circuit device and fabrication method for...
Publication number
20020098670
Publication date
Jul 25, 2002
Hiroshi Ashihara
H01 - BASIC ELECTRIC ELEMENTS