Ken P. HACKENBERG

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies including a thermal interface material
- Patent number 11,791,237
- Issue date Oct 17, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with underfilled sealant
- Patent number 11,710,672
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet (UV)-curable sealant in a microelectronic package
- Patent number 11,710,677
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-chip packages and sinterable paste for use with thermal inter...
- Patent number 11,404,349
- Issue date Aug 2, 2022
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,515,914
- Issue date Dec 24, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,224,299
- Issue date Mar 5, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE
- Publication number 20210013123
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT
- Publication number 20210013115
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...
- Publication number 20200381332
- Publication date Dec 3, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...
- Publication number 20200373220
- Publication date Nov 26, 2020
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL
- Publication number 20200006192
- Publication date Jan 2, 2020
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...
- Publication number 20190267306
- Publication date Aug 29, 2019
- Intel Corporation
- Nachiket R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...
- Publication number 20190206753
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20190157225
- Publication date May 23, 2019
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099777
- Publication date Apr 4, 2019
- Intel Corporation
- Ken P. Hackenberg
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099776
- Publication date Apr 4, 2019
- Ken P. Hackenberg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20180190604
- Publication date Jul 5, 2018
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS

Ken P. HACKENBERG

Person

Patents Grantslast 30 patents

Integrated circuit packages with thermal interface materials with d...

Integrated heat spreader (IHS) with heating element

Microelectronic assemblies including a thermal interface material

Microelectronic package with underfilled sealant

Ultraviolet (UV)-curable sealant in a microelectronic package

Multi-chip packages and sinterable paste for use with thermal inter...

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Patents Applicationslast 30 patents

ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE

MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...

MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL

MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...

BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...