Ken Sugimoto

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,329,570
- Issue date Dec 11, 2012
- Fujitsu Semiconductor Limited
- Masahiro Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,749,897
- Issue date Jul 6, 2010
- Fujitsu Semiconductor Limited
- Ken Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating film forming method capable of enhancing adhesion of sil...
- Patent number 7,642,185
- Issue date Jan 5, 2010
- Fujitsu Microelectronics Limited
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using low-K material as interlayer insulating...
- Patent number 7,256,118
- Issue date Aug 14, 2007
- Fujitsu Limited
- Shun-ichi Fukuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating film forming method capable of enhancing adhesion of sil...
- Patent number 7,208,405
- Issue date Apr 24, 2007
- Fujitsu Limited
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using low-k material as interlayer insulating...
- Patent number 6,943,431
- Issue date Sep 13, 2005
- Fujitsu Limited
- Shun-ichi Fukuyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110250748
- Publication date Oct 13, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Masahiro Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080305645
- Publication date Dec 11, 2008
- FUJITSU LIMITED
- Ken Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor device and semiconductor device
- Publication number 20070181966
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Hirofumi Watatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating film forming method capable of enhancing adhesion of sil...
- Publication number 20070173054
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20070123035
- Publication date May 31, 2007
- FUJITSU LIMITED
- Ken Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming SiC-based film and method for fabricating semico...
- Publication number 20060205193
- Publication date Sep 14, 2006
- FUJITSU LIMITED
- Ken Sugimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device
- Publication number 20060087041
- Publication date Apr 27, 2006
- FUJITSU LIMITED
- Shun-ichi Fukuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using low-K material as interlayer insulating...
- Publication number 20050250309
- Publication date Nov 10, 2005
- FUJITSU LIMITED
- Shun-ichi Fukuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating film forming method capable of enhancing adhesion of sil...
- Publication number 20050242440
- Publication date Nov 3, 2005
- FUJITSU LIMITED
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using low-k material as interlayer insulating...
- Publication number 20040021224
- Publication date Feb 5, 2004
- FUJITSU LIMITED
- Shun-ichi Fukuyama
- H01 - BASIC ELECTRIC ELEMENTS

Ken Sugimoto

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Insulating film forming method capable of enhancing adhesion of sil...

Semiconductor device using low-K material as interlayer insulating...

Insulating film forming method capable of enhancing adhesion of sil...

Semiconductor device using low-k material as interlayer insulating...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device

Fabrication process of semiconductor device and semiconductor device

Insulating film forming method capable of enhancing adhesion of sil...

Method of manufacturing semiconductor device

Method for forming SiC-based film and method for fabricating semico...

Semiconductor device

Semiconductor device using low-K material as interlayer insulating...

Insulating film forming method capable of enhancing adhesion of sil...

Semiconductor device using low-k material as interlayer insulating...