KENG-CHIH LIN

Person

Tu-Cheng, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy fin structures and methods of forming same
- Patent number 12,154,822
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures with stacked metal silicide layers for...
- Patent number 12,148,807
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 12,112,974
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer formation with a spin-on dielectric material
- Patent number 12,094,952
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 12,094,947
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel structure
- Patent number 12,087,819
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial backside contact
- Patent number 12,080,766
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures for stacked semiconductor devices
- Patent number 12,074,068
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 12,057,397
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed photobiomodulation therapy system and method
- Patent number 12,035,433
- Issue date Jul 9, 2024
- Applied BioPhotonics Ltd
- Richard K. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device of dielectric layer
- Patent number 12,034,075
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including a heat dissipation layer and metho...
- Patent number 11,996,363
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal budget dielectric for semiconductor devices
- Patent number 11,942,358
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 11,942,447
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance fill metal layer material as stressor in metal gates
- Patent number 11,923,367
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,908,921
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,894,437
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,246
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner spacers for gate-all-around semiconductor devices
- Patent number 11,855,214
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co. LTD
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with high contact area
- Patent number 11,855,215
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing semiconductor devices with tunable low-k...
- Patent number 11,848,238
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,837,544
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure formed by cyclic chemical vapor deposition
- Patent number 11,823,896
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,817,384
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,804,539
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING TRENCH ISOLATION PROCESS
- Publication number 20240395597
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240387789
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER LAYER FOR BACKSIDE CONTACTS OF SEIMICONDUCTOR DEVICES
- Publication number 20240387653
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Structures and Methods of Forming Same
- Publication number 20240387240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20240371952
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371961
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-YU YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CHANNEL STRUCTURE
- Publication number 20240371939
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240363417
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL BACKSIDE CONTACT
- Publication number 20240363704
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL
- Publication number 20240363722
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355825
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355733
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240355805
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240332419
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Contacts and Methods of Forming the Same
- Publication number 20240332357
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE...
- Publication number 20240282622
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240282761
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240274539
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE FILL METAL LAYER MATERIAL AS STRESSOR IN METAL GATES
- Publication number 20240258318
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240249947
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND MO...
- Publication number 20240240010
- Publication date Jul 18, 2024
- Chimei Corporation
- Keng-Chu Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
JIG FOR AUTOMATICALLY MEASURING FLOW RATE OF RETICLE CARRIER
- Publication number 20240219217
- Publication date Jul 4, 2024
- GUDENG EQUIPMENT CO., LTD.
- CHIN-HUNG WEN
- G01 - MEASURING TESTING
Information Patent Application
JIG FOR MEASURING TEMPERATURE AND HUMIDITY OF RETICLE CARRIER
- Publication number 20240219242
- Publication date Jul 4, 2024
- GUDENG EQUIPMENT CO., LTD.
- CHAO-CHIN CHIN
- G01 - MEASURING TESTING

KENG-CHIH LIN

Person

Patents Grantslast 30 patents

Dummy fin structures and methods of forming same

Backside contact structures with stacked metal silicide layers for...

Integrated circuit isolation feature and method of forming the same

Air spacer formation with a spin-on dielectric material

Semiconductor structure and method of manufacturing the same

Dual channel structure

Epitaxial backside contact

Epitaxial structures for stacked semiconductor devices

Capping layer for liner-free conductive structures

Method and structure for barrier-less plug

Distributed photobiomodulation therapy system and method

Device of dielectric layer

Interconnect structure including a heat dissipation layer and metho...

Self-aligned barrier for metal vias

Low thermal budget dielectric for semiconductor devices

Storage layers for wafer bonding

Device of dielectric layer

Liner-free conductive structures with anchor points

Low resistance fill metal layer material as stressor in metal gates

Transistor isolation structures

Bilayer seal material for air gaps in semiconductor devices

Hybrid conductive structures

Semiconductor device and method

Inner spacers for gate-all-around semiconductor devices

Semiconductor device structure with high contact area

Methods for manufacturing semiconductor devices with tunable low-k...

Liner-free conductive structures with anchor points

Conductive structure formed by cyclic chemical vapor deposition

Interconnect structure and manufacturing method for the same

Transistor isolation structures

Patents Applicationslast 30 patents

Surface Profile Control Of Passivation Layers In Integrated Circuit...

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

METHOD FOR PERFORMING TRENCH ISOLATION PROCESS

SEMICONDUCTOR DEVICES

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

LINER LAYER FOR BACKSIDE CONTACTS OF SEIMICONDUCTOR DEVICES

Dummy Fin Structures and Methods of Forming Same

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DUAL CHANNEL STRUCTURE

EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES

EPITAXIAL BACKSIDE CONTACT

AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL

Capping Layer For Liner-Free Conductive Structures

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

DEVICE OF DIELECTRIC LAYER

Transistor Contacts and Methods of Forming the Same

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE...

CARRIER STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

LOW RESISTANCE FILL METAL LAYER MATERIAL AS STRESSOR IN METAL GATES

DEVICE OF DIELECTRIC LAYER

SELF-ALIGNED BARRIER FOR METAL VIAS

THERMOPLASTIC COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND MO...

JIG FOR AUTOMATICALLY MEASURING FLOW RATE OF RETICLE CARRIER

JIG FOR MEASURING TEMPERATURE AND HUMIDITY OF RETICLE CARRIER