Membership
Tour
Register
Log in
Kenichi Nishino
Follow
Person
Osaka-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
Patent number
7,938,929
Issue date
May 10, 2011
Panasonic Corporation
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
Patent number
7,490,652
Issue date
Feb 17, 2009
Panasonic Corporation
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component, component mounting equipment, and component m...
Patent number
7,220,922
Issue date
May 22, 2007
Matsushita Electric Industrial Co., Ltd.
Kenichi Nishino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump bonding unit with tray storage and transport apparatuses
Patent number
6,647,616
Issue date
Nov 18, 2003
Matsushita Electric Industrial Co., Ltd.
Nobuya Matsumura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
Patent number
6,544,377
Issue date
Apr 8, 2003
Matsushita Electric Industrial Co., Ltd.
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Component mounting apparatus and method
Patent number
6,246,789
Issue date
Jun 12, 2001
Matsushita Electric Industrial Co., Ltd.
Naoto Hosotani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
IC discarding apparatus for flip chip mounting facility
Patent number
6,129,203
Issue date
Oct 10, 2000
Matsushita Electric Industrial Co., Ltd.
Hiroyuki Kiyomura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and device for sealing IC chip
Patent number
6,055,724
Issue date
May 2, 2000
Matsushita Electric Industrial Co., Ltd.
Kenichi Nishino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus for terminal component
Patent number
5,582,341
Issue date
Dec 10, 1996
Matsushita Electric Industrial Co., Ltd.
Shinji Kanayama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of bonding an external lead and a tool therefor
Patent number
5,462,626
Issue date
Oct 31, 1995
Matsushita Electric Industrial Co., Ltd.
Shinji Kanayama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC C...
Publication number
20090120998
Publication date
May 14, 2009
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heating and pressurizing apparatus for use in mounting electronic c...
Publication number
20060016562
Publication date
Jan 26, 2006
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component component mounting equipment and component mou...
Publication number
20040060666
Publication date
Apr 1, 2004
Kenichi Nishino
G02 - OPTICS
Information
Patent Application
Heating and pressurizing apparatus for use in mounting electronic c...
Publication number
20030121616
Publication date
Jul 3, 2003
Shozo Minamitani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR