Claims
- 1. An electronic component mounting apparatus for producing a plurality of circuit boards, in which an electronic component pre-bonded on each circuit board of the boards via a bonding element is heated and pressurized so as to be post-bonded, the apparatus comprising:
a pre-bonding unit for pre-bonding the electronic component onto each circuit board; and an electronic-component post-bonding unit which is separate from and independent of the pre-bonding unit and operates simultaneously with the pre-bonding unit, and which heats and pressurizes the pre-bonded electronic component so that the pre-bonded electronic component is post-bonded on the circuit board.
- 2. An electronic component mounting apparatus according to claim 1, further comprising a carrying unit for carrying the circuit board produced by the pre-bonding unit with the electronic component pre-bonded thereon, from the pre-bonding unit to the post-bonding unit.
- 3. A heating and pressurizing apparatus for use in mounting electronic components, comprising:
a placement table for placing thereon a circuit board on which an electronic component has been pre-bonded via a bonding element applied onto the circuit board; and a mounting finishing unit which is provided separately from the placement table and which heats the electronic component pre-bonded onto the circuit board placed on the placement table and pressurizes the electronic component in a direction of thickness of the circuit board, whereby the electronic component is post-bonded on the circuit board.
- 4. A heating and pressurizing apparatus for use in mounting electronic components according to claim 3, wherein the mounting finishing unit comprises:
a pressurizing device which has a contact member having a contact surface to be brought into contact with the pre-bonded electronic component, and which moves the contact member in the direction of thickness of the circuit board to press the pre-bonded electronic component against the circuit board; and a heating device for heating the contact member to post-cure the bonding element.
- 5. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the pressurizing device further comprises:
a parallelism adjuster for adjusting parallelism between the contact surface of the contact member and the pre-bonded electronic component; and a pressurizing-force adjuster for adjusting pressurizing force of the contact member.
- 6. A heating and pressurizing apparatus for use in mounting electronic components according to claim 3, wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.
- 7. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.
- 8. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.
- 9. A heating and pressurizing apparatus for use in mounting electronic components according to claim 3, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 10. A heating and pressurizing apparatus for use in mounting electronic components according to claim 9, wherein the contamination preventing member is formed of a sheet material.
- 11. A heating and pressurizing apparatus for use in mounting electronic components according to claim 3, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 12. A heating and pressurizing apparatus for use in mounting electronic components according to claim 3, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 13. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.
- 14. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.
- 15. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.
- 16. A heating and pressurizing apparatus for use in mounting electronic components according to claim 6, wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.
- 17. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.
- 18. A heating and pressurizing apparatus for use in mounting electronic components according to claim 6, wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.
- 19. A heating and pressurizing apparatus for use in mounting electronic components according to claim 7, wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.
- 20. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 21. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 22. A heating and pressurizing apparatus for use in mounting electronic components according to claim 6, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 23. A heating and pressurizing apparatus for use in mounting electronic components according to claim 7, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 24. A heating and pressurizing apparatus for use in mounting electronic components according to claim 8, wherein the mounting finishing unit further comprises:
a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.
- 25. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 26. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 27. A heating and pressurizing apparatus for use in mounting electronic components according to claim 6, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 28. A heating and pressurizing apparatus for use in mounting electronic components according to claim 7, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 29. A heating and pressurizing apparatus for use in mounting electronic components according to claim 8, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 30. A heating and pressurizing apparatus for use in mounting electronic components according to claim 9, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 31. A heating and pressurizing apparatus for use in mounting electronic components according to claim 10, wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.
- 32. A heating and pressurizing apparatus for use in mounting electronic components according to claim 4, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 33. A heating and pressurizing apparatus for use in mounting electronic components according to claim 5, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 34. A heating and pressurizing apparatus for use in mounting electronic components according to claim 6, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 35. A heating and pressurizing apparatus for use in mounting electronic components according to claim 7, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 36. A heating and pressurizing apparatus for use in mounting electronic components according to claim 8, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 37. A heating and pressurizing apparatus for use in mounting electronic components according to claim 9, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 38. A heating and pressurizing apparatus for use in mounting electronic components according to claim 10, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
- 39. A heating and pressurizing apparatus for use in mounting electronic components according to claim 11, wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-319783 |
Nov 1997 |
JP |
|
Parent Case Info
[0001] This application is a Divisional Application of Ser. No. 09/554,721, filed May 18, 2000, which is the National Stage Application of International Application No. PCT/JP98/05204, filed Nov. 19, 1998.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09554721 |
May 2000 |
US |
Child |
10365515 |
Feb 2003 |
US |