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Kenichi Tokuno
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Semiconductor packing stack module and method of producing the same
Patent number
6,188,127
Issue date
Feb 13, 2001
NEC Corporation
Naoji Senba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip component mounting board, chip component mounting structure, a...
Patent number
6,094,354
Issue date
Jul 25, 2000
NEC Corporation
Toshiaki Nakajoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bare chip mounting structure and manufacturing method therefor
Patent number
5,892,289
Issue date
Apr 6, 1999
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack module
Patent number
5,883,426
Issue date
Mar 16, 1999
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip semiconductor mounting structure with electrically conduc...
Patent number
5,869,886
Issue date
Feb 9, 1999
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip module having a cover wtih support pillar
Patent number
5,777,847
Issue date
Jul 7, 1998
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bare chip test carrier with an improved holding structure for a sem...
Patent number
5,767,689
Issue date
Jun 16, 1998
NEC Corporation
Kenichi Tokuno
G01 - MEASURING TESTING
Information
Patent Grant
Device module comprising a substrate having grooves fixed to circui...
Patent number
5,763,295
Issue date
Jun 9, 1998
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device module comprising a substrate having grooves fixed to circui...
Patent number
5,686,763
Issue date
Nov 11, 1997
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory card having two types of memory integrated circuits connecte...
Patent number
5,565,704
Issue date
Oct 15, 1996
NEC Corporation
Kenichi Tokuno
H01 - BASIC ELECTRIC ELEMENTS