Kenichiro Iwakiri

Person

Ageo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrodeposited copper foil with carrier foil with a primer resin...
- Patent number 8,304,091
- Issue date Nov 6, 2012
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil and method of manufacturing the same
- Patent number 7,749,610
- Issue date Jul 6, 2010
- Mitsui Mining & Smelting Co., Ltd.
- Kenichiro Iwakiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electrodeposited copper foil with carrier f...
- Patent number 7,217,464
- Issue date May 15, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Akitoshi Takanashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-coated composite foil, production and use thereof
- Patent number 6,652,962
- Issue date Nov 25, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material used in making printed wiring boards
- Patent number 6,548,153
- Issue date Apr 15, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,319,620
- Issue date Nov 20, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,270,889
- Issue date Aug 7, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Foil and Method of Manufacturing the Same
- Publication number 20080280159
- Publication date Nov 13, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Kenichiro Iwakiri
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...
- Publication number 20080107865
- Publication date May 8, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for producing high temperature heat resisting carrier foil...
- Publication number 20040170858
- Publication date Sep 2, 2004
- Akitoshi Takanashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite material used in making printed wiring boards
- Publication number 20020090497
- Publication date Jul 11, 2002
- Takashi Kataoka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Making and using an ultra-thin copper foil
- Publication number 20020070120
- Publication date Jun 13, 2002
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kenichiro Iwakiri

Person

Patents Grantslast 30 patents

Electrodeposited copper foil with carrier foil with a primer resin...

Copper foil and method of manufacturing the same

Method of manufacturing electrodeposited copper foil with carrier f...

Resin-coated composite foil, production and use thereof

Composite material used in making printed wiring boards

Making and using an ultra-thin copper foil

Making and using an ultra-thin copper foil

Patents Applicationslast 30 patents

Copper Foil and Method of Manufacturing the Same

Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...

Process for producing high temperature heat resisting carrier foil...

Composite material used in making printed wiring boards

Making and using an ultra-thin copper foil