Patent Application
20080107865
The present invention relates to electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof
Electrodeposited copper foil with carrier foil is being used in fields of electric industries or electronic industries as raw materials for manufacturing of printed wiring board and the like. Applying of the electrodeposited copper foil with carrier foil has begun as a result of requirements for thinning and fining pitch of the printed wiring boards and the like. It is consists of carrier foil and thin copper foil (hereinafter also to be referred to as “bulk copper layer”), which is formed by electrolytic deposition on a surface of the carrier foil via a bonding interface layer and the like to have required thickness around several μms, such as 3 μm or 5 μm, for example. Here, the carrier foil, which is a foil usually having thickness of around 18 μm to 35 μm, is for reinforcing a thin bulk copper layer with low mechanical strength due to its thickness of around several μms. For carrier foil, copper foil is mainly used in examples, and as for the copper foil for use of the carrier foil, thicker and tough mechanical strength than the copper foil formed as bulk copper layer is used.
Here, on one side of surfaces of the bulk copper layer in the electrodeposited copper foil with carrier foil which does not facing to the carrier foil, that is a surface side of direction for thickness increasing of the bulk copper layer by electrolytic deposition (hereinafter also to be referred to as “the deposition side surface of bulk copper layer”), various kinds of treatments such as a roughening treatment such as a nodular treatment and the like of copper, an inorganic treatment, plating of a metal element or an organic treatment of applying a silane coupling agent and the like and the like in consideration of a bonding ability or a shelf life are usually carried out. In the present specification, a bulk copper layer that has been carried out the above described roughening treatment will be also called a “bulk copper layer” which includes the portion of roughening treatment, while the layer formed that has been subjected to an inorganic rust proofing treatment is also called an “inorganic treated layer”. In addition, in the present specification, the surface of the inorganic treated layer formed on the bulk copper layer is also called an “inorganic treated layer surface”.
In case of manufacturing a printed wiring board with the above described electrodeposited copper foil with carrier foil, the bulk copper layer portion is usually used as a circuit forming material, and therefore a printed wiring board is manufactured generally along steps as follows. That is, at first, an inorganic treated layer surface formed on the surface on the bulk copper layer deposition side or, as required, a silane coupling agent layer formed on the surface of a bulk copper layer are brought into contact with the pre-preg (FR-4 substrate and the like), and they are bonded together by hot pressing, and thus the resin substrate layer has been hardened to obtain a copper-clad laminate with a carrier foil. Here, for the purpose of simplifying descriptions, descriptions on the inorganic treated layer and a silane coupling agent layer will be omitted in principle, even an inorganic treated layer and a silane coupling agent layer formed as required are present between the bulk copper layer and the resin substrate layer in strictly speaking.
Next, the carrier foil is released from the copper-clad laminate with a carrier foil to obtain copper-clad laminate consist of the bulk copper layer and the resin substrate layer. Next, after the bulk copper layer surface of the copper-clad laminate is carried out acid cleaning with dilute acid, the bulk copper layer is carried out etching with etching solution such as copper chloride solution and the like to obtain a circuit. Here, in the above described step, hot pressing one sheet of electrodeposited copper foil with carrier foil on one side of a resin impregnated base material derives a single-sided printed wiring board, while two sheets of electrodeposited copper foil with carrier foil on the both sides of a resin impregnated base materials derives a double-sided printed wiring board.
A printed wiring board in recent years is often used as a multilayer printed wiring board with circuits in multiple layers. In this case, the following steps are usually carried out. That is, a plurality of double-sided printed wiring boards usually with respectively different circuit patterns are produced with the above described manner, and resin impregnated base materials are sandwiched between these double-sided printed wiring boards and undergo hot pressing to laminate to obtain a multilayer printed wiring board.
In case of a double-sided printed wiring board or a multilayer printed wiring board, circuits that are locating to sandwich one layer or more than two layers of resin substrate layers are electrically connected. To do so, “through holes” or “via holes” and the like as a penetrated hole or a blind hole are formed by laser drilling and the like. Then they are subjected to desmear processing with an alkaline potassium permanganate solution and the like to remove smears in the holes, followed by copper plating.
As a method of releasing carrier foil that is not useful in the step of manufacturing the above described single-sided printed wiring board or double-sided printed wiring board, a method of peeling in a bonding interface layer, that is formed between the carrier foil and the bulk copper layer and has a comparatively weak bonding strength, or a method of carrying out etching on the carrier foil is employed. A type of electrodeposited copper foil with carrier foil corresponding with the former method is called electrodeposited copper foil with carrier foil of a peelable type. While a type of electrodeposited copper foil with carrier foil corresponding with the latter method is called electrodeposited copper foil with carrier foil of an etchable type. Among them, since the latter has drawback in that it costs much for etching equipment and the like, in recent years, the former peelable type of the electrodeposited copper foil with carrier foil has become in wide use.
Since use of the above described electrodeposited copper foil with carrier foil enables to make thickness of the bulk copper foil thin by securing the strength level by the carrier foil, thinning of printed wiring boards, enhancement in miniaturizing and light weight and fining of circuits and the like can be designated when compared with the case of using copper foil with conventional thickness. In particular, the electrodeposited copper foil with carrier foil of a peelable type has become preferable for use due to its' easy releasing of the carrier foil and for its low cost.
However, in electrodeposited copper foil with carrier foil, a bulk copper layer is very thin with thickness of around 3 μm or 5 μm and the deposition side surface of bulk copper layer is smooth, and therefore bonding the deposition side surface of bulk copper layer, the surface of inorganic treated layer formed on the deposition side surface of bulk copper layer or a silane coupling agent layer formed as required and a resin substrate layer often shows too low bonding strength, and is hard to use in manufacturing a printed wiring board. Therefore, usually, a roughening treatment of electrolyzing the electrodeposited copper foil with carrier foil in a copper electrolytic solution to form minute copper particles, and the like on the deposition side surface of bulk copper layer as described above is carried out to increase roughness, and thereafter, a process of forming an inorganic treatment layer or a silane coupling agent layer, and then bonding strength between the bulk copper layer and the resin substrate layer is increased.
However, in recent years, decrease in roughness of a deposition side surface of bulk copper layer as much as possible is demanded in order to fulfill features such as finer circuit, a migration resistance and controlled impedance, but when a roughness-decreased roughening treatment is carried out, such a problem comes out that bonding strength is hard to increase enough. Therefore, electrodeposited copper foil with carrier foil having bonding strength high enough has been required more and more, either without or with the roughening treatment described above providing lower roughness on the bulk copper layer.
In addition, in the electrodeposited copper foil with carrier foil having thickness of the bulk copper layer of 3 μm or more does not show a defect of pin holes and the like, since electrolytic deposition may fill pin holes and the like But generally in the case where thickness of the bulk copper layer is less than 3 μm and very thin, and moreover a roughening treatment is not carried out or is not carried out sufficiently, pin holes and the like are not filled successfully and the pin holes and the like may remain. Therefore, in any type of printed wiring board, single-sided printed wiring board, double-sided printed wiring board or multilayer printed wiring board, such a problem come up that an inorganic rust proofing layer usually present at the interface between the bulk copper layer and the resin substrate layer is corroded by an acid cleaning solution, an etching solution or a desmear solution inside the pin holes and the like at the time of production thereof and the interface may create delamination and a circuit formed on the delaminated portion is easily peeled off. In particular, as described above, in electrodeposited copper foil with carrier foil of a type without a roughening treatment on the bulk copper layer or with a roughening treatment to provide low roughness, an interface between the bulk copper layer and the resin substrate layer is bonded with a surface in smooth or similar state, and therefore an acid cleaning solution, an etching solution or a desmear solution will easily spread over a wide area into the above described inorganic treated layer compared with a conventional type of electrodeposited copper foil with carrier foil that is carried out a roughening treatment to provide a comparatively high roughness onto the deposition side surface of bulk copper layer. Therefore, a problem that a circuit peels off easily will come out.
Moreover, in case of producing a double-sided printed wiring board or a multilayer printed wiring board with conventional electrodeposited copper foil with carrier foil, such a problem comes out that an inorganic treatment layer usually present on the interface between the bulk copper layer and the resin substrate layer exposed in the side wall of holes such as through holes or via holes and the like is corroded by a desmear solution at the time of a desmear process and may create delamination, and a circuit formed on the delaminated portion may peel off.
Due to the above described situations, electrodeposited copper foil with carrier foil is required to have bonding strength high enough between the deposition side surface of bulk copper layer or the surface of an inorganic treated layer and the resin substrate layer even when roughness of the deposition side surface of bulk copper layer or the surface of an inorganic treated layer is low. Also, the interface between the bulk copper layer and the resin substrate layer is hard to delaminate even when it contact with an acid cleaning solution, an etching solution or a desmear solution where pin holes and the like remain in the bulk copper layer or the side wall in the holes of through holes or via holes and the like.
In contrast, a prior art related to electrodeposited copper foil with carrier foil of a peelable type, JP-A-2000-309898 (Patent Document 1), for example, discloses electrodeposited copper foil with carrier foil, comprising a bonding interface layer being formed on a surface of carrier foil with an organic agent, and with electrodeposited copper foil layer being deposited and formed on the bonding interface layer. They say that using of the electrodeposited copper foil with carrier foil, stability is high in peeling at the time of releasing carrier foil and therefore a yield of production can be improved greatly.
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-309898 (first column on Page 2)
However, the electrodeposited copper foil with carrier foil disclosed in the patent document 1 cause a problem that it is hard to have bonding strength high enough between the bulk copper layer and the resin substrate layer in the case where roughness of the bulk copper layer deposition side surface or the inorganic treated layer surface is low. In addition, the electrodeposited copper foil with carrier foil has caused a problem of delamination in the interface between the bulk copper layer and the resin substrate layer when contact with the acid cleaning solution, the etching solution or the desmear solution in the step of producing a printed wiring board in a state with pin holes and the like remaining in the bulk copper layer or in the case where the side wall in holes, through holes or via holes and the like contacts with the desmear solution in desmear processing and the like.
Accordingly, an object of the present invention is to provide electrodeposited copper foil with carrier foil which shows high bonding strength between the bulk copper layer and the resin substrate layer even when surface roughness of the bulk copper layer deposition surface or the inorganic treated layer surface is low and it is hard to delaminate within the inorganic treated layer surface and the resin substrate layer even when pin holes and the like remain in the bulk copper layer or the side wall of through holes or via holes and the like when contact with the desmear solution and the like.
Under such current situations, as a result of serious studies, the present inventors have found out that the above described object can be attained with the present invention, in which electrodeposited copper foil with carrier foil with at least plated Ni—Zn alloy layer and a primer resin layer in this order on the surface of a bulk copper layer with low surface roughness, wherein a roughness Rzjis measured on the surface of the above described plated Ni—Zn alloy layer or roughness measured on a chromate layer surface in the case where a chromate layer has been further formed on the surface of the above described plated Ni—Zn alloy layer falls within a specific range, and the above described plated Ni—Zn alloy layer contains Ni and Zn, and Ni/Zn deposit amount ratio in the layer falls within a specific range.
The electrodeposited copper foil with carrier foil with primer resin layer of the present invention is an electrodeposited copper foil with carrier foil with primer resin layer characterized in the construction comprising a bonding interface layer, a bulk copper layer, a rust proofing layer and a primer resin layer which are formed in this order on the surface of at least one side of the carrier foil, in which a plated Ni—Zn alloy layer constitute the rust proofing layer and a roughness Rzjis measured on the surface of said plated Ni—Zn alloy layer is not more than 3 μm, and said plated Ni—Zn alloy layer contains Ni and Zn, and Ni/Zn deposit amount ratio in the layer is 1.5 to 10.
The electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to comprise silane coupling agent layer on the surface of plated Ni—Zn alloy layer as rust proofing layer.
The electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be that comprising a bonding interface layer, a bulk copper layer, a rust proofing layer and a primer resin layer which are formed in this order on the surface of at least one side of the carrier foil and the plated Ni—Zn alloy layer and a chromate layer constitute the rust proofing layer and roughness Rzjis measured on the surface of said chromate layer is not more than 3 μm, and said plated Ni—Zn alloy layer contains Ni and Zn, and Ni/Zn deposit amount ratio in the layer is 1.5 to 10.
The electrodeposited copper foil with carrier foil of the present invention is preferred to be that said rust proofing layer comprises a silane coupling agent layer on the surface even when rust proofing layer comprises plated Ni—Zn alloy layer and chromate layer.
Said primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a semi-cured primer resin composition which contains an epoxy resin and a polyether sulfone having functions selected from a hydroxyl group or an amino group or both groups at its ends.
Said primer resin composition used to form primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to have composition balance of said primer resin composition containing said epoxy resin of 5% by weight to 50% by weight and said polyether sulfone resin of 95% by weight to 50% by weight when the total weight of said epoxy resin and said polyether sulfone having functions selected from a hydroxyl group or an amino group or both groups at its ends is assumed to be 100% by weight.
Said primer resin composition used to form the primer resin layer of the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to further contains an epoxy resin curing agent.
When epoxy curing agent is mixed to the primer resin composition to manufacture the electrodeposited copper foil with carrier foil with primer resin layer of the present invention, said primer resin composition is preferred to have composition balance, sum of said epoxy resin and said epoxy resin curing agent of 5% by weight to 50% by weight and said polyether sulfone resin of 95% by weight to 50% by weight when the total weight of said epoxy resin, said epoxy resin curing agent and said polyether sulfone having functions selected from a hydroxyl group or an amino group or both groups at its ends is assumed to be 100% by weight.
Said primer resin composition used to form the primer resin layer of the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to use an epoxy resin having a structure shown in following formula 7 (1) as a epoxy resin.
In the formula, X and Y represent the same formula expressed by formula 8 (3).
When said epoxy resin curing agent is used to constitute primer resin composition for forming primer resin layer of the electrodeposited copper foil with carrier foil with primer resin layer of the present invention, the epoxy resin curing agent is preferred to have a structure shown in following formula 9 (2).
In the formula, either of X and Y is —OH or —NH2, and X and Y may be the same or different.
The primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a semi-cured primer resin composition consist of an epoxy resin curing agent and an epoxy resin having a structure shown in following formula 10 (1).
In the formula, X and Y represent the same function expressed by formula 11 (3).
The primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a semi-cured primer resin composition consist of an epoxy resin and an epoxy resin curing agent having a structure shown in following formula 12 (2).
In the formula, either of X and Y is —OH or —NH2, and X and Y may be the same or different.
Said primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a semi-cured primer resin composition further containing a polyether sulfone having function selected from a hydroxyl group or an amino group or both groups at its ends.
Said primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a semi-cured silane coupling agent containing primer resin composition consist of said primer resin composition and a silane coupling agent.
When said silane coupling agent containing primer resin composition is applied, content of said silane coupling agent is preferred to be 0.1 parts by weight to 5 parts by weight of said silane coupling agent against 100 parts by weight of said primer resin composition.
Said primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to apply said primer resin composition which contains a sulfur content of 0.6% by weight or more.
Said primer resin layer constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to have an equivalent thickness of 1 μm to 5 μm.
Said plated Ni—Zn alloy layer constituting the rust proofing layer of the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to have an amount of Ni therein of 1 mg/m2 to 50 mg/m2.
Carrier foil constituting the electrodeposited copper foil with carrier foil with primer resin layer of the present invention is preferred to be a copper foil.
As for the method of manufacturing the electrodeposited copper foil with carrier foil with primer resin layer of the present invention described above, it is preferred to apply manufacturing method of the electrodeposited copper foil with carrier foil with primer resin layer which contains process steps a) to f) shown below.
a) Process to contact a carrier foil of one surface at least with a solution containing bonding interface forming agents.
b) Bonding interface layer forming process to form bonding interface layer on a carrier foil by fixing bonding interface forming agents put on said carrier foil.
c) Bulk copper layer forming process to form bulk copper layer on the bonding interface layer by electro-plating a bulk copper on the carrier foil with bonding interface layer by using a bulk copper plating solution.
e) Rust proofing layer forming process to form rust proofing layer on said bulk copper layer, by forming an electro-plated Ni—Zn alloy layer from Ni—Zn-containing plating solution at least, followed by forming of chromate layer or adsorbing of silane coupling agent by using conventional method as required.
f) Primer resin layer forming process to form primer resin layer on said copper foil with carrier foil after finishing rust proofing process by coating a primer resin composition or a silane coupling agent containing primer resin composition on said rust proofing layer.
The plating solution used for forming the plated Ni—Zn alloy layer constituting rust proofing layer is preferred to use the plating solution which has a concentration ratio of Ni ion concentration to Zn ion concentration [Ni/Zn] within 1.5 to 27.
Even when the surface of the electrodeposited copper foil comprising surface treated layer consists of plated Ni—Zn alloy layer and the like has low profile, the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention provides sufficient adhesion within the said surface and resin substrate because of primer resin layer with adequate surface treatment. In addition, because of the surface treated layer consist of plated Ni—Zn alloy layer and the like formed on the electrodeposited copper foil layer of the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention, delamination from resin substrate hardly occur even if bulk layer had defects like pin-hole and/or inside wall of the through holes and/or when via holes are contacted with desmear solution, i.e. it is superior in chemical resistance. Also, the manufacturing method of manufacturing an electrodeposited copper foil with carrier foil with a primer resin layer of the present invention is suitable for manufacturing the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention.
Electrodeposited copper foil with carrier foil with a primer resin layer of the present invention is provided with a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which are formed in this order at least on one surface of the carrier foil.
The carrier foil used in the present invention can be selected from foils which are capable for electrolytic deposition on its surface to form a bulk copper layer, such as aluminum foil, copper foil, resin film that has been subjected to metal coating on its surface and the like. In addition, as the copper foil, any of wrought copper foil and electrodeposited copper foil can be used. Among them, copper foil is preferable to the carrier foil because collecting and recycling of the carrier foil after releasing is easy.
As the thickness of the carrier foil, it is not limited in particular but is usually not more than 200 im and is preferable to be 18 im to 200 im. And it is not so preferable that the thickness of the carrier foil is less than 18 m, because the mechanical strength and handling property of the carrier foil may not good. In addition, the thickness of the carrier foil of more than 200im is not so preferable, because the handling property may not good, while the manufacturing cost of the carrier foil may be expensive.
In the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention; a bonding interface layer is formed at least on one surface of the carrier foil surfaces. That is, the bonding interface layer may be formed on either one surface of the carrier foil or may be formed on the both surfaces.
In the present invention, the bonding interface layer is formed between the carrier foil and the bulk copper layer provided by electrodeposition on the surface hereof and is intended to decrease release strength of the carrier foil and secure the stability of the release strength level and moreover to work as barrier for occurrence of mutual diffusion between the carrier foil and the electrodeposited copper foil at the time of hot pressing. Here, the bonding interface layer of the present invention, which is, in particular, formed by an organic bonding interface layer forming component to be described later, it may remain on the surface of the bulk copper layer after releasing the carrier foil. But even in this case, the one, which is formed by an organic bonding interface layer forming component, can be easily removed by acid cleaning with dilute acid such as dilute sulfuric acid, dilute hydrochloric acid and the like. Therefore, no problem may come into manufacturing of a printed wiring board.
The bonding interface layer is formed on at least one surface of the carrier foil by contacting to the bonding interface layer forming agent and put the bonding interface layer forming component in the bonding interface layer forming agent at least on one surface of the carrier foil.
The bonding interface layer forming agent used in the present invention consists of the bonding interface layer forming component to be fixed on the carrier foil to form the bonding interface layer and solvent for the bonding interface layer forming component. As a bonding interface layer forming component used in the present invention, an organic bonding interface layer forming component such as a nitrogen-containing organic compound, a sulphur-containing organic compound and a carboxylic acid or the like, and an inorganic bonding interface layer forming component such as Cr, Zn, chromate layer or the like are exemplified.
Among organic bonding interface layer forming components, as a nitrogen-containing organic compound, a triazole compound, an imidazole compound and the like, for example, can be used. Among them, a triazole compound can form a bonding interface layer being thin and with approximately uniform thickness on the copper surface and therefore the releasability of the bonding interface layer is preferably be stable in the case when the carrier foil is a copper foil. For example, as a triazole compound used in the present invention, 1,2,3-benzotriazole, carboxy benzotriazole, N′,N′-bis (benzotriazolyl methyl) urea, 1H-1,2,4-triazole, 3-amino-1H-1,2,4-triazole and the like can be used.
Among organic bonding interface layer forming components, as a nitrogen-containing organic compound, mercapto benzothiazole, a thiocyanate acid and 2-bensimidazolethiol and the like, for example, can be used.
Among organic bonding interface layer forming components, as a carboxylic acid, a mono carboxylic acid, a dicarboxylic acid and the like, for example, can be used.
As solvent used for a bonding interface layer forming agent to dissolve the above described bonding interface layer forming component, water, ethanol and the like can be used. Among them, water is preferable in its low costs and it is free from any concern about environmental pollution after removal.
As a method of contacting the bonding interface layer forming agent to the surface of carrier foil, a method of immersing the carrier foil into a bonding interface layer forming agent, a method of spraying the bonding interface layer forming agent to the carrier foil, a method to flow the bonding interface layer forming agent to stream down on the carrier foil and the like may be applicable. These methods can be used alone or in combination of two or more.
In addition, as a method of fixing the bonding interface layer forming component in the bonding interface layer forming agent to the surface of the carrier foil, a method of fixing the bonding interface layer forming component by heat drying the bonding interface layer forming agent on the carrier foil surface, a method of fixing the bonding interface layer forming component by electrodepositing the bonding interface layer forming component in the bonding interface layer forming agent to the carrier foil surface and the like are exemplified.
The thickness of the bonding interface layer is usually 1 nm to 1 m and preferably 5 nm to 500 nm. The thickness of the bonding interface layer of less than 1 nm does not show a sufficient performance of the bonding interface layer, while a thickness in excess of 1
m makes it difficult to form a bulk copper layer by the electrodeposition process, therefore they are not preferable.
In the present invention, a bulk copper layer is a copper layer formed on a surface of a bonding interface layer by electrodeposition on carrier foil surface. Here, in the case where the above described bonding interface layer is formed on the both surfaces of the carrier foil, the bulk copper layer may be formed on the respective surfaces of the two bonding interface layers that are present on the both surfaces of the carrier foil, or may be formed on only any one surface of the surfaces of the two bonding interface layers. In the former case, the layer will be configured by bulk copper layer/bonding interface layer/carrier foil/bonding interface layer/bulk copper layer while in the latter case the same will be configured by bonding interface layer /carrier foil/bonding interface layer/bulk copper layer.
The thickness of the bulk copper layer may be set appropriately depending on the application of the electrodeposited copper foil with carrier foil with a primer resin layer and will not be limited in particular. However, in case of using a bulk copper layer of the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention as it is or after subjecting to copper plating thereon to have thicker copper layer, thickness of the bulk copper layer is usually 0.5 im to 8 im, preferably 0.5 im to 6 im and moreover preferably 0.5 im to 2.5 im. The thickness of the bulk copper layer falling within the range will enable thinning of a printed wiring board as well as finer pitch in the circuit, so it is preferable.
Roughness Rzjis on a surface at the side that does not facing to the carrier foil in the surfaces of the bulk copper layer, that is the surface at the side in a thickness increasing direction of the bulk copper layer by electrolytic deposition (deposition side surface of bulk copper layer) is usually not more than 3 im, preferably 2.3 im and more preferably not more than 1.6 im. Rzjis falling within the range makes it easy to control surface roughness of plated Ni—Zn alloy layer or chromate treated layer formed on the bulk copper layer. And it makes a circuit formed from the bulk copper layer fine and substantially eliminates an etching residue and makes impedance control easy, therefore it is preferable. Here in the present invention, Rzjis means Ten-Point Height of Roughness Profile defined in JIS B0601-2001.
Here, a conventional electrodeposited copper foil with carrier foil is carried out a roughening treatment such as a nodular treatment and the like of forming minute copper particles, and the like on the deposition side surface of bulk copper layer in order to up the bonding strength. In contrast, the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention is provided with a primer resin layer being formed on the deposition side surface of bulk copper layer to sufficiently up the above described bonding strength therefore the roughening treatment is not necessarily indispensable, but may be carried out appropriately as far as roughness Rzjis of the bulk copper layer deposition side falls within the above described range. In the present invention, a bulk copper layer that has been subjected to the above described roughening treatment is called a bulk copper layer inclusive of the roughening treatment. In case of carrying out a roughening treatment the plated Ni—Zn alloy layer is formed on the deposition side surface of bulk copper layer that has carried out a roughening treatment.
A plated Ni—Zn alloy layer to constitute a rust proofing layer is a metallic layer formed by electrodeposition on a surface at a bulk copper layer deposition side or a surface at a bulk copper layer deposition side after carrying out a roughening treatment as required, and is to provide rust proofing effects to the bulk copper layer. The plated Ni—Zn alloy layer is a plated layer containing at least Ni and Zn, and the layer may further contain elements such as Sn, Cr or Co and the like as required. That is, the plated Ni—Zn alloy layer may be a binary alloy layer made of just Ni and Zn, or may be a ternary alloy layer to a quinary alloy layer containing one kind to three kinds of Sn, Cr or Co in addition thereto.
For the plated Ni—Zn alloy layer, said plated Ni—Zn alloy layer contains Ni and Zn, and Ni/Zn deposit amount ratio in the layer is 1.5 to 10, preferably 2 to 7 and more preferably 2.7 to 4. In the present invention, the Ni/Zn deposit amount ratio means the ratio of Ni amount divided by Zn amount contained in the plated Ni—Zn alloy layer. When the ratio is falling within the range, delamination of the interface between the bulk copper layer and the resin substrate layer can be eliminated even when the bulk copper layer is carried out processing with an acid cleaning solution or an etching solution in a state that pin holes and the like remain, so it is preferable.
On the other hand, the above described ratio of less than 1.5 or in excess of 10 is not so preferable, because it may inferior in chemical resistance against a desmear solution and the like. Here, the Ni/Zn deposit amount ratio can be calculated from the value of Zn deposit (mg/m2) and Ni deposit (mg/m2) in the plated Ni—Zn alloy layer which are converted from concentrations of Ni and Zn in the solution obtained by dissolving the plated Ni—Zn alloy layer in an acid and the like, by carrying out ICP optical emission spectrometry on the solution.
In addition, Ni deposit in the plated Ni—Zn alloy layer is usually 1 mg/m2 to 50 mg/m2, and preferably 10 mg/m2 to 35 mg/m2, and more preferably 15 mg/m2 to 30 mg/m2. As for the plated Ni—Zn alloy layer, in the case where the above described Ni/Zn deposit amount ratio falls within the above described range, and moreover in the case where the Ni deposit falls within the range, delamination of the interface between the bulk copper layer and the resin substrate layer will be eliminated even when processing with an acid cleaning solution or an etching solution are performed in a state where pin holes and the like remain in the bulk copper layer, and the bulk copper layer shows good etchability, so it is preferable.
On the other hand, a Ni deposit of less than 10 mg/m2 may cause discoloration by oxidation in the bulk copper layer and is not so preferable. In addition, a Ni deposit in excess of 35 mg/m2 may worsen the removability of the plated Ni—Zn alloy layer, so it is not so preferable.
In the present invention, a chromate layer may be formed on the surface of the plated Ni—Zn alloy layer as required. Forming a chromate layer increases rust proofing ability of a bulk copper layer, so it is preferable. Here, since the chromate layer is formed on the surface of a plated Ni—Zn alloy layer, in case of forming a chromate layer, respective layers of the electrodeposited copper foil with carrier foil with a primer resin layer will be carrier foil, a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer, a chromate layer and a primer resin layer in this order. The chromate layer can be formed by a popular chromate treatment.
The electrodeposited copper foil with carrier foil with a primer resin layer of the present invention has, as described above, carrier foil, bonding interface layer, a bulk copper layer and a plated Ni—Zn alloy layer at least, and moreover a chromate layer is formed on the surface of the plated Ni—Zn alloy layer.
In the present invention, a silane coupling agent layer may be formed on the surface of a plated Ni—Zn alloy layer or a chromate layer as required. Forming the silane coupling agent layer may increase the humidity resistance, chemical resistance against desmear solution and the like and peel strength of the electrodeposited copper foil with carrier foil with a primer resin layer, so it is preferable.
After the silane coupling agent layer is formed on the surface of a plated Ni—Zn alloy layer or a chromate layer, respective layers of electrodeposited copper foil with carrier foil with a primer resin layer will be carrier foil/a bonding interface layer/a bulk copper layer/a plated Ni—Zn alloy layer/a silane coupling agent layer/a primer resin layer in this order, or carrier foil/a bonding interface layer/a bulk copper layer/a plated Ni—Zn alloy layer/ a chromate layer/a silane coupling agent layer/a primer resin layer in this order. The silane coupling agent layer can be formed by applying appropriately diluted silane coupling agent, followed by drying.
As a silane coupling agent used in the present invention, for example, an epoxy functional silane coupling agent such as 4-glycidyl butyl tri methoxy silane and ã-glycidoxypropyltrimethoxy silane and the like; an amino functional silane coupling agent such as ã-aminopropyltrimethoxy silane, N-â(aminoethyl) ã-aminopropyltrimethoxy silane, N-3-(4-(3-aminopropoxy)butoxy) propyl-3-aminopropyltrimethoxy silane, and N-phenyl-ã-aminopropyltrimethoxy silane, and the like; a mercapto functional silane coupling agent such as ã-mercaptopropyltrimethoxy silane and the like; an olefin functional silane coupling agent such as vinyltrimethoxy silane and vinylphenyltrimethoxy silane, and the like; an acrylic functional silane coupling agent such as ã-methacryloxypropyltrimethoxy silane and the like; an imidazole functional silane coupling agent such as imidazole silane and the like; a triazine functional silane coupling agent such as triazine silane and the like can be used.
A primer resin layer is a resin layer formed on the surface of a plated Ni—Zn alloy layer by semi-curing of a primer resin composition or a primer resin composition containing a silane coupling agent to improve bonding strength between a bulk copper layer and a resin substrate layer.
As a primer resin composition used in the present invention, the following first composition to fourth composition may be used. That is, among the primer resin compositions used in the present invention, a first composition contains epoxy resin and polyether sulfone having a hydroxyl group, amino group or the both at the end ( hereinafter referred to “first primer resin composition”), a second composition contains an epoxy resin having a structure shown in following formula (1) and an epoxy resin curing agent (hereinafter referred to “second primer resin composition”), a third composition contains an epoxy resin and an epoxy resin curing agent having a structure shown in following formula (2) (hereinafter referred to “third primer resin composition”) and a fourth composition contains an epoxy resin having the following composition of the following formula (1) and an epoxy resin curing agent having a structure shown in following formula (2) (hereinafter referred to “fourth primer resin composition”).
In addition, primer resin composition containing a silane coupling agent used in the present invention consists of the above described primer resin composition mixed with a silane coupling agent.
At first, a first primer resin composition will be described. The epoxy resin used in the first primer resin composition is not limited in particular but a popular one can be used. As the epoxy resin, bisphenyl sulfone type epoxy resin, bisphenol A type epoxy resin, for example, bisphenol F type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, bromined epoxy resin, alicyclic type epoxy resin, glycidyl amine type epoxy resin, biphenyl type epoxy resin, trifunctional epoxy resin and the like can be used. Among them, employing of bisphenol S type epoxy resin as epoxy resin may increase peel strength and it is preferable. In addition, when trifunctional epoxy resin and the like are employed as a multifunctional epoxy resin as epoxy resin, it may increase the heat resistance of the printed wiring board obtained, so it is preferable.
For example, the bisphenyl sulfone type epoxy resin used in the first primer resin composition include those having a structure shown in following formula 13 (1).
In the formula, X and Y represent the same group expressed by Formula 14 (3).
The first primer resin composition with an epoxy resin having a structure in the above described formula 13 (1) may increase peel strength of the bulk copper layer within the resin substrate layer. In the first primer resin composition, epoxy resin can be used alone or in combination of two or more among those described above.
Polyether sulfone having a hydroxyl group, an amino group or the both at the end which is used in the first primer resin composition has a basic structure expressed by the following formula 15 and has a hydroxyl group, an amino group or the both at the end. Here, it is advisable that polyether sulfone expressed by the formula 15 has a basic structure enclosed with parenthesis to which “n” is attached and has a hydroxyl group, an amino group or the both of them. Further, a structure such as a benzene ring and the like may be appropriately included between the basic structure and ends. Because the polyether sulfone contains a hydroxyl group, an amino group or the both of them at its ends, they can combine with epoxy resin and be semi-cured.
For example, the first primer resin composition is obtained by mixing the above described epoxy resin and polyether sulfone containing a hydroxyl group, an amino group or both of them at its ends. In addition, an organic solvent may be mixed to the first primer resin composition at the time of preparation or after preparation in order to adjust the viscosity for the purpose of improving coating ability.
The first primer resin composition contains the epoxy resin of usually 5% by weight to 50% by weight and preferably 15% by weight to 40% by weight and polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) of usually 95% by weight to 50% by weight and preferably 85% by weight to 60% by weight, based on the total weight of epoxy resin and polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) contained in the primer resin composition as 100% by weight.
With mixing ratio of epoxy resin to polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) falling within the above described range, deviation of surface insulating resistance of a printed wiring board formed with electrodeposited copper foil with carrier foil with a primer resin layer using the first primer resin composition may get smaller, so it is preferable.
On the other hand, with epoxy resin being less than 5% by weight, thermal curing is not performed sufficiently and cause insufficient bonding strength between the bulk copper layer and the resin substrate layer, so it is not so preferable. In addition, epoxy resin in excess of 50% by weight decreases toughness of the primer resin layer to cause micro-cracks on the substrate surface, so it is not so preferable.
The first primer resin composition may be mixed with an epoxy resin curing agent as required. As the epoxy resin curing agent, amines such as dicyandiamide, imidazoles, diaminodiphenyl sulfone and aromatic amine and the like; phenols such as bisphenyl sulfone type phenol resin, bisphenol S, bisphenol A and bromined bisphenol A and the like; novolacs such as phenol novolac resin and cresol novolac resin and the like; acid anhydride such as phthalic anhydride and the like can be used, for example.
As the above described diaminodiphenyl sulfone or bisphenyl sulfone type phenol resin, those having a structure shown in the following formula 16 (2) can be used.
In the formula, either of X and Y is —OH or —NH2, and X and Y may be the same or different.
Here, in case of either one of X and Y being —OH and the other being —NH2 in formula 16 (2), a compound of formula 16 (2) corresponds to both diaminodiphenyl sulfone and bisphenyl sulfone type phenol resin.
The first primer resin composition with an epoxy resin curing agent structured shown in the above described formula 16 (2) may increase peel strength, so it is preferable. In the first primer resin composition, the above described epoxy resin curing agents can be used alone or in combination of two or more among those described above.
The first primer resin composition contains the epoxy resin and the epoxy resin curing agent in sum of usually 5% by weight to 50% by weight and preferably 15% by weight to 40% by weight and polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) of usually 95% by weight to 50% by weight and preferably 85% by weight to 60% by weight, based on the total weight of epoxy resin, an epoxy resin curing agent and polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) as 100% by weight.
With mixing ratio of epoxy resin, an epoxy resin curing agent and polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) falling within the above described range, deviation of surface insulating resistance of a printed wiring board formed with electrodeposited copper foil with carrier foil with a primer resin layer using the first primer resin composition may get smaller, so it is preferable.
On the other hand, with total amount of epoxy resin and the epoxy resin curing agent being less than 5% by weight, thermal curing is not performed sufficiently and thereby bonding strength between the bulk copper layer and the resin substrate layer may become insufficient, so it is not so preferable. In addition, total amount of epoxy resin and the epoxy resin curing agent in excess of 50% by weight decreases toughness of the primer resin layer and may cause micro-cracks on the substrate surface, so it is not so preferable.
The first primer resin composition may appropriately contain a curing accelerator and the like different from the above described epoxy resin, polyether sulfone having a hydroxyl group, an amino group or the both of them at the end(s) and or the epoxy resin curing agent mixed as required. As a curing accelerator used in the present invention, tertiary amine, imidazole, phosphor compound such as triphenylphosphine and the like, a urea derived curing accelerator and the like can be used, for example.
Next, a second primer resin composition will be described. In the second primer resin composition, bisphenyl sulfone type epoxy resin having a structure shown in the above described formula (1) is used at least for epoxy resin, and bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, bromined epoxy resin, alicyclic type epoxy resin, glycidyl amine type epoxy resin, biphenyl type epoxy resin, trifunctional epoxy resin and the like are used, as required.
In the second primer resin composition, epoxy resin which is used in combination with bisphenyl sulfone type epoxy resin having a structure shown in formula (1) as required, can be used alone or in combination of two or more among those described above.
As an epoxy resin curing agent used in the second primer resin composition , amines such as dicyandiamide, imidazoles and aromatic amines excepting diaminodiphenyl sulfone having a structure shown in formula (2), phenols excepting bisphenyl sulfone type phenol resin having a structure shown in formula (2) such as bisphenol S, bisphenol A and bromined bisphenol A, novolacs such as phenol novolac resin and cresol novolac resin and acid anhydrides such as phthalic anhydride can be shown as an example.
For example, the second primer resin composition is obtained by mixing epoxy resin having a structure shown in the above described formula (1) and an epoxy resin curing agent. In addition, an organic solvent may be mixed to the second primer resin composition at the time of preparation or after preparation in order to adjust the viscosity for the purpose of improving coating ability.
The second primer resin composition contains bisphenyl sulfone type epoxy resin having a structure shown in the above described formula (1) at least as epoxy resin. It resembles a basic structure of polyether sulfone, and the epoxy resin has a function for increasing bonding strength between the bulk copper layer and the resin substrate layer as polyether sulfone, and therefore even without polyether sulfone, bonding strength between the bulk copper layer and the resin substrate layer of the second primer resin composition can be increased sufficiently. However, further mixing of polyether sulfone as required, bonding strength between the bulk copper layer and the resin substrate layer can be increased more, so it is preferable. As the polyether sulfone, the same one as that used in the first primer resin composition can be used.
Next, a third primer resin composition will be described. As epoxy resin used in the third primer resin composition, those different from bisphenyl sulfone type epoxy resin having a structure shown in formula (1) are exemplified. And for bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, bromined type epoxy resin, alicyclic type epoxy resin, glycidyl amine type epoxy resin, biphenyl type epoxy resin, trifunctional type epoxy resin and the like can be used, for examples.
In the third primer resin composition, diaminodiphenyl sulfone having a structure shown in formula (2) described above and/or bisphenyl sulfone type phenol resin having a structure shown in formula (2) described above is at least used for epoxy resin curing agent, and as required, amines such as dicyandiamide, imidazoles and aromatic amines excepting diaminodiphenyl sulfone having a structure shown in formula (2), phenols excepting bisphenyl sulfone type phenol resin having a structure shown in formula (2) such as bisphenol S, bisphenol A and bromined bisphenol A, novolacs such as phenol novolac resin and cresol novolac resin and acid anhydrides such as phthalic anhydride are used.
Here, in case of either one of X and Y being —OH and the other being —NH2 in formula (2), a compound of formula (2) corresponds to both diaminodiphenyl sulfone and bisphenyl sulfone type phenol resin.
In the third primer resin composition, the above described epoxy resin curing agents, which are used in combination with an epoxy resin curing agent having a structure shown in formula (2), can be used alone or in combination of two or more among those described above.
For example, the third primer resin composition is prepared by mixing the above described epoxy resin and an epoxy resin curing agent having a structure shown in formula (2). In addition, an organic solvent may be mixed with the third primer resin composition at the time of preparation or after preparation in order to adjust the viscosity for the purpose of improving coating performance.
The third primer resin composition contains an epoxy resin curing agent having a structure shown in the above described formula (2) as an epoxy resin curing agent at least. It resembles a basic structure of polyether sulfone, and the epoxy resin curing agent has a function of increasing bonding strength between the bulk copper layer and the resin substrate layer as polyether sulfone, and therefore even without polyether sulfone, bonding strength between the bulk copper layer and the resin substrate layer of the third primer resin composition can be increased sufficiently. However, further mixing polyether sulfone as required; bonding strength between the bulk copper layer and the resin substrate layer can be increased more, so it is preferable. As the polyether sulfone, the same one as that used in the first primer resin composition can be used.
Next, a fourth primer resin composition will be described. Epoxy resin used in the fourth primer resin composition is the same as those used in the second primer resin composition. That is, in the fourth primer resin composition, bisphenyl sulfone type epoxy resin having a structure shown in the above described formula (1) is at least used for epoxy resin. And as required, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, bromined epoxy resin, alicyclic type epoxy resin, glycidyl amine type epoxy resin, biphenyl type epoxy resin, trifunctional epoxy resin and the like can be used.
In the fourth primer resin composition, the above described epoxy resin, which is used in combination with bisphenyl sulfone type epoxy resin having a structure shown in formula (1), can be used alone or in combination of two or more among those described above.
The epoxy resin curing agent used in the fourth primer resin composition is the same as the one used in the third primer resin composition. That is, in the fourth primer resin composition, diaminodiphenyl sulfone having a structure shown in formula (2) and/or bisphenyl sulfone type phenol resin having a structure shown in formula (2) described above is at least used for epoxy resin curing agent. And as required, amines such as dicyandiamide, imidazoles and aromatic amines excepting diaminodiphenyl sulfone having a structure shown in formula (2), phenols excepting bisphenyl sulfone type phenol resin having a structure shown in formula (2) such as bisphenol S, bisphenol A and bromined bisphenol A, novolacs such as phenol novolac resin and cresol novolac resin and acid anhydrides such as phthalic anhydride are used.
Here, in case of either one of X and Y being -OH and the other being -NH2 in formula (2), a compound of formula (2) corresponds to both diaminodiphenyl sulfone and bisphenyl sulfone type phenol resin.
In the fourth primer resin composition, the above described epoxy resin curing agents, which are used in combination with an epoxy resin curing agent having a structure shown in formula (2), can be used alone or in combination of two or more among those described above.
For example, the fourth primer resin composition is prepared by mixing epoxy resin having a structure shown in the above described formula (1) and an epoxy resin curing agent having a structure shown in formula (2). In addition, an organic solvent may be mixed to the fourth primer resin composition at the time of preparation or after preparation in order to adjust the viscosity for the purpose of improving coating ability.
The fourth primer resin composition contains bisphenyl sulfone type epoxy resin having a structure shown in the above described formula (1) as epoxy resin, at least. It resembles a basic structure of polyether sulfone, and the epoxy resin has a function of increasing bonding strength between the bulk copper layer and the resin substrate layer as polyether sulfone, and it contains at least an epoxy resin curing agent having a structure shown in the above described formula (2) which resembles a basic structure of polyether sulfone as an epoxy resin curing agent, so the epoxy resin curing agent has a function of increasing bonding strength between the bulk copper layer and the resin substrate layer as polyether sulfone. Therefore even without polyether sulfone, bonding strength between the bulk copper layer and the resin substrate layer of the fourth primer resin composition can be increased sufficiently. However, further mixing polyether sulfone as required; bonding strength between the bulk copper layer and the resin substrate layer can be increased more, so it is preferable. As the polyether sulfone, the same one as that used in the first primer resin composition can be used.
For the above described first primer resin composition to the fourth primer resin composition, content of sulfur in the layer being usually 0.6% by weight or more may increase affinity with metals such as copper and the like, so it is preferable.
Next, a primer resin composition including a silane coupling agent will be described. A primer resin composition including a silane coupling agent consists of the above described primer resin composition and a silane coupling agent. The primer resin composition above is the same as the one described in the section for the primer resin composition, and therefore description thereof will be omitted.
As the primer resin composition including a silane coupling agent contains a silane coupling agent, the primer resin layer obtained by semi-curing the primer resin composition contains a silane coupling agent as well. Therefore, the primer resin layer formed of the primer resin composition including a silane coupling agent may show higher bonding strength between the bulk copper layer and the resin substrate layer, when compared with the primer resin layer formed of a primer resin composition without a silane coupling agent. Therefore, in case of using the primer resin composition including a silane coupling agent as a raw material for producing the primer resin layer, forming of the silane coupling agent layer can be omitted. Here, in case of using the primer resin composition including a silane coupling agent as a raw material for forming the primer resin layer, forming of the silane coupling agent layer individually may further increase bonding strength between the bulk copper layer and the resin substrate layer, compared with the case of forming the layer without silane coupling agent, so it is preferable.
The primer resin composition including a silane coupling agent contains usually 0.1 parts by weight to 5 parts by weight and preferably 0.5 parts by weight to 3 parts by weight of the silane coupling agent with respect to 100 parts by weight of the primer resin composition. With the ratio of mixing the silane coupling agent to the primer resin composition falling within the range, bonding strength between the bulk copper layer and the resin substrate layer may increase sufficiently even without forming the silane coupling agent layer individually, so it is preferable.
On the other hand, with the ratio of mixing the silane coupling agent to the primer resin composition being less than 0.1 parts by weight, without forming silane coupling agent layer individually, bonding strength between the bulk copper layer and the resin substrate layer may hardly increase sufficiently, so it is not so preferable. In addition, with the mixing ratio of the silane coupling agent in excess of 5 parts by weight, heat resistance of the primer resin layer may not be sufficient, so it is not so preferable.
The primer resin layer is obtained by semi-curing the above described primer resin composition or the primer resin composition including a silane coupling agent. The method of semi-curing the primer resin composition or the primer resin composition including a silane coupling agent will not be limited in particular, but popular methods such as leaving materials after mixing and the like can be employed. For example, mixing of the above described epoxy resin and polyether sulfone having a hydroxyl group or an amino group or the both at its ends followed by hot air drying can perform semi-curing.
Equivalent thickness of the primer resin layer is usually 1 pm to 5 μm and preferably 1.5 μm to 4.0 μm. Here, equivalent thickness is a thickness measured in the condition when primer resin composition is coated on an ideal flat plane and then cured completely. With the thickness falling within the range, the bulk copper layer surface can be coated to provide uniform thickness and bonding strength with the resin substrate layer is high, so it is preferable. On the other hand, with the thickness being less than 1 μm, it may be difficult to cover the bulk copper layer surface with uniform thickness, so it is not so preferable. In addition, the thickness in excess of 5 μm may show tendency to cause interface delamination within the resin substrate layer, so it is not so preferable.
Electrodeposited copper foil with carrier foil with a primer resin layer of the present invention having above described layer construction, roughness Rzjis measured on a surface of plated Ni—Zn alloy layer is not more than 3 μm, preferably not more than 2.3 μm and more preferably not more than 1.6 μm. Rzjis falling within the range enables a finer circuit formation from the bulk copper layer, eliminate occurrence of an etching residue, and make impedance control easy, so it is preferable.
In addition, in the case where a chromate layer is formed, the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention has roughness Rzjis measured on the chromate layer not more than 3 μm, preferably not more than 2.3 μm and more preferably not more than 1.6 μm. Rzjis falling within the range enables a finer circuit formation from the bulk copper layer, eliminate occurrence of an etching residue, make impedance control easy, so it is preferable.
The electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be manufactured, for example, by a method of manufacturing the electrodeposited copper foil with carrier foil of the present invention as follows.
A method of manufacturing the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention includes a bonding interface layer forming process, a bulk copper layer forming process, a rust proofing layer forming process and a primer resin layer forming process as follows.
A bonding interface layer forming process is to contact at least one surface of the carrier foil which is fed continuously with the bonding interface layer forming agent to fix the bonding interface layer forming component in the bonding interface layer forming agent on the above described surface to form a bonding interface layer.
As carrier foil used in the present step, the same one as carrier foil described in electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be used. As a method of continuously feeding carrier foil, for example, a method of unwinding a carrier foil from a rolled state can be applicable.
As a bonding interface layer forming agent used in the present process, the same one as the bonding interface layer forming agent described in electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be used. In addition, as a method of contacting at least one surface of carrier foil to the bonding interface layer forming agent, a method of immersing the carrier foil into a bonding interface layer forming agent, a method of spraying the bonding interface layer forming agent to the carrier foil, a method of streaming down the bonding interface layer forming agent to the carrier foil and the like can be used, for example. These methods can be used alone or in combination of two or more.
In addition, as a method of fixing the bonding interface layer forming component in the bonding interface layer forming agent onto the surface of the carrier foil, a method by drying the bonding interface layer forming agent on the carrier foil surface to fix the bonding interface layer forming component, a method by electrodepositing the bonding interface layer forming component in the bonding interface layer forming agent onto the carrier foil surface and the like can be used, for example.
In the present process, a bonding interface layer is formed on at least one surface of the carrier foil. In the present process, conditions are appropriately adjusted so as to provide thickness of the bonding interface layer formed of usually 1 nm to 1 μl and preferably 5 nm to 500 nm. The thickness of the bonding interface layer of less than 1 nm does not show a sufficient performance of the bonding interface layer and, in excess of 1 μm, it cause difficulty in forming a bulk copper layer, so it is not preferable.
A bulk copper layer forming process is to form a bulk copper layer by electrolysis on the surface of the above described bonding interface layer by immersing the carrier foil that has been subjected to the bonding interface layer forming process into a bulk copper forming electrolytic solution.
The electrolytic solution for bulk copper forming used in the present process is a copper plating solution capable of forming a copper layer on the bonding interface layer surface by electrolysis. As such a bulk copper forming electrolytic solution, a copper sulfate solution and the like is used, for example. Electrolysis conditions such as current density in electrolysis for forming a bulk copper layer are not limited in particular but may be adjusted appropriately.
Here, the bulk copper layer is formed on the surface of a bonding interface layer which is formed in the process of forming the bonding interface layer, and the bulk copper layer does not always have to be formed on the bonding interface layer surface. That is, in the case where a bonding interface layer is formed on the both surfaces of carrier foil, forming on at least either one surface thereof will be carried out. Thus, as a method of forming a bulk copper layer on one surface, a method of setting an anode at the location in a predetermined distance apart from a surface of carrier foil surfaces where a bulk copper layer is desired to be formed. For example, to the carrier foil immersing into the bulk copper forming electrolytic solution, electric current is supplied to make the carrier foil to be a cathode to carry out electrolysis. Here, as a method of forming a bulk copper layer on the both surfaces of carrier foil, a method of setting anodes facing to both surfaces of the carrier foil and electric current is supplied to make the carrier foil to be a cathode to carry out electrolysis, or a method of setting an anode facing to one surface of carrier foil to make the carrier foil to be a cathode and another anode facing to another surface of carrier foil to make the carrier foil to be a cathode and electric current is supplied to carry out electrolysis can be used, for example. In the above described process, a bulk copper layer is formed on any one surface of surfaces of bonding interface layer.
To form Ni—Zn alloy layer as a rust proofing layer, the carrier foil that has been finished the bulk copper layer forming process is immersed into a Ni—Zn-containing plating solution to carry out electrolysis for forming a plated Ni—Zn alloy layer on the surface of the above described bulk copper layer.
The Ni—Zn-containing plating solution used in the present process is a solution containing Ni ions and Zn ions. For example, the Ni—Zn-containing plating solution is prepared by dissolving a pyrophosphate such as potassium pyrophosphate, and the like and moreover by dissolving nickel compound such as nickel sulfate and nickel acetate and the like as Ni ion source, and zinc compound such as Zinc pyrophosphate and zinc carbonate and the like as Zn ion source also into pure water.
The Ni—Zn-containing plating solution has a ratio of the Ni ion concentration to the Zn ion concentration (Ni ion concentration/Zn ion concentration) of usually 1.5 to 27 and preferably 6 to 15. With the ratio falling within the range, the Ni/Zn deposit amount ratio of the plated Ni—Zn alloy layer formed on the surface of the bulk copper layer may become appropriate, so it is preferable.
On the other hand, with the above described ratio being less than 1.5, the Ni/Zn deposit amount ratio of the plated Ni—Zn alloy layer formed on the surface of the bulk copper layer may become too small, so it is not so preferable. In addition, with the ratio in excess of 27, the Ni/Zn deposit amount ratio of the plated Ni—Zn alloy layer formed on the surface of the bulk copper layer may become too large, so it is not so preferable.
In addition, for the Ni—Zn-containing plating solution, the Ni ion concentration is usually 1 g/l to 6 g/l and preferably 2 g/l to 5 g/l. With the Ni ion concentration falling within the range, the Ni/Zn deposit amount ratio of the plated Ni—Zn alloy layer formed on the surface of the bulk copper layer may become appropriate, so it is preferable.
On the other hand, with the Ni ion concentration being less than 1 g/l, deposit amount of the both Ni and Zn in the plated Ni—Zn alloy layer may become too small, so it is not so preferable. In addition, with the Ni ion concentration in excess of 6 g/l, deposit amount of the both Ni and Zn in the plated Ni—Zn alloy layer formed on the surface of the bulk copper layer may become too large, so it is not so preferable.
For an electrolysis condition of forming the plated Ni—Zn alloy layer with the above described Ni—Zn-containing plating solution, current density is usually 0.1 A/dm2 to 3 A/dm2 and preferably 0.4 A/dm2 to 1.5 A/dm2. With the current density falling within the range, the Ni/Zn deposit amount ratio of the plated Ni—Zn alloy layer may fall within the above described preferable range, so it is preferable. Carrying out the above described process, a plated Ni—Zn alloy layer is formed on the surface of a bulk copper layer.
In addition, in the case chromate layer is formed, chromate layer is formed on the Ni—Zn alloy layer formed by above described method. On the method of forming chromate layer, any popular method can be applicable, so the production method will not be limited in particular.
A primer resin layer forming process is to coat a primer resin composition solution or a primer resin composition including a silane coupling agent solution onto a surface of the above described plated Ni—Zn alloy layer of carrier foil that has been subjected to the a plated Ni—Zn alloy layer forming process to form a primer resin layer.
The primer resin composition solution used in the present process consists of a primer resin composition and an organic solvent. And the primer resin composition including a silane coupling agent solution used in the present process consists of a primer resin composition including a silane coupling agent and an organic solvent.
As the primer resin composition used in the present process, the same one as the primer resin composition described in electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be used.
In addition, as the primer resin composition including a silane coupling agent used in the present process, the same one as the primer resin composition including a silane coupling agent described in electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be used.
Next, a primer resin composition solution will be described. Organic solvents used in a primer resin composition solution will not be limited in particular if it can dissolve those described above. For example, methyl ethyl ketone, cyclopentanone, dimethylformamide, dimethylacetamide, N-methyl-pyrrolidone, ã-butyrolactone and the like can be used. The above described organic solvents can be used alone or in combination of two or more. Among them, cyclopentanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, ã-butyrolactone has high dissolution ability for the polyether sulfone having a hydroxyl group or an amino group or the both at its ends, used in the present invention, so they are preferable.
Organic solvents used in a primer resin composition solution are preferably methyl ethyl ketone, cyclopentanone and a mixed solvent of methyl ethyl ketone and cyclopentanon, and more preferably a mixed solvent of methyl ethyl ketone and cyclopentanon. These organic solvents are easy to remove by evaporation at hot pressing in manufacturing process of the copper-clad laminates. Also the evaporated gas can be easily cleaned up. And it ease adjusting of the viscosity of a primer resin composition solution to be suitable for its coating on the bulk copper layer surface where a plated Ni—Zn alloy layer has been formed.
The mixing ratio of the primer resin composition and the organic solvent in the primer resin composition solution for the first primer resin composition is different in the other cases of the primer resin compositions for the second primer resin composition, the third primer resin composition and the fourth primer resin composition. The primer resin composition being in case of the first primer resin composition contains a lot of polyether sulfone which is a polymer hard to dissolve comparatively, to the ratio of mixing the above described primer resin composition with the organic solvent, the mixing ratio of the primer resin composition is usually 15% by weight to 35% by weight and preferably 20% by weight to 30% by weight, based on the total weight of both the primer resin composition and the organic solvent. The mixing ratio falling within the range may improve uniformity in film thickness of the formed primer resin composition, so it is preferable.
On the other hand, with the above described mixing ratio less than 15% by weight, the viscosity of the primer resin composition solution is too low to secure uniformity of film thickness of the formed primer resin composition, so it is not so preferable. In addition, with the above described mixing ratio in excess of 35% by weight, the viscosity of the primer resin composition is too high to cause difficulty in adjusting thickness of the film thickness of the formed primer resin layer, so it is not so preferable.
By the way, in case of the primer resin composition being the second primer resin composition, the third primer resin composition or the fourth primer resin composition, ratio of mixing the above described primer resin composition with the organic solvent is usually 30% by weight to 50% by weight and preferably 35% by weight to 45% by weight, based on the total weight of the both primer resin composition and the organic solvent as 100% by weight. The mixing ratio falling within the range may improve uniformity in film thickness of the formed primer resin composition, which is preferable.
On the other hand, with the above described mixing ratio less than 30% by weight, the viscosity of the primer resin composition solution is too low to secure uniformity of film thickness of the formed primer resin composition, so it is not so preferable. In addition, with the above described mixing ratio in excess of 50% by weight, the viscosity of the primer resin composition is too high to cause difficulty in adjusting thickness of the film thickness of the formed primer resin layer, so it is not so preferable.
Next, a primer resin composition including a silane coupling agent solution will be described. As organic solvents used in a primer resin composition including a silane coupling agent solution, those described in the section for the primer resin composition solution can be used.
The mixing ratio of primer resin composition including a silane coupling agent and the organic solvent in the primer resin composition including a silane coupling agent solution is similar with the mixing ratio of the primer resin composition and the organic solvent in the primer resin composition solution.
Carrying out the processes as described above, the primer resin layer is formed onto a surface of the plated Ni—Zn alloy layer, and electrodeposited copper foil with carrier foil with a primer resin layer of the present invention is manufactured. Here, as required, a process of chromate treatment to form a chromate layer onto a surface of the plated Ni—Zn alloy layer may be carried out within the plated Ni—Zn alloy layer forming process and the primer resin layer forming process. For a method of the chromate treatment, popular methods can be employed.
In the present invention, a silane coupling agent treatment process to form a silane coupling agent layer to the plated Ni—Zn alloy layer or the chromate layer may be carried out as required. As the silane coupling agent used in the present step, the same one as the silane coupling agent described on the electrodeposited copper foil with carrier foil with a primer resin layer of the present invention can be used. As the method of the silane coupling agent treatment, conventional methods, for example, applying appropriately diluted silane coupling agent, followed by drying can be employed.
The electrodeposited copper foil with carrier foil with a primer resin layer of the present invention and a method of manufacturing it can be used, for example, for electrodeposited copper foil with carrier foil with a primer resin layer for application as materials for forming electrodes and circuits and manufacture of it.
Examples will be shown as follows but the present invention should not be considered to be limited thereto.
As carrier foil, a copper foil with a thickness of 35 im (roughness of matte side Rzjis being 4.0 im and roughness of shiny side Rzjis being 1.4 im) rolled up was used. The carrier foil was unwound continuously and the following processing was carried out.
At first, the carrier foil was immersed into a dilute acid of 100 g/l at 25 deg. C. in an acid pickling bath to carry out acid pickling. After acid pickling was over, the test sample was cleaned with pure water.
Next, the carrier foil was immersed into a carboxybenzotriazole solution of 3.5 g/l for 45 seconds in the bonding interface layer forming bath, followed by rinsing with water to form bonding interface layers with a 20 nm thickness on both sides of the carrier foil. At this point of time, layer structure of the foil became bonding interface layer/carrier foil/bonding interface layer in this order from the matte side of the carrier foil.
Moreover, in the bulk copper forming bath, the carrier foil on which bonding interface layers having been formed was immersed into a copper sulfate solution containing Cu with concentration of 65 g/l and free S042− with concentration of 80 g/l at a temperature of 50 deg. C., and was electrolyzed at 20 A/dm2 with an anode arranged apart in a predetermined gap facing to the shiny side of the carrier foil to form a bulk copper layer with 1 μm thickness on the surface of the bonding interface layer on the shiny side of the carrier foil. At this point of time, layer structure of the foil became bonding interface layer/carrier foil/bonding interface layer/bulk copper layer in this order from the matte side of the carrier foil.
Next, the carrier foil on which the bulk copper layer having been formed was immersed into a Ni—Zn solution (plated Ni—Zn alloy layer solution A). The solution A) is prepared by dissolving potassium pyrophosphate being 100 g/l, Zinc pyrophosphate to adjust Zn ion concentration being 0.5 g/l and nickel sulfate to adjust Ni ion concentration being 4 g/l into pure water at 40 deg. C., and then the Ni—Zn-containing plating bath is adjusted to pH 10 with potassium hydroxide solution. The plated Ni—Zn alloy layer was formed on the surface of the bulk copper layer after electrolyzing at 0.59 A/dm2 for 9 seconds with an anode arranged apart by a predetermined gap facing to the shiny side of the carrier foil by using the solution A) . At this point of time, layer structure of the foil became bonding interface layer/carrier foil/bonding interface layer/bulk copper layer/plated Ni—Zn alloy layer in this order from the matte side of the carrier foil.
Next, the carrier foil with the plated Ni—Zn alloy layer having been formed was immersed into a chromate treatment solution, that is, chromic oxide CrO3 was dissolved in a pure water at 30 deg. C. to be 1 g/l of a chromate treatment bath, and was electrolyzed at 1.7 A/dm2 for 7 seconds with an anode arranged apart in a predetermined gap facing to the shiny side of the carrier foil to form a chromate layer with Cr deposition being 1.7 mg/m2 on the surface of the plated Ni—Zn alloy layer. At this point of time, layer structure of the foil became bonding interface layer/carrier foil/bonding interface layer/bulk copper layer/plated Ni—Zn alloy layer /chromate layer in this order from the matte side of the carrier foil.
Next, in a silane coupling agent treatment bath, a silane coupling agent solution prepared to be 5 g/l of epoxy silane (KBM403, produced by Shin-Etsu Chemical Co., Ltd.) was applied by spraying from the bottom to the chromate layer surface by using a shower nozzle, followed by drying with a heater to form a silane coupling agent layer, and then rolled up. The electrodeposited copper foil with carrier foil (electrodeposited copper foil with carrier foil A) with layer structure of the foil being bonding interface layer/carrier foil/bonding interface layer/bulk copper layer/plated Ni—Zn alloy layer /chromate layer/silane coupling agent layer in this order from the matte side of the carrier foil was obtained through above described steps.
At first, a primer resin composition (primer resin composition A) was prepared by mixing bisphenol A type epoxy resin (Epikote 828 produced by Japan Epoxy Resins Co., Ltd.) with 40 parts by weight, polyether sulfone resin (SUMIKAEXCEL 5003P, produced by Sumitomo Chemical Co., Ltd.) with 60 parts by weight and imidazole (2E4MZ, produced by Shikoku Chemicals Corporation) with 1 parts by weight as an epoxy resin curing accelerator. Content of sulfur in the primer resin composition A was 8.2% by weight. Then, to prepare a solution containing solid resin content of 30% by weight (primer resin composition solution A) was prepared by mixing the primer resin composition A and dimethylacetamide.
Next, the electrodeposited copper foil with carrier foil A was set into a coating machine and was unwound continuously, and the above described primer resin composition solution A was coated on the surface of the silane coupling agent layer of the electrodeposited copper foil with carrier foil A with a coating amount being adjusted by using a gravure coater to form primer resin layer with thickness of 2im, followed by drying to semi-cure the primer resin layer. As such, electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil A) with layer structure being bonding interface layer/carrier foil/bonding interface layer/bulk copper layer/plated Ni—Zn alloy layer /chromate layer/silane coupling agent layer/primer resin layer in this order from the matte side of the carrier foil was obtained.
Here, the bulk copper layer of the primer resin coated electrodeposited copper foil with carrier foil A is too thin to perform measurement of peel strength as it is, as a substitute properties, measurements as described below were used for peel strength as received state as well as peel strength after chemical treatment. In addition, roughness in Rzjis (im) was measured after removing the primer resin layer and silane coupling agent layer to expose the chromate layer on the primer resin coated electrodeposited copper foil with carrier foil A. In addition, deposit amount of Ni and Zn in the plated Ni—Zn alloy layer of the primer resin coated electrodeposited copper foil with carrier foil A was analyzed by using ICP optical emission spectrometry. Results thereof are shown in Table 2 and Table 3.
The primer resin coated electrodeposited copper foil with carrier foil A and an epoxy resin impregnated glass cloth base prepreg (FR-4 R1661 produced by Matsushita Electric Works, Ltd.) were lay-up where the primer resin layer face to the prepreg, and hot pressed at 190 deg.C. for 60 minutes to obtain a copper-clad laminate with a carrier foil (a copper-clad laminate with a carrier foil A) . Then the resin substrate layer is obtained by curing the layer structure of the foil being bonding interface layer/carrier foil/bonding interface layer/bulk copper layer/plated Ni—Zn alloy layer /chromate layer/silane coupling agent layer/primer resin layer/prepreg in this order from the matte side of the carrier foil.
After releasing the carrier foil from the copper-clad laminate with a carrier foil A and the bonding interface layer remaining on the bulk copper layer surface is carried out pickling in the dilute hydrochloric acid, a copper-clad laminate (copper-clad laminate A) with the layer structure of bulk copper layer/plated Ni—Zn alloy layer /chromate layer/silane coupling agent layer/primer resin layer/resin substrate layer in the order in view from the side where the carrier foil was released.
The copper-clad laminate A is immersed into a copper sulfate solution containing Cu2+with concentration of 65 g/l and free SO42− with concentration of 90 g/l at a temperature of 50 deg. C. And electrolysis at 20 A/dm2 was carried out with an anode arranged apart in a predetermined gap facing to the bulk copper layer to carry out copper plating on the surface of the bulk copper layer. Thus a thickened copper-clad laminate with bulk copper layer thickened to 35 im was obtained (thickened copper-clad laminate A).
The thickened copper-clad laminate A was etched to form a plurality of circuits with 0.8 mm width of the thickened bulk copper layer, and thus a printed wiring board was obtained (printed wiring board A) . Next, the printed wiring board A is cut to be individual circuit boards which has one circuit pattern, and plurality of test specimens (peel strength measurement test specimen A) for peel strength measurement having rectangular-shaped circuit with 0.8 mm line width 100 mm length were obtained.
A portion around several millimeters from an end of the above described peel strength measurement test specimen A in its longitudinal direction was folded to break just the base along the direction approximately perpendicular to the longitudinal direction of the rectangular-shaped circuit to remain rectangular-shaped circuit. Then a peel strength measurement test specimen A with the rectangular-shaped circuit which is connected at the cut base portion was obtained.
Next the peel strength measurement test specimen A was set on a peel strength measuring equipment. Then a rectangular-shaped circuit of the portion where the above described base was cut is directed upward and was chucked to the above described peel strength measuring equipment. Next, the chuck was pull up at a constant speed with peeling off the rectangular-shaped circuit from the resin substrate layer of the peel strength measurement test specimen A. Peel strength was measured according to JIS C-6481 to examine peel strength.
The above described peel strength measurement test specimens A were immersed into a solution with potassium permanganate of 55 g/l at 70 deg. C. with pH 13 for 10 minutes. Picking out them followed by rinsing with pure water, drying by leaving, pluralities of peel strength after chemical-treatment measurement test specimen (peel strength after chemical-treatment measurement test specimen A) were obtained. Peel strength was measured on peel strength after chemical-treatment measurement test specimen A as shown in the method of measuring peel strength as received and the value at that time is shown as peel strength after chemical-treatment. As a result, peel strength as received was 1.6 kgf/cm and peel loss after chemical-treatment was around 6%, so it is both acceptable.
The electrodeposited copper foil with carrier foil (electrodeposited copper foil with carrier foil B) was obtained as same with Embodiment 1 except electrolysis condition in Ni—Zn plating changed to 0.66 A/dm2 with plating time for 6 seconds having been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 4.8/16.2/1.7 mg/m2 for each respectively and Ni/Zn ratio was 3.4.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil B) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil B. As a result, P/S after chemical-treatment was 1.7 kgf/cm and peel loss after chemical-treatment was around 6%, so it was acceptable.
The electrodeposited copper foil with carrier foil (electrodeposited copper foil with carrier foil C) was obtained as same with Embodiment 1 except electrolysis condition in Ni—Zn plating changed to 0.66 A/dm2 with plating time for 7 seconds have been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 6.6/21.2/1.7 mg/m2 for each respectively and Ni/Zn ratio was 3.2.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil C) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil C. As a result, P/S after chemical-treatment was 1.6 kgf/cm and peel loss after chemical-treatment was around 6%, so it was acceptable.
The electrodeposited copper foil with carrier foil (electrodeposited copper foil with carrier foil D) was obtained as same with Embodiment 1 except electrolysis condition in Ni—Zn plating changed to 0.72 A/dm2 with plating time for 6 seconds having been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 5.6/18.8/1.7 mg/m2 for each respectively and Ni/Zn ratio was 3.4.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil D) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil D. As a result, P/S after chemical-treatment was 1.6 kgf/cm and peel loss after chemical-treatment was around 6%, so it was acceptable.
The electrodeposited copper foil with carrier foil (electrodeposited copper foil with carrier foil E) was obtained as same with Embodiment 1 except electrolysis condition in Ni—Zn plating changed to 0.79 A/dm2 with plating time for 7 seconds having been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 12.4/33.6/1.7 mg/m2for each respectively and Ni/Zn ratio was 2.7.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil E) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil E. As a result, P/S after chemical-treatment was 1.6 kgf/cm and peel loss after chemical-treatment was around 6%, so it was acceptable.
In place of the Ni—Zn-containing plating solution A in Embodiment 1, the Ni—Zn solution (Ni—Zn-containing plating solution B) prepared by dissolving potassium pyrophosphate being 100 g/l, zinc pyrophosphate to adjust Zn ion concentration being 0.95 g/l and nickel sulfate to adjust Ni ion concentration being 1.6 g/l at 40 deg.C. into pure water, and then the Ni—Zn-containing plating bath is adjusted to pH 10 with potassium hydroxide solution. Then electrodeposited copper foil with carrier foil was obtained as same with Embodiment 1 except using the Ni—Zn-containing plating solution B and current density 0.79 A/dm2 have been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 10.4/13.6/1.8 mg/m2 for each respectively and Ni/Zn ratio was 1.3.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil F) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil F. As a result, P/S after chemical-treatment was 0.85 kgf/cm and peel loss after chemical-treatment was around 50%.
The electrodeposited copper foil with carrier foil was obtained as same with Embodiment 1 except using the Ni—Zn-containing plating solution B and electrolysis condition in Ni—Zn plating changed to 0.79 A/dm2with plating time for 9 seconds have been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 14.2/17.8/1.8 mg/m2 for each respectively and Ni/Zn ratio was 1.3.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil G) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil G. As a result, P/S after chemical-treatment was 0.85 kgf/cm and peel loss after chemical-treatment was around 50%.
The electrodeposited copper foil with carrier foil was obtained as same with Embodiment 1 except t using the Ni—Zn-containing plating solution B and electrolysis condition in Ni—Zn plating changed to 1.05 A/dm2 with plating time for 9 seconds have been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 16.4/20.2/1.8 mg/m2 for each respectively and Ni/Zn ratio was 1.2.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil H) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil H. As a result, P/S after chemical-treatment was 0.85 kgf/cm and peel loss after chemical-treatment was around 50%.
The electrodeposited copper foil with carrier foil was obtained as same with Embodiment 1 except t using the Ni—Zn-containing plating solution B and electrolysis condition in Ni—Zn plating changed to 1.18 A/dm2 with plating time for 9 seconds have been taken. In analysis on the deposited elements, deposited amount of Ni/Zn/Cr were 20.2/23.8/1.8 mg/m2 for each respectively and Ni/Zn ratio was 1.2.
The electrodeposited copper foil with carrier foil with a primer resin layer (primer resin coated electrodeposited copper foil with carrier foil I) was obtained as same with Embodiment 1. And respective properties were measured on the primer resin coated electrodeposited copper foil with carrier foil I. As a result, P/S after chemical-treatment was 0.85 kgf/cm and peel loss after chemical-treatment was around 50%.
Process conditions and results in measurements for Example 1 to Example 5 and Comparative Example 1 to Comparative Example 4 are summarized in Table 1 to Table 3.
According to Table 1 to Table 3, it is apparent that a smaller Ni/Zn deposit amount ratio in plated Ni—Zn alloy layer cause peel loss after chemical-treatment against to the peel strength as received.
The electrodeposited copper foil with carrier foil of the present invention and a method of manufacturing thereof can be applied, for example, to electrodeposited copper foil with carrier foil as materials for forming electrodes and circuits and to manufacture the electrodeposited copper foil with carrier foil.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2004-264640 | Sep 2004 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP05/16609 | 9/9/2005 | WO | 00 | 7/12/2007 |
