Kenji Arai

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Okazaki-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wave soldering method and system used for the method
- Patent number 6,412,682
- Issue date Jul 2, 2002
- Denso Corporation
- Ataru Ichikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow soldering apparatus having resilient substrate clamping mechan...
- Patent number 6,273,317
- Issue date Aug 14, 2001
- Denso Corporation
- Kenji Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave soldering method and system used for the method
- Patent number 6,273,319
- Issue date Aug 14, 2001
- Denso Corporation
- Ataru Ichikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet soldering method and apparatus
- Patent number 6,257,480
- Issue date Jul 10, 2001
- Denso Corporation
- Atushi Furumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wave soldering method and system used for the method
- Publication number 20010032869
- Publication date Oct 25, 2001
- DENSO Corporation
- Ataru Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR