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Kenji Furuta

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer dividing method and dividing apparatus
    • Patent number 12,074,067
    • Issue date Aug 27, 2024
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 12,062,575
    • Issue date Aug 13, 2024
    • Disco Corporation
    • Kenji Furuta
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 11,548,096
    • Issue date Jan 10, 2023
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,195,757
    • Issue date Dec 7, 2021
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Evaluation jig and evaluation method for height position detection...
    • Patent number 10,864,598
    • Issue date Dec 15, 2020
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of processing a substrate
    • Patent number 10,682,728
    • Issue date Jun 16, 2020
    • Disco Corporation
    • Karl Heinz Priewasser
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrostatic chuck table
    • Patent number 10,490,450
    • Issue date Nov 26, 2019
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrostatic chuck table using method
    • Patent number 10,410,901
    • Issue date Sep 10, 2019
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,786,561
    • Issue date Oct 10, 2017
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,478,465
    • Issue date Oct 25, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,093,519
    • Issue date Jul 28, 2015
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,018,080
    • Issue date Apr 28, 2015
    • Disco Corporation
    • Kenji Furuta
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece dividing method
    • Patent number 8,685,839
    • Issue date Apr 1, 2014
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of dividing a workpiece having an uneven surface
    • Patent number 8,592,717
    • Issue date Nov 26, 2013
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus and laser processing method
    • Patent number 8,581,144
    • Issue date Nov 12, 2013
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of dividing workpiece using laser beam
    • Patent number 8,536,486
    • Issue date Sep 17, 2013
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of forming a modified layer in a substrate
    • Patent number 7,927,974
    • Issue date Apr 19, 2011
    • Disco Corporation
    • Yosuke Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer dividing method
    • Patent number 7,883,992
    • Issue date Feb 8, 2011
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method for gallium arsenide wafer
    • Patent number 7,776,721
    • Issue date Aug 17, 2010
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam processing machine
    • Patent number 7,482,554
    • Issue date Jan 27, 2009
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for laser processing of wafer
    • Patent number 7,396,780
    • Issue date Jul 8, 2008
    • Disco Corporation
    • Hitoshi Hoshino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,179,723
    • Issue date Feb 20, 2007
    • Disco Corporation
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents