Kenji Isihara

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,356,528
- Issue date Oct 18, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,338,619
- Issue date Aug 16, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR