TREA

Kenji Kamimura

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Polishing apparatus and polishing method
    • Patent number 11,331,769
    • Issue date May 17, 2022
    • Ebara Corporation
    • Kenji Kamimura
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number RE45687
    • Issue date Sep 29, 2015
    • Ebara Corporation
    • Nobutoshi Saito
    • 001 -
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,486,234
    • Issue date Jul 16, 2013
    • Ebara Corporation
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,177,944
    • Issue date May 15, 2012
    • Ebara Corporation
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method and apparatus for preventing adherence of solid products in...
    • Patent number 7,736,440
    • Issue date Jun 15, 2010
    • Ebara Corporation
    • Hiroshi Ikeda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Polishing apparatus
    • Patent number 7,207,864
    • Issue date Apr 24, 2007
    • Ebara Corporation
    • Kenji Kamimura
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 7,040,968
    • Issue date May 9, 2006
    • Ebara Corporation
    • Kenji Kamimura
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 6,939,208
    • Issue date Sep 6, 2005
    • Ebara Corporation
    • Kenji Kamimura
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents