Kenji Osawa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame and semiconductor device having the same
- Patent number 6,700,184
- Issue date Mar 2, 2004
- Sony Corporation
- Kenji Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package with improved cross...
- Patent number 6,492,199
- Issue date Dec 10, 2002
- Sony Corporation
- Kenji Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor package having the same and method for ma...
- Patent number 6,319,749
- Issue date Nov 20, 2001
- Sony Corporation
- Hiroyuki Shigeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film circuit
- Patent number 6,153,925
- Issue date Nov 28, 2000
- Sony Corporation
- Kazuhiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package having a lead frame
- Patent number 6,107,678
- Issue date Aug 22, 2000
- Sony Corporation
- Hiroyuki Shigeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing lead frame
- Patent number 6,077,727
- Issue date Jun 20, 2000
- Sony Corporation
- Kenji Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film circuit and method of manufacturing the same
- Patent number 5,843,810
- Issue date Dec 1, 1998
- Sony Corporation
- Kazuhiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated printed coil structure
- Patent number 4,804,574
- Issue date Feb 14, 1989
- Sony Corporation
- Kenji Osawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package with improved cross talk and grounding, and m...
- Publication number 20010011767
- Publication date Aug 9, 2001
- Kenji Osawa
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Osawa

Person

Patents Grantslast 30 patents

Lead frame and semiconductor device having the same

Method of manufacturing a semiconductor package with improved cross...

Lead frame, semiconductor package having the same and method for ma...

Film circuit

Lead frame and semiconductor package having a lead frame

Method for manufacturing lead frame

Film circuit and method of manufacturing the same

Laminated printed coil structure

Patents Applicationslast 30 patents

Semiconductor package with improved cross talk and grounding, and m...