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Kenji OUCHI

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  • Nirasaki City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing method and substrate processing system
    • Patent number 11,996,296
    • Issue date May 28, 2024
    • Tokyo Electron Limited
    • Kae Kumagai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for processing workpiece
    • Patent number 10,937,660
    • Issue date Mar 2, 2021
    • Tokyo Electron Limited
    • Kenji Ouchi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method for processing workpiece
    • Patent number 10,763,106
    • Issue date Sep 1, 2020
    • Tokyo Electron Limited
    • Kenji Ouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method
    • Patent number 10,483,135
    • Issue date Nov 19, 2019
    • Tokyo Electron Limited
    • Kenji Ouchi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Film forming method
    • Patent number 10,431,450
    • Issue date Oct 1, 2019
    • Tokyo Electron Limited
    • Kenji Ouchi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Film forming method and film forming apparatus
    • Patent number 9,926,624
    • Issue date Mar 27, 2018
    • Tokyo Electron Limited
    • Kazuki Yamada
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING
    • Publication number 20240014153
    • Publication date Jan 11, 2024
    • TOKYO ELECTRON LIMITED
    • Takashi FUJIBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM-FORMING METHOD
    • Publication number 20230148162
    • Publication date May 11, 2023
    • TOKYO ELECTRON LIMITED
    • Shuji AZUMO
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    FILM FORMATION METHOD
    • Publication number 20220336205
    • Publication date Oct 20, 2022
    • Tokyo Electron Limited
    • Kenji OUCHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
    • Publication number 20220157616
    • Publication date May 19, 2022
    • TOKYO ELECTRON LIMITED
    • Kae KUMAGAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PROCESSING WORKPIECE
    • Publication number 20190326124
    • Publication date Oct 24, 2019
    • TOKYO ELECTRON LIMITED
    • Kenji OUCHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR PROCESSING WORKPIECE
    • Publication number 20190189437
    • Publication date Jun 20, 2019
    • TOKYO ELECTRON LIMITED
    • Kenji OUCHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FILM FORMING METHOD
    • Publication number 20180261452
    • Publication date Sep 13, 2018
    • Kenji OUCHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FILM FORMING METHOD AND FILM FORMING APPARATUS
    • Publication number 20150368802
    • Publication date Dec 24, 2015
    • TOKYO ELECTRON LIMITED
    • Kazuki YAMADA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...