Kenji Sugawara

Person

Musashimurayama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure-bonded ball diameter detecting apparatus and pressure-bond...
- Patent number 8,149,276
- Issue date Apr 3, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,091,761
- Issue date Jan 10, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for detecting press-bonded ball at bonding portion in bon...
- Patent number 7,929,152
- Issue date Apr 19, 2011
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding program
- Patent number 7,330,582
- Issue date Feb 12, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 7,324,684
- Issue date Jan 29, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, bonding apparatus and bonding program
- Patent number 7,209,583
- Issue date Apr 24, 2007
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image processing method, an image processing device and a bonding a...
- Patent number 7,013,039
- Issue date Mar 14, 2006
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,961,457
- Issue date Nov 1, 2005
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image processing method, an image processing device and a bonding a...
- Patent number 6,917,699
- Issue date Jul 12, 2005
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image processing method and device
- Patent number 6,868,176
- Issue date Mar 15, 2005
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding wire inspection apparatus
- Patent number 5,396,334
- Issue date Mar 7, 1995
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire inspection apparatus and method
- Patent number 5,394,246
- Issue date Feb 28, 1995
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire inspection apparatus
- Patent number 5,369,492
- Issue date Nov 29, 1994
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire inspection apparatus
- Patent number 5,365,341
- Issue date Nov 15, 1994
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire inspection method
- Patent number 5,347,362
- Issue date Sep 13, 1994
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire inspection apparatus
- Patent number 5,293,217
- Issue date Mar 8, 1994
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G01 - MEASURING TESTING
Information Patent Grant
Driving device for an optical system
- Patent number 5,078,472
- Issue date Jan 7, 1992
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bond...
- Publication number 20110128369
- Publication date Jun 2, 2011
- SHINKAWA LTD.
- Kenji SUGAWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20110114704
- Publication date May 19, 2011
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method
- Publication number 20100072262
- Publication date Mar 25, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for detecting press-bonded ball at bonding portion in bon...
- Publication number 20080259352
- Publication date Oct 23, 2008
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding program
- Publication number 20070041632
- Publication date Feb 22, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus
- Publication number 20070036425
- Publication date Feb 15, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method, bonding apparatus and bonding program
- Publication number 20050167471
- Publication date Aug 4, 2005
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image processing method, an image processing device and a bonding a...
- Publication number 20030016860
- Publication date Jan 23, 2003
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image processing method, an image processing device and a bonding a...
- Publication number 20020166885
- Publication date Nov 14, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G05 - CONTROLLING REGULATING
Information Patent Application
Image processing method and device
- Publication number 20020122584
- Publication date Sep 5, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Position detection device and method
- Publication number 20020114520
- Publication date Aug 22, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image processing method and device
- Publication number 20020102016
- Publication date Aug 1, 2002
- KABUSHIKI KAISHA SHINKAWA
- Nobuto Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20020039437
- Publication date Apr 4, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G06 - COMPUTING CALCULATING COUNTING

Kenji Sugawara

Person

Patents Grantslast 30 patents

Pressure-bonded ball diameter detecting apparatus and pressure-bond...

Bonding apparatus and bonding method

Apparatus for detecting press-bonded ball at bonding portion in bon...

Bonding program

Bonding apparatus

Bonding method, bonding apparatus and bonding program

Image processing method, an image processing device and a bonding a...

Bonding apparatus and bonding method

Image processing method, an image processing device and a bonding a...

Image processing method and device

Bonding wire inspection apparatus

Bonding wire inspection apparatus and method

Bonding wire inspection apparatus

Bonding wire inspection apparatus

Bonding wire inspection method

Bonding wire inspection apparatus

Driving device for an optical system

Patents Applicationslast 30 patents

Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bond...

Bonding apparatus and bonding method

Wire bonding method

Apparatus for detecting press-bonded ball at bonding portion in bon...

Bonding program

Bonding apparatus

Bonding method, bonding apparatus and bonding program

Image processing method, an image processing device and a bonding a...

Image processing method, an image processing device and a bonding a...

Image processing method and device

Position detection device and method

Image processing method and device

Bonding apparatus and bonding method