Claims
- 1. A bonding wire inspection apparatus that inspects wires bonded between the pads of a semiconductor chip and the leads of a lead frame comprising:
- a ring-form illumination means made up of plural LED's arranged in a ring shape so as to illuminate an object of inspection at inclined angles to provide dark field illumination;
- a vertical illuminator for illuminating said object to provide bright field illumination;
- an optical means that receives light reflected by said object and images said object; and
- cameras that photograph the image taken in by said optical means; and wherein
- said optical means further comprises a diaphragm means provided only in an optical path of said cameras, said diaphragm means having variable opening diameter to provide a wide opening for shallow optical depth of focus or a small opening to provide a large optical depth of field of focus.
- 2. A bonding wire inspection apparatus according to claim 1, wherein said optical means further comprises a high magnification imaging lens group and a low magnification imaging lens group.
- 3. An apparatus according to claim 2, wherein said diaphragm means comprises at least two diaphragms, one of said two diaphragms being provided only in an optical path of said low magnification imaging lens group.
- 4. An apparatus according to claim 3, wherein an opening diameter of each of said two diaphragms is independently varied.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-341831 |
Dec 1991 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 07/983,649, filed Dec. 1, 1992, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5030008 |
Scott et al. |
Jul 1991 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
2-129942 |
May 1990 |
JPX |
3-76137 |
Apr 1991 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
983649 |
Dec 1992 |
|