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Kenji Tazawa

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  • Samukawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Photopolymerizable composition
    • Patent number 6,506,540
    • Issue date Jan 14, 2003
    • Tokyo Ohka Kogyo Co., Ltd.
    • Akira Kumazawa
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Process for producing multilayer wiring boards
    • Patent number 6,228,465
    • Issue date May 8, 2001
    • Tokyo Ohka Kogyo Co., Ltd.
    • Yoshikazu Takiguchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Process for producing multilayer wiring boards
    • Patent number 6,010,956
    • Issue date Jan 4, 2000
    • Tokyo Ohka Kogyo Co., Ltd.
    • Yoshikazu Takiguchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Remover solution for photoresist
    • Patent number 5,185,235
    • Issue date Feb 9, 1993
    • Tokyo Ohka Kogyo Co., Ltd.
    • Hiromitsu Sato
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Photosensitive resin composition
    • Patent number 5,087,552
    • Issue date Feb 11, 1992
    • Tokyo Ohka Kogyo Co., Ltd.
    • Tomoki Horigome
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Heat-resistant photosensitive resin composition
    • Patent number 4,996,132
    • Issue date Feb 26, 1991
    • Toyko Ohka Kogyo Co. Ltd.
    • Kenji Tazawa
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Heat-resistant photosensitive resin composition
    • Patent number 4,786,579
    • Issue date Nov 22, 1988
    • Tokyo Ohka Kogyo Co., Ltd.
    • Kenji Tazawa
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

  • Information Patent Application

    Photopolymerizable composition
    • Publication number 20020031723
    • Publication date Mar 14, 2002
    • Akira Kumazawa
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC