Kenji Wada

Person

Fujimi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic component, and electronic appar...
- Patent number 8,921,162
- Issue date Dec 30, 2014
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a layer, method for manufacturing an active matr...
- Patent number 8,888,229
- Issue date Nov 18, 2014
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniature optical element for wireless bonding in an electronic ins...
- Patent number 7,879,633
- Issue date Feb 1, 2011
- Seiko Epson Corporation
- Kenji Wada
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-layered structure forming method, method of manufacturing wir...
- Patent number 7,723,243
- Issue date May 25, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniature optical element for wireless bonding in an electronic ins...
- Patent number 7,544,973
- Issue date Jun 9, 2009
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature optical element for wireless bonding in an electronic ins...
- Patent number 7,276,738
- Issue date Oct 2, 2007
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered structure forming method, method of manufacturing wir...
- Patent number 7,250,377
- Issue date Jul 31, 2007
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of fabricating the same, stack-type se...
- Patent number 7,102,219
- Issue date Sep 5, 2006
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature optical element for wireless bonding in an electronic ins...
- Patent number 7,074,632
- Issue date Jul 11, 2006
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,033,935
- Issue date Apr 25, 2006
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same, stack-type se...
- Patent number 6,962,865
- Issue date Nov 8, 2005
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor, circuit boa...
- Patent number 6,852,621
- Issue date Feb 8, 2005
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same, stack-type se...
- Patent number 6,720,661
- Issue date Apr 13, 2004
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature optical element for wireless bonding in an electronic ins...
- Patent number 6,703,689
- Issue date Mar 9, 2004
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,682,948
- Issue date Jan 27, 2004
- Seiko Epson Corporation
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing thereof, including a through...
- Patent number 6,667,551
- Issue date Dec 23, 2003
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC APPAR...
- Publication number 20130307124
- Publication date Nov 21, 2013
- SEIKO EPSON CORPORATION
- Kenji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM MEMBER, FILM MOLDED PRODUCT, FILM MEMBER PRODUCING METHOD, AND...
- Publication number 20120237723
- Publication date Sep 20, 2012
- SEIKO EPSON CORPORATION
- Kenji WADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Miniature optical element for wireless bonding in an electronic ins...
- Publication number 20090221108
- Publication date Sep 3, 2009
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Miniature optical element for wireless bonding in an electronic ins...
- Publication number 20080009087
- Publication date Jan 10, 2008
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layered structure forming method, method of manufacturing wir...
- Publication number 20070141828
- Publication date Jun 21, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A LAYER, METHOD FOR MANUFACTURING AN ACTIVE MATR...
- Publication number 20070046718
- Publication date Mar 1, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- G02 - OPTICS
Information Patent Application
MULTILAYERED STRUCTURE FORMING METHOD
- Publication number 20060292769
- Publication date Dec 28, 2006
- SEIKO EPSON CORPORATION
- Kenji Wada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of manufacturing multi-layered substrate
- Publication number 20060240664
- Publication date Oct 26, 2006
- Kenji Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Miniature optical element for wireless bonding in an electronic ins...
- Publication number 20060208331
- Publication date Sep 21, 2006
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layered structure forming method, method of manufacturing wir...
- Publication number 20060040489
- Publication date Feb 23, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for providing a layer, wiring substrate, elector-optical dev...
- Publication number 20060013970
- Publication date Jan 19, 2006
- SEIKO EPSON CORPORATION
- Kenji Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shield wire
- Publication number 20060003633
- Publication date Jan 5, 2006
- SEIKO EPSON CORPORATION
- Kenji Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making layers and wiring board made thereby
- Publication number 20050287377
- Publication date Dec 29, 2005
- SEIKO EPSON CORPORATION
- Kenji Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing circuit element, method for manufacturing...
- Publication number 20050272244
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same, stack-type se...
- Publication number 20040155354
- Publication date Aug 12, 2004
- SEIKO EPSON CORPORATION
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same, stack-type se...
- Publication number 20040155355
- Publication date Aug 12, 2004
- SEIKO EPSON CORPORATION
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Miniature optical element for wireless bonding in an electronic ins...
- Publication number 20040147051
- Publication date Jul 29, 2004
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040113269
- Publication date Jun 17, 2004
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor, circuit boa...
- Publication number 20040092099
- Publication date May 13, 2004
- SEIKO EPSON CORPORATION
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same, stack-type se...
- Publication number 20020030245
- Publication date Mar 14, 2002
- SEIKO EPSON CORPORATION
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020025587
- Publication date Feb 28, 2002
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical element and method of manufacturing the same, and electroni...
- Publication number 20020019069
- Publication date Feb 14, 2002
- SEIKO EPSON CORPORATION
- Kenji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor, circuit boa...
- Publication number 20010027011
- Publication date Oct 4, 2001
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for manufacturing electronic component, and electronic appar...

Method for forming a layer, method for manufacturing an active matr...

Miniature optical element for wireless bonding in an electronic ins...

Multi-layered structure forming method, method of manufacturing wir...

Miniature optical element for wireless bonding in an electronic ins...

Miniature optical element for wireless bonding in an electronic ins...

Multi-layered structure forming method, method of manufacturing wir...

Semiconductor device, method of fabricating the same, stack-type se...

Miniature optical element for wireless bonding in an electronic ins...

Semiconductor device and method for manufacturing the same

Semiconductor device, method of fabricating the same, stack-type se...

Semiconductor device and manufacturing method therefor, circuit boa...

Semiconductor device, method of fabricating the same, stack-type se...

Miniature optical element for wireless bonding in an electronic ins...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing thereof, including a through...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC APPAR...

FILM MEMBER, FILM MOLDED PRODUCT, FILM MEMBER PRODUCING METHOD, AND...

Miniature optical element for wireless bonding in an electronic ins...

Miniature optical element for wireless bonding in an electronic ins...

Multi-layered structure forming method, method of manufacturing wir...

METHOD FOR FORMING A LAYER, METHOD FOR MANUFACTURING AN ACTIVE MATR...

MULTILAYERED STRUCTURE FORMING METHOD

Method of manufacturing multi-layered substrate

Miniature optical element for wireless bonding in an electronic ins...

Multi-layered structure forming method, method of manufacturing wir...

Method for providing a layer, wiring substrate, elector-optical dev...

Shield wire

Method for making layers and wiring board made thereby

Method for manufacturing circuit element, method for manufacturing...

Semiconductor device, method of fabricating the same, stack-type se...

Semiconductor device, method of fabricating the same, stack-type se...

Miniature optical element for wireless bonding in an electronic ins...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method therefor, circuit boa...

Semiconductor device, method of fabricating the same, stack-type se...

Semiconductor device and method for manufacturing the same

Optical element and method of manufacturing the same, and electroni...

Semiconductor device and manufacturing method therefor, circuit boa...