Kenneth B. Gilleo

Person

Cranston, RI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Releasable microcapsule and adhesive curing system using the same
- Patent number 6,936,644
- Issue date Aug 30, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Via interconnect forming process and electronic component product t...
- Patent number 6,838,372
- Issue date Jan 4, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer coating method for flip chips
- Patent number 6,323,062
- Issue date Nov 27, 2001
- Alpha Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip with integrated mask and underfill
- Patent number 6,228,678
- Issue date May 8, 2001
- Fry's Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip having integral mask and underfill providing two-stage bu...
- Patent number 6,228,681
- Issue date May 8, 2001
- Fry's Metals, Inc.
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip with integrated flux and underfill
- Patent number 6,194,788
- Issue date Feb 27, 2001
- Alpha Metals, Inc.
- Kenneth Burton Gilleo
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Wafer-level assembly method for semiconductor devices
- Publication number 20060012020
- Publication date Jan 19, 2006
- Kenneth B. Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical circuit assembly with improved shock resistance
- Publication number 20050056946
- Publication date Mar 17, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reconnectable chip interface and chip package
- Publication number 20050012191
- Publication date Jan 20, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reconnectable chip interface and chip package
- Publication number 20050012212
- Publication date Jan 20, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device assembly
- Publication number 20040163717
- Publication date Aug 26, 2004
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package for microchips
- Publication number 20040108588
- Publication date Jun 10, 2004
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Releasable microcapsule and adhesive curing system using the same
- Publication number 20040074089
- Publication date Apr 22, 2004
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Via interconnect forming process and electronic component product t...
- Publication number 20040056345
- Publication date Mar 25, 2004
- Kenneth B. Gilleo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip with integrated mask and underfill
- Publication number 20010017414
- Publication date Aug 30, 2001
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip with integrated flux and underfill
- Publication number 20010003058
- Publication date Jun 7, 2001
- Kenneth Burton Gilleo
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth B. Gilleo

Person

Patents Grantslast 30 patents

Releasable microcapsule and adhesive curing system using the same

Via interconnect forming process and electronic component product t...

Wafer coating method for flip chips

Flip chip with integrated mask and underfill

Flip chip having integral mask and underfill providing two-stage bu...

Flip chip with integrated flux and underfill

Patents Applicationslast 30 patents

Wafer-level assembly method for semiconductor devices

Electrical circuit assembly with improved shock resistance

Reconnectable chip interface and chip package

Reconnectable chip interface and chip package

MEMS device assembly

Package for microchips

Releasable microcapsule and adhesive curing system using the same

Via interconnect forming process and electronic component product t...

Flip chip with integrated mask and underfill

Flip chip with integrated flux and underfill