Kenneth C. Marston

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lid/heat spreader having targeted flexibility
- Patent number 11,430,710
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized weight heat spreader for an electronic package
- Patent number 11,410,905
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device package lid attach utilizing nano pa...
- Patent number 11,164,804
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,905,029
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,757,833
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,542,636
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink attachment on existing heat sinks
- Patent number 10,342,160
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Louis-Marie Achard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,172,258
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink attachment on existing heat sinks
- Patent number 9,883,612
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Louis-Marie Achard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic boards
- Patent number 9,721,870
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precast thermal interface adhesive for easy and repeated, separatio...
- Patent number 9,272,498
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Evan George Colgan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package structures having liquid cooler integrated wi...
- Patent number 8,772,927
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,421,217
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing loading and heat removal for hub module assembly
- Patent number 8,363,404
- Issue date Jan 29, 2013
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Precast thermal interface adhesive for easy and repeated, separatio...
- Patent number 8,268,389
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Evan G. Colgan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Enhanced thermal management for improved module reliability
- Patent number 8,214,658
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Jon A. Casey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,202,765
- Issue date Jun 19, 2012
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures having liquid coolers integrated w...
- Patent number 8,115,303
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmentation of a die stack for 3D packaging thermal management
- Patent number 7,928,562
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tracking thermal mini-cycle stress
- Patent number 7,917,328
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package method and structure with cure-melt hierarchy
- Patent number 7,834,442
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Bruce K Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for high-performance liquid cooling of multip...
- Patent number 7,808,781
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Evan George Colgan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexure plate for maintaining contact between a cooling plate/heat...
- Patent number 7,239,516
- Issue date Jul 3, 2007
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
- Publication number 20210233825
- Publication date Jul 29, 2021
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...
- Publication number 20210028079
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE
- Publication number 20200303279
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20200068744
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20190335617
- Publication date Oct 31, 2019
- International Business Machines Corporation
- Paul F. BODENWEBER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20180338390
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Paul F. BODENWEBER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
- Publication number 20180054915
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Louis-Marie Achard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20170196119
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Paul F. BODENWEBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
- Publication number 20160360645
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Louis-Marie Achard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20160165755
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...
- Publication number 20120276375
- Publication date Nov 1, 2012
- International Business Machines Corporation
- Evan George Colgan
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...
- Publication number 20120175766
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY
- Publication number 20120147563
- Publication date Jun 14, 2012
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package Structures Having Liquid Cooler Integrated wi...
- Publication number 20120049341
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...
- Publication number 20110171466
- Publication date Jul 14, 2011
- International Business Machines Corporation
- Evan George Colgan
- B32 - LAYERED PRODUCTS
Information Patent Application
System and Method of Achieving Mechanical and Thermal Stability in...
- Publication number 20100181665
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Thermal Management for Improved Module Reliability
- Publication number 20100049995
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tracking Thermal Mini-Cycle Stress
- Publication number 20100049466
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT
- Publication number 20100019377
- Publication date Jan 28, 2010
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Coolers Integrated w...
- Publication number 20090283902
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for High-Performance Liquid Cooling of Multip...
- Publication number 20090284921
- Publication date Nov 19, 2009
- Evan George Colgan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY
- Publication number 20090179322
- Publication date Jul 16, 2009
- International Business Machines Corporation
- BRUCE K FURMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS...
- Publication number 20080002363
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Levi A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexure plate for maintaining contact between a cooling plate/heat...
- Publication number 20060056156
- Publication date Mar 16, 2006
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth C. Marston

Person

Patents Grantslast 30 patents

Lid/heat spreader having targeted flexibility

Optimized weight heat spreader for an electronic package

Integrated circuit (IC) device package lid attach utilizing nano pa...

Cooling structure for electronic boards

Cooling structure for electronic boards

Cooling structure for electronic boards

Heat sink attachment on existing heat sinks

Cooling structure for electronic boards

Heat sink attachment on existing heat sinks

Cooling structure for electronic boards

Thermal hot spot cooling for semiconductor devices

Precast thermal interface adhesive for easy and repeated, separatio...

Semiconductor package structures having liquid cooler integrated wi...

Achieving mechanical and thermal stability in a multi-chip package

Implementing loading and heat removal for hub module assembly

Precast thermal interface adhesive for easy and repeated, separatio...

Enhanced thermal management for improved module reliability

Achieving mechanical and thermal stability in a multi-chip package

Semiconductor package structures having liquid coolers integrated w...

Segmentation of a die stack for 3D packaging thermal management

Tracking thermal mini-cycle stress

Electronic package method and structure with cure-melt hierarchy

Apparatus and methods for high-performance liquid cooling of multip...

Flexure plate for maintaining contact between a cooling plate/heat...

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

Patents Applicationslast 30 patents

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY

Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...

OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE

COOLING STRUCTURE FOR ELECTRONIC BOARDS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...

SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...

IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY

Semiconductor Package Structures Having Liquid Cooler Integrated wi...

PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...

System and Method of Achieving Mechanical and Thermal Stability in...

Enhanced Thermal Management for Improved Module Reliability

Tracking Thermal Mini-Cycle Stress

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

Semiconductor Package Structures Having Liquid Coolers Integrated w...

Apparatus and Methods for High-Performance Liquid Cooling of Multip...

ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY

DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS...

Flexure plate for maintaining contact between a cooling plate/heat...

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...