KENNETH D. BRENNAN

Person

BOISE, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to improve inductance with a high-permeability slotted plate...
- Patent number 7,969,274
- Issue date Jun 28, 2011
- Texas Instruments Incorporated
- Kenneth D. Brennan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to improve inductance with a high-permeability slotted plate...
- Patent number 7,436,281
- Issue date Oct 14, 2008
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferromagnetic capacitor
- Patent number 7,397,107
- Issue date Jul 8, 2008
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator metal (MIM) capacitor fabrication with sidewall spa...
- Patent number 7,250,334
- Issue date Jul 31, 2007
- Texas Instruments Incorporated
- Darius L. Crenshaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mask MIM capacitor and resistor with in trench copper drift...
- Patent number 7,189,615
- Issue date Mar 13, 2007
- Texas Instruments Incorporated
- Satyavolu Srinivas Papa Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a ferromagnetic inductor core and capacitor electrod...
- Patent number 7,118,925
- Issue date Oct 10, 2006
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for integrating a toroidal inductor in a semiconductor device
- Patent number 7,109,838
- Issue date Sep 19, 2006
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene pattern liner
- Patent number 6,984,580
- Issue date Jan 10, 2006
- Texas Instruments Incorporated
- William W. Dostalik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper transition layer for improving copper interconnection reliab...
- Patent number 6,951,812
- Issue date Oct 4, 2005
- Texas Instruments Incorporated
- Qing-Tang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned vias in dual damascene interconnect, buried mask approach
- Patent number 6,911,389
- Issue date Jun 28, 2005
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded planar capacitor
- Patent number 6,903,918
- Issue date Jun 7, 2005
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned vias in an integrated circuit structure
- Patent number 6,787,875
- Issue date Sep 7, 2004
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper transition layer for improving copper interconnection reliab...
- Patent number 6,693,356
- Issue date Feb 17, 2004
- Texas Instruments Incorporated
- Qing-Tang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum hardmask for dielectric etch
- Patent number 6,620,727
- Issue date Sep 16, 2003
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of low-k dielectric films to enable patterning of deep su...
- Patent number 6,605,536
- Issue date Aug 12, 2003
- Texas Instruments Incorporated
- Mona Eissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile system for integrated circuit containing shielded inductor
- Patent number 6,600,208
- Issue date Jul 29, 2003
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating interlevel connectors using only one photomas...
- Patent number 6,548,400
- Issue date Apr 15, 2003
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for intralevel capacitive isolation of interconnect paths
- Patent number 6,465,339
- Issue date Oct 15, 2002
- Texas Instruments Incorporated
- Keith Brankner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewalls for guiding the via etch
- Patent number 6,246,120
- Issue date Jun 12, 2001
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewalls for guiding the via etch
- Patent number 6,074,943
- Issue date Jun 13, 2000
- Texas Instruments Incorporated
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching copper or copper-doped aluminum
- Patent number 5,998,297
- Issue date Dec 7, 1999
- Texas Instruments Incorporated
- Kenneth D. Brennan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for air gap formation by plasma treatment of aluminum interc...
- Patent number 5,880,026
- Issue date Mar 9, 1999
- Texas Instruments Incorporated
- Guoqiang Xing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO IMPROVE INDUCTANCE WITH A HIGH-PERMEABILITY SLOTTED PLATE...
- Publication number 20090002115
- Publication date Jan 1, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single mask MIM capacitor and resistor with in trench copper drift...
- Publication number 20060160299
- Publication date Jul 20, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Satyavolu Srinivas Papa Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of a ferromagnetic inductor core and capacitor electrod...
- Publication number 20060134809
- Publication date Jun 22, 2006
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of a ferromagnetic inductor core and capacitor electrod...
- Publication number 20060128036
- Publication date Jun 15, 2006
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal insulator metal (MIM) capacitor fabrication with sidewall spa...
- Publication number 20060024899
- Publication date Feb 2, 2006
- Darius L. Crenshaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve inductance with a high-permeability slotted plate...
- Publication number 20060022787
- Publication date Feb 2, 2006
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene pattern liner
- Publication number 20040222529
- Publication date Nov 11, 2004
- William W. Dostalik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene pattern liner
- Publication number 20040222527
- Publication date Nov 11, 2004
- William W. Dostalik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper transition layer for improving copper interconnection reliab...
- Publication number 20040132282
- Publication date Jul 8, 2004
- Qing-Tang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self aligned vias in dual damascene interconnect, buried mask approach
- Publication number 20040053501
- Publication date Mar 18, 2004
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned vias in an integrated circuit structure
- Publication number 20040021196
- Publication date Feb 5, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene barrier structures and preferential etching method
- Publication number 20030190829
- Publication date Oct 9, 2003
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper transition layer for improving copper interconnection reliab...
- Publication number 20030186543
- Publication date Oct 2, 2003
- Qing-Tang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum hardmask for dielectric etch
- Publication number 20030040172
- Publication date Feb 27, 2003
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual hardmask process for the formation of copper/low-k interconnects
- Publication number 20030008490
- Publication date Jan 9, 2003
- Guoqiang Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating interlevel connectors using only one photomas...
- Publication number 20030001272
- Publication date Jan 2, 2003
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for sealing via sidewalls in porous low-k dielectric layers
- Publication number 20020177303
- Publication date Nov 28, 2002
- Qing-Tang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment of low-k dielectric films to enable patterning of deep su...
- Publication number 20020127876
- Publication date Sep 12, 2002
- Mona Eissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile system for integrated circuit containing shielded inductor
- Publication number 20020096736
- Publication date Jul 25, 2002
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment of low-k dielectric films to enable patterning of deep su...
- Publication number 20020064951
- Publication date May 30, 2002
- Mona M. Eissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for integrating a toroidal inductor in a semiconductor device
- Publication number 20020058355
- Publication date May 16, 2002
- Kenneth D. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR INTRALEVEL CAPACITIVE ISOLATION OF INTERCONNECT PATHS
- Publication number 20020048933
- Publication date Apr 25, 2002
- KEITH BRANKNER
- H01 - BASIC ELECTRIC ELEMENTS

KENNETH D. BRENNAN

Person

Patents Grantslast 30 patents

Method to improve inductance with a high-permeability slotted plate...

Method to improve inductance with a high-permeability slotted plate...

Ferromagnetic capacitor

Metal insulator metal (MIM) capacitor fabrication with sidewall spa...

Single mask MIM capacitor and resistor with in trench copper drift...

Fabrication of a ferromagnetic inductor core and capacitor electrod...

System for integrating a toroidal inductor in a semiconductor device

Dual damascene pattern liner

Copper transition layer for improving copper interconnection reliab...

Self aligned vias in dual damascene interconnect, buried mask approach

Shielded planar capacitor

Self-aligned vias in an integrated circuit structure

Copper transition layer for improving copper interconnection reliab...

Aluminum hardmask for dielectric etch

Treatment of low-k dielectric films to enable patterning of deep su...

Versatile system for integrated circuit containing shielded inductor

Method of fabricating interlevel connectors using only one photomas...

Technique for intralevel capacitive isolation of interconnect paths

Sidewalls for guiding the via etch

Sidewalls for guiding the via etch

Method of etching copper or copper-doped aluminum

Method for air gap formation by plasma treatment of aluminum interc...

Patents Applicationslast 30 patents

METHOD TO IMPROVE INDUCTANCE WITH A HIGH-PERMEABILITY SLOTTED PLATE...

Single mask MIM capacitor and resistor with in trench copper drift...

Fabrication of a ferromagnetic inductor core and capacitor electrod...

Fabrication of a ferromagnetic inductor core and capacitor electrod...

Metal insulator metal (MIM) capacitor fabrication with sidewall spa...

Method to improve inductance with a high-permeability slotted plate...

Dual damascene pattern liner

Dual damascene pattern liner

Copper transition layer for improving copper interconnection reliab...

Self aligned vias in dual damascene interconnect, buried mask approach

Self-aligned vias in an integrated circuit structure

Dual damascene barrier structures and preferential etching method

Copper transition layer for improving copper interconnection reliab...

Aluminum hardmask for dielectric etch

Dual hardmask process for the formation of copper/low-k interconnects

Method of fabricating interlevel connectors using only one photomas...

Method for sealing via sidewalls in porous low-k dielectric layers

Treatment of low-k dielectric films to enable patterning of deep su...

Versatile system for integrated circuit containing shielded inductor

Treatment of low-k dielectric films to enable patterning of deep su...

System for integrating a toroidal inductor in a semiconductor device

TECHNIQUE FOR INTRALEVEL CAPACITIVE ISOLATION OF INTERCONNECT PATHS