Kenneth D. Scholz

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Broad-area edge-emitting semiconductor laser with limited thermal c...
- Patent number 8,446,926
- Issue date May 21, 2013
- Coherent, Inc.
- David Schleuning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broad-area edge-emitting semiconductor laser with limited thermal c...
- Patent number 8,233,513
- Issue date Jul 31, 2012
- Coherent, Inc.
- David Schleuning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stable optical switch with reduced power consumption
- Patent number 6,718,085
- Issue date Apr 6, 2004
- Agilent Technologies, Inc.
- Kenneth D Scholz
- G02 - OPTICS
Information Patent Grant
Redistribution layer and under bump material structure for converti...
- Patent number 6,011,314
- Issue date Jan 4, 2000
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer fabrication in integrated circuit systems
- Patent number 5,399,528
- Issue date Mar 21, 1995
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressive bump-and-socket interconnection scheme for integrated c...
- Patent number 5,329,423
- Issue date Jul 12, 1994
- Kenneth D. Scholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab frame with area array edge contacts
- Patent number 5,262,925
- Issue date Nov 16, 1993
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming high density multi-chip carriers
- Patent number 5,200,300
- Issue date Apr 6, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,162,260
- Issue date Nov 10, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit demountable TAB apparatus
- Patent number 5,162,975
- Issue date Nov 10, 1992
- Hewlett-Packard Company
- Farid Matta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding system which facilitate repair
- Patent number 5,086,335
- Issue date Feb 4, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,055,425
- Issue date Oct 8, 1991
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power regulator with R.M.S. output voltage as function of unregulat...
- Patent number 3,946,302
- Issue date Mar 23, 1976
- Hewlett-Packard Company
- Albert W. Kovalick
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
BROAD-AREA EDGE-EMITTING SEMICONDUCTOR LASER WITH LIMITED THERMAL C...
- Publication number 20120263201
- Publication date Oct 18, 2012
- COHERENT, INC.
- David SCHLEUNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity and packaging designs for arrays of vertical cavity surface...
- Publication number 20070147458
- Publication date Jun 28, 2007
- Novalux, Inc.
- Jason P. Watson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABLE OPTICAL SWITCH WITH REDUCED POWER CONSUMPTION
- Publication number 20040067009
- Publication date Apr 8, 2004
- Kenneth D. Scholz
- G02 - OPTICS

Kenneth D. Scholz

Person

Patents Grantslast 30 patents

Broad-area edge-emitting semiconductor laser with limited thermal c...

Broad-area edge-emitting semiconductor laser with limited thermal c...

Stable optical switch with reduced power consumption

Redistribution layer and under bump material structure for converti...

Multi-layer fabrication in integrated circuit systems

Compressive bump-and-socket interconnection scheme for integrated c...

Tab frame with area array edge contacts

Methods for forming high density multi-chip carriers

Stacked solid via formation in integrated circuit systems

Integrated circuit demountable TAB apparatus

Tape automated bonding system which facilitate repair

Stacked solid via formation in integrated circuit systems

Power regulator with R.M.S. output voltage as function of unregulat...

Patents Applicationslast 30 patents

BROAD-AREA EDGE-EMITTING SEMICONDUCTOR LASER WITH LIMITED THERMAL C...

Cavity and packaging designs for arrays of vertical cavity surface...

STABLE OPTICAL SWITCH WITH REDUCED POWER CONSUMPTION