Kenneth John Kirsten

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Streamwood, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulant with fluxing properties and method of use in flip-chip...
- Patent number 7,041,771
- Issue date May 9, 2006
- KAC Holdings, Inc.
- Kenneth John Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulant with fluxing properties and method of use in flip-chip...
- Patent number 6,819,004
- Issue date Nov 16, 2004
- KAC Holdings, Inc.
- Kenneth John Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electrical connection using solder flux...
- Patent number 6,615,484
- Issue date Sep 9, 2003
- Litton Systems, Inc.
- Kenneth J. Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder flux compatible with flip-chip underfill material
- Patent number 6,367,150
- Issue date Apr 9, 2002
- Northrop Grumman Corporation
- Kenneth J. Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Encapsulant with fluxing properties and method of use in flip-chip...
- Publication number 20030176599
- Publication date Sep 18, 2003
- Kenneth John Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Encapsulant with fluxing properties and method of use in flip-chip...
- Publication number 20030175521
- Publication date Sep 18, 2003
- Kenneth John Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder flux compatible with flip-chip underfill material
- Publication number 20020095783
- Publication date Jul 25, 2002
- Kenneth J. Kirsten
- H01 - BASIC ELECTRIC ELEMENTS