Claims
- 1) A method for selecting the components of an encapsulant for forming an assembly having encapsulated electrical interconnections formed by solder at surface mount reflow profile conditions, wherein the encapsulant is comprised of a thermosetting resin, a cross-linking agent that also acts as a flux and optionally a cross-linking catalyst which selection method comprises:
a) identifying the melting point of the solder used to form said electrical interconnections; b) heating the encapsulant to a temperature exceeding the melting point of the solder; c) measuring the exothermic activity of the encapsulant during heating step b); d) identifying the temperature at which peak exothermic activity occurs; and e) selecting as an encapsulant that displays peak exothermic activity at or above the melting point of the solder.
- 2) The method of claim 1, wherein the encapsulant selected displays peak exothermic activity above the melting point of the solder.
- 3) The method of claim 1, wherein the initiation of exothermic activity is identified and the criteria for encapsulant selection also includes initiation of thermal reaction at a temperature that is no lower than 40° C. below the solder melt temperature.
- 4) The method of claim 2, wherein the initiation of exothermic activity is identified and the criteria for encapsulant selection also includes initiation of thermal reaction at a temperature that is no lower than 40° C. below the solder melt temperature.
Parent Case Info
[0001] This application is a continuation-in-part of application Ser. No. 08/514,049, filed Aug. 11, 1995, the disclosure of which is incorporated herein by reference thereto.
Divisions (1)
|
Number |
Date |
Country |
Parent |
08644912 |
May 1996 |
US |
Child |
10361671 |
Feb 2003 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08514049 |
Aug 1995 |
US |
Child |
08644912 |
May 1996 |
US |