Kensuke Nakamura

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Patents Grantslast 30 patents

Information Patent Grant
Electrodeposited copper foil with carrier foil with a primer resin...
- Patent number 8,304,091
- Issue date Nov 6, 2012
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for manufacturing dielectric layer constituting material, di...
- Patent number 8,205,329
- Issue date Jun 26, 2012
- Mitsuimining & Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board and multil...
- Patent number 8,062,539
- Issue date Nov 22, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed wiring board and manufacturing method thereof
- Patent number 7,485,361
- Issue date Feb 3, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing Dielectric Layer Constituting Material, Di...
- Publication number 20080289865
- Publication date Nov 27, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Multilayer Printed Wiring Board and Multil...
- Publication number 20080257480
- Publication date Oct 23, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...
- Publication number 20080107865
- Publication date May 8, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multilayered printed wiring board and manufacturing method thereof
- Publication number 20070102804
- Publication date May 10, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR