Kent Rossman

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Staggered in-situ deposition and etching of a dielectric layer for...
- Patent number 7,455,893
- Issue date Nov 25, 2008
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing the intrinsic stress of high density plasma films
- Patent number 7,294,205
- Issue date Nov 13, 2007
- Applied Materials, Inc.
- K. V. Ravi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multistep remote plasma clean process
- Patent number 7,159,597
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staggered in-situ deposition and etching of a dielectric layer for...
- Patent number 7,132,134
- Issue date Nov 7, 2006
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Si seasoning to reduce particles, extend clean frequency, block mob...
- Patent number 6,846,742
- Issue date Jan 25, 2005
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning a semiconductor processing chamber
- Patent number 6,843,858
- Issue date Jan 18, 2005
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staggered in-situ deposition and etching of a dielectric layer for...
- Patent number 6,821,577
- Issue date Nov 23, 2004
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ wafer heat for reduced backside contamination
- Patent number 6,704,913
- Issue date Mar 9, 2004
- Applied Materials Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for using an in situ particle sensor for monitoring particle...
- Patent number 6,696,362
- Issue date Feb 24, 2004
- Applied Materials Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Si seasoning to reduce particles, extend clean frequency, block mob...
- Patent number 6,589,868
- Issue date Jul 8, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of amorphous silicon films by high density plasma HDP-CV...
- Patent number 6,559,052
- Issue date May 6, 2003
- Applied Materials, Inc.
- Zhuang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench fill with HDP-CVD process including coupled high power densi...
- Patent number 6,559,026
- Issue date May 6, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staggered in-situ deposition and etching of a dielectric layer for...
- Patent number 6,527,910
- Issue date Mar 4, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density plasma chemical vapor deposition (HDP-CVD) processing...
- Patent number 6,524,969
- Issue date Feb 25, 2003
- Applied Materials, Inc.
- Zhuang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ wafer heat for reduced backside contamination
- Patent number 6,514,870
- Issue date Feb 4, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled method of silicon-rich oxide deposition using HDP-CVD
- Patent number 6,458,722
- Issue date Oct 1, 2002
- Applied Materials, Inc.
- Bikram Kapoor
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for deposition of a conformal layer on a substrate
- Patent number 6,194,038
- Issue date Feb 27, 2001
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduction of mobile ion and metal contamination in HDP-CVD chambers...
- Patent number 6,121,161
- Issue date Sep 19, 2000
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Orientless wafer processing on an electrostatic chuck
- Patent number 6,077,357
- Issue date Jun 20, 2000
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing the intrinsic stress of high density plasma films
- Patent number 5,976,993
- Issue date Nov 2, 1999
- Applied Materials, Inc.
- K. V. Ravi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduction in mobile ion and metal contamination by varying season t...
- Patent number 5,811,356
- Issue date Sep 22, 1998
- Applied Materials, Inc.
- Laxman Murugesh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shield for an electrostatic chuck
- Patent number 5,748,434
- Issue date May 5, 1998
- Applied Materials, Inc.
- Kent Rossman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Staggered in-situ deposition and etching of a dielectric layer for...
- Publication number 20070071908
- Publication date Mar 29, 2007
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Staggered in-situ deposition and etching of a dielectric layer for...
- Publication number 20050032382
- Publication date Feb 10, 2005
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Si seasoning to reduce particles, extend clean frequency, block mob...
- Publication number 20030211735
- Publication date Nov 13, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of cleaning a semiconductor processing chamber
- Publication number 20030183244
- Publication date Oct 2, 2003
- Applied Materials, Inc.
- Kent Rossman
- B08 - CLEANING
Information Patent Application
In situ wafer heat for reduced backside contamination
- Publication number 20030070619
- Publication date Apr 17, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multistep remote plasma clean process
- Publication number 20030029475
- Publication date Feb 13, 2003
- APPLIED MATERIALS, INC., A Delaware corporation
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Staggered in-situ deposition and etching of a dielectric layer for...
- Publication number 20030003244
- Publication date Jan 2, 2003
- Applied Materials, Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for using an in situ particle sensor for monitoring particle...
- Publication number 20020163637
- Publication date Nov 7, 2002
- Applied Materials Inc.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Si seasoning to reduce particles, extend clean frequency, block mob...
- Publication number 20020146512
- Publication date Oct 10, 2002
- APPLIED MATERIALS, INC.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In situ wafer heat for reduced backside contamination
- Publication number 20020102864
- Publication date Aug 1, 2002
- APPLIED MATERIALS, INC.
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High density plasma chemical vapor deposition (HDP-CVD) processing...
- Publication number 20020076939
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- Zhuang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deposition of amorphous silicon films by high density plasma HDP-CV...
- Publication number 20020037635
- Publication date Mar 28, 2002
- Zhuang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Staggered in-situ deposition and etching of a dielectric layer for...
- Publication number 20010015344
- Publication date Aug 23, 2001
- Kent Rossman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kent Rossman

Person

Patents Grantslast 30 patents

Staggered in-situ deposition and etching of a dielectric layer for...

Method for reducing the intrinsic stress of high density plasma films

Multistep remote plasma clean process

Staggered in-situ deposition and etching of a dielectric layer for...

Si seasoning to reduce particles, extend clean frequency, block mob...

Method of cleaning a semiconductor processing chamber

Staggered in-situ deposition and etching of a dielectric layer for...

In situ wafer heat for reduced backside contamination

Method for using an in situ particle sensor for monitoring particle...

Si seasoning to reduce particles, extend clean frequency, block mob...

Deposition of amorphous silicon films by high density plasma HDP-CV...

Trench fill with HDP-CVD process including coupled high power densi...

Staggered in-situ deposition and etching of a dielectric layer for...

High density plasma chemical vapor deposition (HDP-CVD) processing...

In situ wafer heat for reduced backside contamination

Controlled method of silicon-rich oxide deposition using HDP-CVD

Method for deposition of a conformal layer on a substrate

Reduction of mobile ion and metal contamination in HDP-CVD chambers...

Orientless wafer processing on an electrostatic chuck

Method for reducing the intrinsic stress of high density plasma films

Reduction in mobile ion and metal contamination by varying season t...

Shield for an electrostatic chuck

Patents Applicationslast 30 patents

Staggered in-situ deposition and etching of a dielectric layer for...

Staggered in-situ deposition and etching of a dielectric layer for...

Si seasoning to reduce particles, extend clean frequency, block mob...

Method of cleaning a semiconductor processing chamber

In situ wafer heat for reduced backside contamination

Multistep remote plasma clean process

Staggered in-situ deposition and etching of a dielectric layer for...

Method for using an in situ particle sensor for monitoring particle...

Si seasoning to reduce particles, extend clean frequency, block mob...

In situ wafer heat for reduced backside contamination

High density plasma chemical vapor deposition (HDP-CVD) processing...

Deposition of amorphous silicon films by high density plasma HDP-CV...

Staggered in-situ deposition and etching of a dielectric layer for...