Kentaro Kaneko

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame and semiconductor device
- Patent number 11,756,866
- Issue date Sep 12, 2023
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of leads having a two stage recess
- Patent number 11,616,005
- Issue date Mar 28, 2023
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with multi-layer resin structure and semiconductor device...
- Patent number 10,943,857
- Issue date Mar 9, 2021
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and electronic component device
- Patent number 10,818,579
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing lead frame
- Patent number 10,381,292
- Issue date Aug 13, 2019
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 10,276,478
- Issue date Apr 30, 2019
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 10,201,917
- Issue date Feb 12, 2019
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 10,117,336
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board
- Patent number 9,699,912
- Issue date Jul 4, 2017
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,538,664
- Issue date Jan 3, 2017
- Shinko Electric Industries Co., Ltd.
- Hiroharu Yanagisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,433,109
- Issue date Aug 30, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 9,313,904
- Issue date Apr 12, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,258,899
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,253,897
- Issue date Feb 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrates
- Patent number 9,236,334
- Issue date Jan 12, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,210,808
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,137,896
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,006,103
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate including projecting part having electrode pad for...
- Patent number 8,810,040
- Issue date Aug 19, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,797,757
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor apparatus and method of manufacturing them
- Patent number 8,779,602
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,760,883
- Issue date Jun 24, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
Information Patent Grant
Wiring board and method of producing the same
- Patent number 8,754,336
- Issue date Jun 17, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, and semiconductor d...
- Patent number 8,749,073
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,610,287
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor apparatus and method of manufacturing them
- Patent number 8,502,398
- Issue date Aug 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF LEAD...
- Publication number 20220077028
- Publication date Mar 10, 2022
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LEA...
- Publication number 20210249340
- Publication date Aug 12, 2021
- Shinko Electric Industries Co., Ltd.
- Koji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT DEVICE
- Publication number 20190115288
- Publication date Apr 18, 2019
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR ELEMENTS AND SEMICONDUCTOR DEVICE
- Publication number 20190088578
- Publication date Mar 21, 2019
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20190074242
- Publication date Mar 7, 2019
- Shinko Electric Industries Co., Ltd.
- Koji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20180236696
- Publication date Aug 23, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LEAD FRAME
- Publication number 20180240739
- Publication date Aug 23, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...
- Publication number 20170162520
- Publication date Jun 8, 2017
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20160316560
- Publication date Oct 27, 2016
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160044792
- Publication date Feb 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20150289380
- Publication date Oct 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014020
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Board and Method of Manufacturing Wiring Board
- Publication number 20150008020
- Publication date Jan 8, 2015
- Shinko Electric Industries Co., LTD.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20150009645
- Publication date Jan 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140182920
- Publication date Jul 3, 2014
- Hiroharu YANAGISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140097009
- Publication date Apr 10, 2014
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140087556
- Publication date Mar 27, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140076614
- Publication date Mar 20, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEM...
- Publication number 20130140692
- Publication date Jun 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND S...
- Publication number 20130143062
- Publication date Jun 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WIRING BOARD
- Publication number 20130097856
- Publication date Apr 25, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075145
- Publication date Mar 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...
- Publication number 20120256320
- Publication date Oct 11, 2012
- SHINKO ELECTRIC ELECTRIC INDUSTRIES CO., LTD.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATES
- Publication number 20120222894
- Publication date Sep 6, 2012
- Shinko Electric Industries Co., LTD.
- KENTARO KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120175153
- Publication date Jul 12, 2012
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20120175157
- Publication date Jul 12, 2012
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kentaro Kaneko

Person

Patents Grantslast 30 patents

Lead frame and semiconductor device

Plurality of leads having a two stage recess

Substrate with multi-layer resin structure and semiconductor device...

Lead frame and electronic component device

Lead frame and method of manufacturing lead frame

Lead frame

Lead frame

Method of manufacturing a wiring substrate

Wiring board

Wiring substrate

Wiring substrate and semiconductor package

Method of fabricating a wiring board

Wiring board and method of manufacturing wiring board

Method of fabricating a wiring board

Wiring substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring substrate and method for manufacturing wiring substrates

Wiring substrate and method of manufacturing the same

Wiring substrate

Method of fabricating a wiring board

Method of manufacturing a wiring board having pads highly resistant...

Method of manufacturing wiring substrate

Wiring substrate including projecting part having electrode pad for...

Wiring substrate and manufacturing method thereof

Wiring board, semiconductor apparatus and method of manufacturing them

Wiring substrate and manufacturing method thereof

Wiring board and method of producing the same

Wiring board, method of manufacturing the same, and semiconductor d...

Wiring substrate and method of manufacturing the same

Wiring board, semiconductor apparatus and method of manufacturing them

Patents Applicationslast 30 patents

LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF LEAD...

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LEA...

LEAD FRAME AND ELECTRONIC COMPONENT DEVICE

SUBSTRATE FOR SEMICONDUCTOR ELEMENTS AND SEMICONDUCTOR DEVICE

LEAD FRAME AND METHOD OF MANUFACTURING LEAD FRAME

LEAD FRAME

LEAD FRAME

LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...

WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF FABRICATING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Wiring Board and Method of Manufacturing Wiring Board

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEM...

METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND S...

WIRING BOARD AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING A WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURI...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATES

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD OF PRODUCING THE SAME