Kenzo Fujii

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin structure in which manufacturing cost is cheap and sufficient...
- Patent number 6,564,448
- Issue date May 20, 2003
- NEC Corporation
- Kikuo Oura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 6,523,256
- Issue date Feb 25, 2003
- NEC Corporation
- Kikuo Oura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate, multi-layered wiring substrate and method of fabr...
- Patent number 6,492,597
- Issue date Dec 10, 2002
- NEC Corporation
- Kenzo Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin structure in which manufacturing cost is cheap and sufficient...
- Patent number 6,449,835
- Issue date Sep 17, 2002
- NEC Corporation
- Kikuo Oura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin structure in which manufacturing cost is cheap and sufficient...
- Patent number 6,286,207
- Issue date Sep 11, 2001
- NEC Corporation
- Kikuo Oura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Flexible wiring substrate interposed between semiconductor element...
- Publication number 20030006489
- Publication date Jan 9, 2003
- Kenzo Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, multi-layered wiring substrate and method of fabr...
- Publication number 20010002625
- Publication date Jun 7, 2001
- NEC Corporation
- Kenzo Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR