Keshav B. Prasad

Person

New Paltz, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film wiring scheme utilizing inter-chip site surface wiring
- Patent number 6,444,919
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,916,451
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Eric Daniel Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,757,079
- Issue date May 26, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,747,095
- Issue date May 5, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,464,682
- Issue date Nov 7, 1995
- International Business Machines Corporation
- Eric D. Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chip redistribution interposer
- Patent number 5,455,387
- Issue date Oct 3, 1995
- Olin Corporation
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film wiring layout for a non-planar thin-film structure
- Patent number 5,378,927
- Issue date Jan 3, 1995
- International Business Machines Corporation
- Michael F. McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective plating method for forming integral via and wiring layers
- Patent number 5,209,817
- Issue date May 11, 1993
- International Business Machines Corporation
- Umar M. Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Keshav B. Prasad

Person

Patents Grantslast 30 patents

Thin film wiring scheme utilizing inter-chip site surface wiring

Minimal capture pads applied to ceramic vias in ceramic substrates

Method for repairing defective electrical connections on multi-laye...

Method for repairing defective electrical connections on multi-laye...

Minimal capture pads applied to ceramic vias in ceramic substrates

Semiconductor package with chip redistribution interposer

Thin-film wiring layout for a non-planar thin-film structure

Selective plating method for forming integral via and wiring layers