Kesvakumar V.C. Muniandy

Person

Klang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded die ball grid array package
- Patent number 9,299,675
- Issue date Mar 29, 2016
- Freescale Semiconductor,INC
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed via array for integrated circuit package
- Patent number 9,064,718
- Issue date Jun 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die ball grid array package
- Patent number 9,034,694
- Issue date May 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die
- Patent number 8,980,696
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dominic Koey Poh Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffened semiconductor die package
- Patent number 8,945,989
- Issue date Feb 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making surface mount stacked semiconductor devices
- Patent number 8,853,058
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor device with solder ball reinforcement f...
- Patent number 8,836,098
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Norazham Mohd Sukemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistributed contacts
- Patent number 8,810,020
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffened semiconductor die package
- Patent number 8,772,913
- Issue date Jul 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked die package using redistributed chip pack...
- Patent number 8,669,140
- Issue date Mar 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
- Publication number 20160056094
- Publication date Feb 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE BALL GRID ARRAY PACKAGE
- Publication number 20150243621
- Publication date Aug 27, 2015
- NAVAS KHAN ORATTI KALANDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BASED SEMICONDUCTOR DEVICE WITH POWER BARS
- Publication number 20150206769
- Publication date Jul 23, 2015
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS
- Publication number 20150187728
- Publication date Jul 2, 2015
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DIE GRID ARRAY PACKAGE
- Publication number 20150115420
- Publication date Apr 30, 2015
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140302641
- Publication date Oct 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...
- Publication number 20140231977
- Publication date Aug 21, 2014
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES
- Publication number 20130344656
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V.C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
- Publication number 20130341796
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIE
- Publication number 20130113091
- Publication date May 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Dominic Koey Poh Meng
- H01 - BASIC ELECTRIC ELEMENTS

Kesvakumar V.C. Muniandy

Person

Patents Grantslast 30 patents

Embedded die ball grid array package

Pre-formed via array for integrated circuit package

Embedded die ball grid array package

Method of packaging semiconductor die

Stiffened semiconductor die package

Method of making surface mount stacked semiconductor devices

Surface mount semiconductor device with solder ball reinforcement f...

Semiconductor device with redistributed contacts

Stiffened semiconductor die package

Method of forming stacked die package using redistributed chip pack...

Patents Applicationslast 30 patents

BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES

EMBEDDED DIE BALL GRID ARRAY PACKAGE

LEAD FRAME BASED SEMICONDUCTOR DEVICE WITH POWER BARS

EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS

SENSOR DIE GRID ARRAY PACKAGE

STIFFENED SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...

METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

METHOD OF PACKAGING SEMICONDUCTOR DIE