Keung Jin Sohn

Person

Suwon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with reinforced thermoplastic resin layer
- Patent number 8,450,618
- Issue date May 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Keung-Jin Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 8,415,200
- Issue date Apr 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing an insulating sheet, a copper clad laminate, and a pr...
- Patent number 8,397,378
- Issue date Mar 19, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Keung-Jin Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate, fabrication method thereof, printed circuit boar...
- Patent number 8,344,261
- Issue date Jan 1, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Suk Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier for manufacturing a printed circuit board
- Patent number 8,156,635
- Issue date Apr 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min Cho
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND P...
- Publication number 20160237303
- Publication date Aug 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Geum-Hee YUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MEASURING COEFFICIENT OF THERMAL EXPANSION AND THERMAL M...
- Publication number 20160139068
- Publication date May 19, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Youn Gyu Han
- G01 - MEASURING TESTING
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...
- Publication number 20150114693
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE...
- Publication number 20150107760
- Publication date Apr 23, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE...
- Publication number 20150041206
- Publication date Feb 12, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Joung Gul Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20140060899
- Publication date Mar 6, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hwan Park
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...
- Publication number 20140027156
- Publication date Jan 30, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Hwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130119540
- Publication date May 16, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Kuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USI...
- Publication number 20130062112
- Publication date Mar 14, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Suk Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120152753
- Publication date Jun 21, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120103671
- Publication date May 3, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Suek LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20120088334
- Publication date Apr 12, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20120030938
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120018195
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120012379
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...
- Publication number 20110315745
- Publication date Dec 29, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Min CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with reinforced thermoplastic resin layer
- Publication number 20110315437
- Publication date Dec 29, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Keung-Jin Sohn
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SU...
- Publication number 20110180205
- Publication date Jul 28, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Min CHO
- B32 - LAYERED PRODUCTS
Information Patent Application
Carrier substrate, fabrication method thereof, printed circuit boar...
- Publication number 20110155429
- Publication date Jun 30, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Suk Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...
- Publication number 20110138621
- Publication date Jun 16, 2011
- Seong Min CHO
- B32 - LAYERED PRODUCTS
Information Patent Application
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...
- Publication number 20110139858
- Publication date Jun 16, 2011
- Seong Min Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF MANUF...
- Publication number 20110138615
- Publication date Jun 16, 2011
- Keung Jin Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal core package substrate and method for manufacturing the same
- Publication number 20090288293
- Publication date Nov 26, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Sang Youp Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing an insulating sheet, a copper clad laminate, and a pr...
- Publication number 20090255714
- Publication date Oct 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Keung-Jin Sohn
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20090250253
- Publication date Oct 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Keung Jin Sohn

Person

Patents Grantslast 30 patents

Printed circuit board with reinforced thermoplastic resin layer

Method for manufacturing semiconductor package

Manufacturing an insulating sheet, a copper clad laminate, and a pr...

Carrier substrate, fabrication method thereof, printed circuit boar...

Carrier for manufacturing a printed circuit board

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND P...

METHOD FOR MEASURING COEFFICIENT OF THERMAL EXPANSION AND THERMAL M...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...

CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE...

LAMINATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE...

PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USI...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Method of manufacturing printed circuit board

Printed circuit board

Printed circuit board

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...

Printed circuit board with reinforced thermoplastic resin layer

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SU...

Carrier substrate, fabrication method thereof, printed circuit boar...

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...

CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUB...

CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF MANUF...

Metal core package substrate and method for manufacturing the same

Manufacturing an insulating sheet, a copper clad laminate, and a pr...

Printed circuit board and manufacturing method thereof