Patent Application
20110138615
This application claims the benefit of Korean Patent Application No. 10-2009-0125592, filed Dec. 16, 2009, entitled “A carrier for manufacturing a printed circuit board and a method of manufacturing the same and a method of manufacturing a printed circuit board using the same”, which is hereby incorporated by reference in its entirety into this application.
1. Technical Field
The present invention relates to a carrier for manufacturing a printed circuit board, a method of manufacturing the same and a method of manufacturing a printed circuit board using the same.
2. Description of the Related Art
Generally, printed circuit boards (PCBs) are manufactured by patterning one or both sides of a substrate, composed of various thermosetting resins, using copper foil, and disposing and fixing ICs or electronic parts on the substrate to form an electric circuit and then coating the substrate with an insulator.
Recently, with the advancement of the electronics industry, electronic parts are increasingly required to be highly functionalized, light, thin, short and small. Thus, printed circuit boards loaded with such electronic parts are also required to be highly densified and thin.
In particular, in order to keep up with the thinning of printed circuit boards, a coreless substrate which can decrease thickness by removing a core and can shorten a signal processing time is attracting considerable attention. However, a coreless substrate needs a carrier serving as a support during a process because it does not have a core.
First, as shown in
Subsequently, as shown in
Subsequently, as shown in
Subsequently, as shown in
Subsequently, as shown in
However, the conventional method of manufacturing a printed circuit board using a carrier is problematic in that both ends of a printed circuit board are removed by a to routing process, thus decreasing the size of a printed circuit board.
Further, the conventional method of manufacturing a printed circuit board using a carrier is problematic in that process cost and process time are increased because a vacuum method is used in order to strengthen the conjunction of the carrier 10 or a release layer is additionally formed in order to easily separate the build up layers 15 from the carrier 10.
Accordingly, the present invention has been made to solve the above-mentioned problems, and the present invention provides a carrier for manufacturing a printed circuit board, by which the size of a printed circuit board is maintained even when the carrier is separated from the printed circuit board, a method of manufacturing the carrier, and a method of manufacturing a printed circuit board using the carrier.
Further, the present invention provides a carrier for manufacturing a printed circuit board, by which process cost and process time can be decreased by simplifying the structure of the carrier without using a vacuum method or inserting a release layer, a method of manufacturing the carrier, and a method of manufacturing a printed circuit board using the carrier.
An aspect of the present invention is to provide a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet.
Here, the magnetic sheet may contain glass fiber.
Further, the magnetic sheet may contain magnetic fillers having magnetic properties.
Further, the metal layer may be made of nickel (Ni), cobalt (Co), chromium (Cr), iron (Fe), or manganese (Mn).
Further, the magnetic sheet may include a sheet, and a magnetic metal layer formed on at least one side of the sheet.
Another aspect of the present invention provides a method of manufacturing a carrier for manufacturing a printed circuit board, including: providing a magnetic sheet; and attaching a metal layer to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet.
Here, in the providing of the magnetic sheet, the magnetic sheet may contain glass fiber.
Further, in the providing of the magnetic sheet, the magnetic sheet may contain magnetic fillers having magnetic properties.
Further, in the attaching of the metal layer, the metal layer may be made of nickel (Ni), cobalt (Co), chromium (Cr), iron (Fe), or manganese (Mn).
Further, the providing of the magnetic sheet may include: providing a sheet; and forming a magnetic metal layer having magnetic properties on at least one side of the sheet.
Still another aspect of the present invention provides a method of manufacturing a printed circuit board using a carrier, including: attaching a metal layer to at least one side of a magnetic sheet by the magnetic properties of the magnetic sheet to provide a carrier; sequentially forming a first protective layer, a build up layer and a second protective layer on the metal layer; and separating the metal layer from the magnetic sheet and then removing the metal layer.
Here, in the providing of the carrier, the metal layer may be made of nickel (Ni), cobalt (Co), chromium (Cr), iron (Fe), or manganese (Mn).
Further, in the providing of the carrier, the magnetic sheet may contain glass fiber.
Further, in the providing of the carrier, the magnetic sheet may contain magnetic fillers having magnetic properties.
Further, the providing of the carrier may include: forming a magnetic metal layer having magnetic properties on at least one side of a sheet to provide a magnetic sheet; and attaching a metal layer to the magnetic metal layer by the magnetic properties of the magnetic metal layer.
Further, the separating the metal layer from the magnetic sheet may include: separating the metal layer from the magnetic sheet; removing the metal layer by etching; and forming openings for exposing pads of outermost circuit layers of the build up layer in the exposed first protective layer and second protective layer.
Still another aspect of the present invention provides a method of manufacturing a printed circuit board using a carrier, including: attaching a metal layer to at least one side of a magnetic sheet by the magnetic properties of the magnetic sheet to provide a carrier; sequentially forming a circuit layer and a build up layer on the metal layer; and separating the metal layer from the magnetic sheet and then removing the metal layer.
Here, the separating of the metal layer from the magnetic sheet may include: separating the metal layer from the magnetic sheet; removing the metal layer by etching; forming protective layers on both sides of the exposed build up layer; and forming openings for exposing pads of the circuit layer and outermost circuit layers of the build up layer in the protective layers.
Further, the circuit layer may be made of a metal different from the metal layer.
Various objects, advantages and features of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings.
The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe the best method he or she knows for carrying out the invention.
The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
The objects, features and advantages of the present invention will be more clearly understood from the following detailed description and preferred embodiments taken in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. Further, in the following description, the terms “first”, “second” and the like are used to differentiate a certain component from other components, but the configuration of such components should not be construed to be limited by the terms. Further, in the description of the present invention, when it is determined that the detailed description of the related art would obscure the gist of the present invention, the description thereof will be omitted.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.
A Carrier for Manufacturing a Printed Circuit Board
As shown in
The magnetic sheet 101a, on one side or both sides of which the metal layers 104 are formed, includes a sheet 102 and magnetic fillers 103a.
Here, the sheet 102, which serves to support a printed circuit board at the time of manufacturing the printed circuit board, is required to have high strength. For example, the strength of the sheet 102 can be increased by the addition of glass fiber. Further, the sheet may be made of a non-insulating material, such as a metal, or an insulating material, such as an epoxy resin.
The magnetic fillers 103a are particles having magnetic properties, and the magnetic layers 104 are attached to the magnetic sheet 101a by the magnetic properties of the magnetic fillers 103a. The magnetic fillers 103 may be metal fillers such as nickel, iron or the like or may be ferrite fillers such as Ni—Cu—Zn ferrite, An—Zn ferrite or the like. Meanwhile, although it is shown in
The metal layers 104 are attached to one side or both sides of the magnetic sheet 101a.
Here, the metal layers 104 may be made of a material attaching to magnetic materials, such as nickel, cobalt, chromium, iron, manganese or the like. Meanwhile, the metal layers 104 may be made of a high-strength material because they constitute the carrier 100a together with the magnetic sheet 101a.
Further, although it is shown in
As shown in
The magnetic metal layer 103b is formed on at least one side of the sheet 102, and is made of a magnetic material.
Here, the magnetic metal layer 103b may be made of a magnetic metal, such as nickel, cobalt, iron or an alloy thereof. Further, the magnetic metal layer 103b is not limited to metals, and may be a polymer magnet or an electromagnet.
Meanwhile, the metal layers 104 are attached to the magnetic metal layers 103b by the magnetic properties of the magnetic metal layers 103b.
A Method of Manufacturing a Carrier for Manufacturing a Printed Circuit Board
First, as shown in
In this case, the magnetic sheet 101a may include a sheet 102 containing a reinforcing material, such as glass fiber, and magnetic fillers 103a. For example, when the sheet 102 is made of an insulating material such as an epoxy resin, the sheet 102 can be formed into the magnetic sheet 101a having excellent magnetic properties and high strength by impregnating glass fiber and magnetic fillers 103 into the sheet 102 and then curing the insulating material. Further, the magnetic fillers 103a may also be applied on the sheet 102 by a spray method.
Subsequently, as shown in
In this case, the metal layers 104 can be attached to the magnetic sheet 101a by the magnetic properties of the magnetic sheet 101a. Meanwhile, the metal layers 104 and the magnetic sheet 101 a may be attached to each other to such a degree that foreign materials, such as an etchant and the like, do not infiltrate therebetween.
Through the above processes, the carrier 100a, shown in
First, as shown in
In this case, the magnetic metal layers 103b may be formed on the sheet 102 by metal adhesion or sputtering.
Subsequently, as shown in
In this case, the metal layers 104 can be attached to the magnetic metal layers 103b by the magnetic properties of the magnetic metal layers 103b of the magnetic sheet 101b.
Through the above processes, the carrier 100b, shown in
A Method of Manufacturing a Printed Circuit Board Using a Carrier
It is described in this embodiment that printed circuit boards 200a are formed on both sides of a carrier 100a, but, in the present invention, a printed circuit board 200a may be formed on one side of a carrier 100a. Further, it is described in this embodiment that the carrier 100a according to the first embodiment is used, but, in the present invention, the carrier 100b according to the second embodiment may be used.
First, as shown in
In this case, when a printed circuit board 200a is formed on only one side of the carrier 100a, the metal layer 104 may be attached to only one side of the magnetic sheet 101a.
Subsequently, as shown in
Specifically, a first protective layer 105 is formed on each of the metal layers 104 of the carrier 100a. Here, the first protective layer 105, which serves to protect the outermost circuit layer of a build up layer 16, may be formed of dry film type solder resist or liquid solder resist.
Then, a build up layer 106 is formed on the first protective layer 105. In
Then, a second protective layer 107 may be formed on the build up layer 16. In this case, the second protective layer 107 may be made of the same material as the first protective layer 105.
Subsequently, as shown in
In this case, since the metal layer 104 and the magnetic sheet 101a are attached to each other by their magnetic properties, they can be relatively easily separated from each other. Further, since an additional routing process is not required, the size of a printed circuit board can be maintained.
Subsequently, as shown in
In this case, the metal layer 104 may be removed by an etching process. Further, it is preferable to prevent a build up circuit layer of the build up layer 16 from being unexpectedly etched by making the metal layer 140 using a metal different from the build up circuit layer.
Subsequently, as shown in
In this case, pads 109 of the outermost circuit layer of the build up layer 106 can be exposed through the openings 18. Further, the openings may be formed by laser drilling or machine drilling
Through the above processes, the printed circuit board 200a, shown in
Meanwhile, it is described in this embodiment that the carrier 100b according to the second embodiment is used, but, in the present invention, the carrier 100a according to the first embodiment may be used.
First, as shown in
In this case, when a printed circuit board 200b is formed on only one side of the carrier 100b, the magnetic metal layer 103b and the metal layer 104 may be sequentially formed on only one side of the sheet 102.
Subsequently, as shown in
In this case, the circuit layer 106a, which becomes an outermost circuit layer of the build up layer 106 later, may be formed using a subtractive process, an additive process, a semi-additive process, a modified semi-additive process or the like. Further, the circuit layer 106a may be made of an electroconductive metal, such as gold, silver, copper, nickel or the like, and may be made of a metal different from the metal layer 104 which is to be removed later.
Subsequently, as shown in
In this case, when the magnetic metal layer 103b is formed of an electromagnet, the attractive force between the magnetic metal layer 103b and the metal layer 104 can be removed by blocking the electric current flowing through the electromagnet.
Through the above processes, the printed circuit board 200b, shown in
As described above, according to the present invention, a carrier includes a magnetic sheet and metal layers attached to the magnetic sheet by magnetic properties, so that an additional cutting process is not required when a printed circuit board is separated from the carrier, thereby maintaining the size of a printed circuit board.
Further, according to the present invention, the structure of a carrier can be simplified by using the magnetic properties of a magnetic sheet, thus reducing process cost and process time.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Simple modifications, additions and substitutions of the present invention belong to the scope of the present invention, and the specific scope of the present invention will be clearly defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2009-0125592 | Dec 2009 | KR | national |
