Kevin Byrd

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference (EMI) shield
- Patent number 10,701,796
- Issue date Jun 30, 2020
- Intel Corporation
- Tin Poay Chuah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielding in electronic assemblies
- Patent number 10,548,249
- Issue date Jan 28, 2020
- Intel Corporation
- Scott Mokler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using materials to increase structural rigidity, decrease size, imp...
- Patent number 10,305,529
- Issue date May 28, 2019
- Intel Corporation
- David Pidwerbecki
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
- Publication number 20220181289
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING IN ELECTRONIC ASSEMBLIES
- Publication number 20190098802
- Publication date Mar 28, 2019
- Intel Corporation
- Scott Mokler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD
- Publication number 20190045621
- Publication date Feb 7, 2019
- Intel Corporation
- Tin Poay Chuah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMP...
- Publication number 20160269067
- Publication date Sep 15, 2016
- David Pidwerbecki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...
- Publication number 20120224331
- Publication date Sep 6, 2012
- Weston Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low profile solder grid array technology for printed circuit board...
- Publication number 20090310320
- Publication date Dec 17, 2009
- Weston Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface Mount Components Joined Between a Package Substrate and a P...
- Publication number 20090051004
- Publication date Feb 26, 2009
- Weston C. Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Electromagnetic interference (EMI) shield

Shielding in electronic assemblies

Using materials to increase structural rigidity, decrease size, imp...

Patents Applicationslast 30 patents

THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...

SHIELDING IN ELECTRONIC ASSEMBLIES

ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD

USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMP...

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...

Low profile solder grid array technology for printed circuit board...

Surface Mount Components Joined Between a Package Substrate and a P...