Kevin C. Rolston

Person

Westchester, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module for motherboard
- Patent number 11,195,779
- Issue date Dec 7, 2021
- Raytheon Company
- Michael Benjamin Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tile for an active electronically scanned array (AESA)
- Patent number 10,541,461
- Issue date Jan 21, 2020
- Ratheon Company
- Mary A. Teshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer microwave corrugated printed circuit board and method
- Patent number 9,491,854
- Issue date Nov 8, 2016
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating a three dimensional molded feed structure
- Patent number 9,072,164
- Issue date Jun 30, 2015
- Raytheon Company
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming channels in a flexible circuit substrate using...
- Patent number 8,453,314
- Issue date Jun 4, 2013
- Raytheon Company
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive reinforced open hole interconnect
- Patent number 8,354,595
- Issue date Jan 15, 2013
- Raytheon Company
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating an origami formed antenna radiating structure
- Patent number 8,127,432
- Issue date Mar 6, 2012
- Raytheon Company
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and method of attaching a chip to a circuit...
- Patent number 7,298,235
- Issue date Nov 20, 2007
- Raytheon Company
- Mark S. Hauhe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE FOR MOTHERBOARD
- Publication number 20210043542
- Publication date Feb 11, 2021
- Raytheon Company
- Michael Benjamin Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TILE FOR AN ACTIVE ELECTRONICALLY SCANNED ARRAY (AESA)
- Publication number 20180175476
- Publication date Jun 21, 2018
- Raytheon Company
- Mary A. Teshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20130319732
- Publication date Dec 5, 2013
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
- Publication number 20120137505
- Publication date Jun 7, 2012
- Raytheon Company
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE REINFORCED OPEN HOLE INTERCONNECT
- Publication number 20110261539
- Publication date Oct 27, 2011
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING A THREE DIMENSIONAL MOLDED FEED STRUCTURE
- Publication number 20110113619
- Publication date May 19, 2011
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
- Publication number 20110113618
- Publication date May 19, 2011
- Alberto F. Viscarra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20110024160
- Publication date Feb 3, 2011
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board assembly and method of attaching a chip to a circuit...
- Publication number 20050151215
- Publication date Jul 14, 2005
- Mark S. Hauhe
- H01 - BASIC ELECTRIC ELEMENTS

Kevin C. Rolston

Person

Patents Grantslast 30 patents

Electronic module for motherboard

Tile for an active electronically scanned array (AESA)

Multi-layer microwave corrugated printed circuit board and method

Process for fabricating a three dimensional molded feed structure

Process for forming channels in a flexible circuit substrate using...

Adhesive reinforced open hole interconnect

Process for fabricating an origami formed antenna radiating structure

Circuit board assembly and method of attaching a chip to a circuit...

Patents Applicationslast 30 patents

ELECTRONIC MODULE FOR MOTHERBOARD

TILE FOR AN ACTIVE ELECTRONICALLY SCANNED ARRAY (AESA)

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE

ADHESIVE REINFORCED OPEN HOLE INTERCONNECT

PROCESS FOR FABRICATING A THREE DIMENSIONAL MOLDED FEED STRUCTURE

PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

Circuit board assembly and method of attaching a chip to a circuit...