Kevin Durocher

Person

Schnectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasound transducer array architecture and method of manufacture
- Patent number 12,109,591
- Issue date Oct 8, 2024
- GE Precision Healthcare LLC
- Kevin Mathew Durocher
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and systems for a flexible circuit
- Patent number 10,499,509
- Issue date Dec 3, 2019
- General Electric Company
- Kevin Matthew Durocher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 10,068,840
- Issue date Sep 4, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,679,837
- Issue date Jun 13, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,570,376
- Issue date Feb 14, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,299,647
- Issue date Mar 29, 2016
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an interconnect device
- Patent number 8,904,631
- Issue date Dec 9, 2014
- General Electric Company
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including mask for controlling flow of solder
- Patent number 8,853,550
- Issue date Oct 7, 2014
- General Electric Company
- Arun Virupaksha Gowda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System of chip package build-up
- Patent number 8,829,690
- Issue date Sep 9, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detector modules for imaging systems and methods of manufacturing
- Patent number 8,824,635
- Issue date Sep 2, 2014
- General Electric Company
- John Eric Tkaczyk
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Component protection for advanced packaging applications
- Patent number 8,742,558
- Issue date Jun 3, 2014
- General Electric Company
- Paul Alan McConnelee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ultrasound acoustic assemblies and methods of manufacture
- Patent number 8,742,646
- Issue date Jun 3, 2014
- General Electric Company
- Robert Gideon Wodnicki
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 8,653,670
- Issue date Feb 18, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip package build-up
- Patent number 8,623,699
- Issue date Jan 7, 2014
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 8,498,131
- Issue date Jul 30, 2013
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interface for a sensor array
- Patent number 8,492,762
- Issue date Jul 23, 2013
- General Electric Company
- James Wilson Rose
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power semiconductor module and fabrication method
- Patent number 8,466,007
- Issue date Jun 18, 2013
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article including thermal interface element and method of preparation
- Patent number 8,405,996
- Issue date Mar 26, 2013
- General Electric Company
- David Mulford Shaddock
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hermetically sealed fiber sensing cable
- Patent number 8,369,671
- Issue date Feb 5, 2013
- General Electric Company
- Hua Xia
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for reducing scattered X-ray detection and method of same
- Patent number 8,331,536
- Issue date Dec 11, 2012
- General Electric Company
- Jeffrey Jon Shaw
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Anti-scatter X-ray grid device and method of making same
- Patent number 8,265,228
- Issue date Sep 11, 2012
- General Electric Company
- Jeffrey Jon Shaw
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
System and method for pre-patterned embedded chip build-up
- Patent number 8,114,708
- Issue date Feb 14, 2012
- General Electric Company
- Paul McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and fabrication method
- Patent number 8,049,338
- Issue date Nov 1, 2011
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for stacked die embedded chip build-up
- Patent number 8,008,125
- Issue date Aug 30, 2011
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for reducing pitch in an integrated circuit
- Patent number 8,008,781
- Issue date Aug 30, 2011
- General Electric Company
- Raymond Albert Fillion
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic chip package with reduced contact pad pitch
- Patent number 7,964,974
- Issue date Jun 21, 2011
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and apparatus for venting electronic packages and method of...
- Patent number 7,956,457
- Issue date Jun 7, 2011
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Affordable high performance high frequency multichip module fabrica...
- Patent number 7,952,196
- Issue date May 31, 2011
- Lockheed Martin Corporation
- Joseph Alfred Iannotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a wafer scale package
- Patent number 7,952,187
- Issue date May 31, 2011
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and a method for controlling flow of solder
- Patent number 7,919,714
- Issue date Apr 5, 2011
- General Electric Company
- Arun Virupaksha Gowda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR AN INVASIVE DEPLOYABLE DEVICE
- Publication number 20220313206
- Publication date Oct 6, 2022
- GE Precision Healthcare LLC
- Edouard Da Cruz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHODS AND SYSTEMS FOR AN INVASIVE DEPLOYABLE DEVICE
- Publication number 20220313205
- Publication date Oct 6, 2022
- GE Precision Healthcare LLC
- Edouard Da Cruz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Ultrasound Transducer Array Architecture And Method of Manufacture
- Publication number 20210069749
- Publication date Mar 11, 2021
- GE Precision Healthcare LLC
- Kevin Mathew Durocher
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20170278782
- Publication date Sep 28, 2017
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20160211208
- Publication date Jul 21, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20150171036
- Publication date Jun 18, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20140159213
- Publication date Jun 12, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20140110866
- Publication date Apr 24, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20130257224
- Publication date Oct 3, 2013
- GENERAL ELECTRIC COMPANY
- Robert Gideon Wodnicki
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
DETECTOR MODULES FOR IMAGING SYSTEMS AND METHODS OF MANUFACTURING
- Publication number 20130108019
- Publication date May 2, 2013
- GENERAL ELECTRIC COMPANY
- John Eric Tkaczyk
- G01 - MEASURING TESTING
Information Patent Application
ANODE-ILLUMINATED RADIATION DETECTOR
- Publication number 20130049151
- Publication date Feb 28, 2013
- GENERAL ELECTRIC COMPANY
- Vladimir A. Lobastov
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20120261165
- Publication date Oct 18, 2012
- GENERAL ELECTRIC COMPANY
- Kevin Matthew Durocher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20120018857
- Publication date Jan 26, 2012
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD
- Publication number 20120009733
- Publication date Jan 12, 2012
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20110316167
- Publication date Dec 29, 2011
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-SCATTER X-RAY GRID DEVICE AND METHOD OF MAKING SAME
- Publication number 20110317819
- Publication date Dec 29, 2011
- GENERAL ELECTRIC COMPANY
- Jeffrey Jon Shaw
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
Interconnect structure
- Publication number 20110299821
- Publication date Dec 8, 2011
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED FIBER SENSING CABLE
- Publication number 20110211795
- Publication date Sep 1, 2011
- GENERAL ELECTRIC COMPANY
- Hua Xia
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER
- Publication number 20110139495
- Publication date Jun 16, 2011
- GENERAL ELECTRIC COMPANY
- ARUN VIRUPAKSHA GOWDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR REDUCING SCATTERED X-RAY DETECTION AND METHOD OF SAME
- Publication number 20110069816
- Publication date Mar 24, 2011
- Jeffrey Jon Shaw
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ARTICLE INCLUDING THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION
- Publication number 20100328896
- Publication date Dec 30, 2010
- GENERAL ELECTRIC COMPANY
- David Mulford Shaddock
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP
- Publication number 20100224992
- Publication date Sep 9, 2010
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT
- Publication number 20100132994
- Publication date Jun 3, 2010
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF...
- Publication number 20100133683
- Publication date Jun 3, 2010
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT
- Publication number 20100133705
- Publication date Jun 3, 2010
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PRE-PATTERNED EMBEDDED CHIP BUILD-UP
- Publication number 20100078797
- Publication date Apr 1, 2010
- Paul McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA THIN DIE ELECTRONIC PACKAGE
- Publication number 20090309241
- Publication date Dec 17, 2009
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component protection for advanced packaging applications
- Publication number 20090291296
- Publication date Nov 26, 2009
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE
- Publication number 20090243081
- Publication date Oct 1, 2009
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
- Publication number 20090148967
- Publication date Jun 11, 2009
- GENERAL ELECTRIC COMPANY
- Robert Gideon Wodnicki
- H01 - BASIC ELECTRIC ELEMENTS

Kevin Durocher

Person

Patents Grantslast 30 patents

Ultrasound transducer array architecture and method of manufacture

Methods and systems for a flexible circuit

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect for an integrated circuit package and metho...

Method of fabricating an interconnect device

Circuit board including mask for controlling flow of solder

System of chip package build-up

Detector modules for imaging systems and methods of manufacturing

Component protection for advanced packaging applications

Ultrasound acoustic assemblies and methods of manufacture

Electrical interconnect for an integrated circuit package and metho...

Method of chip package build-up

Interconnect structure

Electrical interface for a sensor array

Power semiconductor module and fabrication method

Article including thermal interface element and method of preparation

Hermetically sealed fiber sensing cable

Apparatus for reducing scattered X-ray detection and method of same

Anti-scatter X-ray grid device and method of making same

System and method for pre-patterned embedded chip build-up

Power semiconductor module and fabrication method

System and method for stacked die embedded chip build-up

Apparatus and method for reducing pitch in an integrated circuit

Electronic chip package with reduced contact pad pitch

System and apparatus for venting electronic packages and method of...

Affordable high performance high frequency multichip module fabrica...

System and method of forming a wafer scale package

System and a method for controlling flow of solder

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR AN INVASIVE DEPLOYABLE DEVICE

METHODS AND SYSTEMS FOR AN INVASIVE DEPLOYABLE DEVICE

Ultrasound Transducer Array Architecture And Method of Manufacture

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE

DETECTOR MODULES FOR IMAGING SYSTEMS AND METHODS OF MANUFACTURING

ANODE-ILLUMINATED RADIATION DETECTOR

INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ANTI-SCATTER X-RAY GRID DEVICE AND METHOD OF MAKING SAME

Interconnect structure

HERMETICALLY SEALED FIBER SENSING CABLE

CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER

APPARATUS FOR REDUCING SCATTERED X-RAY DETECTION AND METHOD OF SAME

ARTICLE INCLUDING THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION

SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP

APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT

SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF...

APPARATUS AND METHOD FOR REDUCING PITCH IN AN INTEGRATED CIRCUIT

SYSTEM AND METHOD FOR PRE-PATTERNED EMBEDDED CHIP BUILD-UP

ULTRA THIN DIE ELECTRONIC PACKAGE

Component protection for advanced packaging applications

SYSTEM AND METHOD OF FORMING A WAFER SCALE PACKAGE

METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY