Kevin J. Hess

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 9,331,046
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for reducing inductance in through-die vias of an electr...
- Patent number 9,099,475
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for reducing heat exposure of thermally sens...
- Patent number 9,093,429
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices
- Patent number 9,082,757
- Issue date Jul 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die with continuous conductive vias
- Patent number 9,076,664
- Issue date Jul 7, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit using wire bonds
- Patent number 8,912,667
- Issue date Dec 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices
- Patent number 8,796,822
- Issue date Aug 5, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 8,791,582
- Issue date Jul 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for reducing heat exposure of thermally sens...
- Patent number 8,680,674
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,501,539
- Issue date Aug 6, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fused buss for plating features on a semiconductor die
- Patent number 8,368,172
- Issue date Feb 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fused buss for plating features on a semiconductor die
- Patent number 8,349,666
- Issue date Jan 8, 2013
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a filler material
- Patent number 8,318,549
- Issue date Nov 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency interconnect pad structure
- Patent number 8,274,146
- Issue date Sep 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Michael A. Stockinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 8,105,933
- Issue date Jan 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for chip level power distribution
- Patent number 7,829,997
- Issue date Nov 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device having crack arrest feature and method of forming
- Patent number 7,821,104
- Issue date Oct 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap layer for an aluminum copper bond pad
- Patent number 7,656,045
- Issue date Feb 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing structural support for interconn...
- Patent number 7,626,276
- Issue date Dec 1, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with enhanced thermal dissipation
- Patent number 7,572,680
- Issue date Aug 11, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die edge reconditioning
- Patent number 7,374,971
- Issue date May 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with enhanced thermal dissipation
- Patent number 7,355,289
- Issue date Apr 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having structural support for a flip-chip interc...
- Patent number 7,247,552
- Issue date Jul 24, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing structural support for interconn...
- Patent number 7,241,636
- Issue date Jul 10, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe street structure for backend interconnect semiconductor wafe...
- Patent number 7,129,566
- Issue date Oct 31, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die having a copper contact and method therefor
- Patent number 6,933,614
- Issue date Aug 23, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 6,921,979
- Issue date Jul 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dyeable polyolefin containing polyetheramine modified functionalize...
- Patent number 6,420,482
- Issue date Jul 16, 2002
- Huntsman Petrochemical Corporation
- Richard Joseph Gilbert Dominguez
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dyeable polyolefin containing polyetheramine modified functionalize...
- Patent number 6,127,480
- Issue date Oct 3, 2000
- Huntsman Petrochemical Corporation
- Richard Joseph Gilbert Dominguez
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Voltage Variable and Electrical Overstress Protection Materials for...
- Publication number 20200248017
- Publication date Aug 6, 2020
- tri/REX, LLC
- Kevin J. Hess
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Modified Epoxy Resin Compositions for Additive Manufacturing
- Publication number 20200032085
- Publication date Jan 30, 2020
- tri/REX, LLC
- Kevin J. Hess
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20150115463
- Publication date Apr 30, 2015
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20140308779
- Publication date Oct 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...
- Publication number 20140071652
- Publication date Mar 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. MCSHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...
- Publication number 20140001641
- Publication date Jan 2, 2014
- Michael B. Mcshane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...
- Publication number 20130320480
- Publication date Dec 5, 2013
- Michael B. Mcshane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS
- Publication number 20130193589
- Publication date Aug 1, 2013
- ROBERT J. WENZEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20130088255
- Publication date Apr 11, 2013
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20130087926
- Publication date Apr 11, 2013
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE
- Publication number 20130020674
- Publication date Jan 24, 2013
- GEORGE R. LEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE
- Publication number 20130023091
- Publication date Jan 24, 2013
- GEORGE R. LEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20120025401
- Publication date Feb 2, 2012
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20110108965
- Publication date May 12, 2011
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING A FILLER MATERIAL
- Publication number 20110101517
- Publication date May 5, 2011
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING
- Publication number 20100052106
- Publication date Mar 4, 2010
- Chu-Chung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY INTERCONNECT PAD STRUCTURE
- Publication number 20090294970
- Publication date Dec 3, 2009
- Michael A. Stockinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel interconnect for chip level power distribution
- Publication number 20080246165
- Publication date Oct 9, 2008
- Freescale Semiconductor, Inc.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20080179745
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION
- Publication number 20080136016
- Publication date Jun 12, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING STRUCTURAL SUPPORT FOR INTERCONN...
- Publication number 20070210442
- Publication date Sep 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cap layer for an aluminum copper bond pad
- Publication number 20070194460
- Publication date Aug 23, 2007
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit with enhanced thermal dissipation
- Publication number 20070023880
- Publication date Feb 1, 2007
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die edge reconditioning
- Publication number 20060237850
- Publication date Oct 26, 2006
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing structural support for interconn...
- Publication number 20060154469
- Publication date Jul 13, 2006
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having structural support for a flip-chip interc...
- Publication number 20060154470
- Publication date Jul 13, 2006
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe pad arrangement for an integrated circuit and method of forming
- Publication number 20060022353
- Publication date Feb 2, 2006
- Sergio A. Ajuria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scribe street structure for backend interconnect semiconductor wafe...
- Publication number 20060001144
- Publication date Jan 5, 2006
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die having a copper contact and method therefor
- Publication number 20040195696
- Publication date Oct 7, 2004
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Kevin J. Hess

Person

Patents Grantslast 30 patents

Integrated circuit package with voltage distributor

Localized alloying for improved bond reliability

Techniques for reducing inductance in through-die vias of an electr...

Methods and structures for reducing heat exposure of thermally sens...

Stacked semiconductor devices

Stacked semiconductor die with continuous conductive vias

Packaged integrated circuit using wire bonds

Stacked semiconductor devices

Integrated circuit package with voltage distributor

Methods and structures for reducing heat exposure of thermally sens...

Semiconductor device package

Fused buss for plating features on a semiconductor die

Fused buss for plating features on a semiconductor die

Molded semiconductor package having a filler material

High frequency interconnect pad structure

Localized alloying for improved bond reliability

Interconnect for chip level power distribution

Package device having crack arrest feature and method of forming

Cap layer for an aluminum copper bond pad

Method and apparatus for providing structural support for interconn...

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor die edge reconditioning

Packaged integrated circuit with enhanced thermal dissipation

Integrated circuit having structural support for a flip-chip interc...

Method and apparatus for providing structural support for interconn...

Scribe street structure for backend interconnect semiconductor wafe...

Integrated circuit die having a copper contact and method therefor

Semiconductor device having a bond pad and method therefor

Dyeable polyolefin containing polyetheramine modified functionalize...

Dyeable polyolefin containing polyetheramine modified functionalize...

Patents Applicationslast 30 patents

Voltage Variable and Electrical Overstress Protection Materials for...

Modified Epoxy Resin Compositions for Additive Manufacturing

STACKED SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...

METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...

METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...

PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS

STACKED SEMICONDUCTOR DEVICES

STACKED SEMICONDUCTOR DEVICES

FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE

FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

SEMICONDUCTOR DEVICE PACKAGE

MOLDED SEMICONDUCTOR PACKAGE HAVING A FILLER MATERIAL

PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING

HIGH FREQUENCY INTERCONNECT PAD STRUCTURE

Novel interconnect for chip level power distribution

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION

METHOD AND APPARATUS FOR PROVIDING STRUCTURAL SUPPORT FOR INTERCONN...

Cap layer for an aluminum copper bond pad

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor die edge reconditioning

Method and apparatus for providing structural support for interconn...

Integrated circuit having structural support for a flip-chip interc...

Probe pad arrangement for an integrated circuit and method of forming

Scribe street structure for backend interconnect semiconductor wafe...

Integrated circuit die having a copper contact and method therefor