Kevin LIN

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 12,218,052
- Issue date Feb 4, 2025
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor/core assemblies for integrated circuits
- Patent number 12,156,473
- Issue date Nov 26, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer crystalline back gated thin film transistor
- Patent number 12,119,409
- Issue date Oct 15, 2024
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxycarbide resists as leave behind plugs
- Patent number 12,107,044
- Issue date Oct 1, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height and multi-width interconnect line metallization for in...
- Patent number 12,002,754
- Issue date Jun 4, 2024
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,990,403
- Issue date May 21, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,953,826
- Issue date Apr 9, 2024
- Intel Corporation
- James M. Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grating replication using helmets and topographically-selective dep...
- Patent number 11,894,270
- Issue date Feb 6, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with metal chalcogenide channel materials
- Patent number 11,888,034
- Issue date Jan 30, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with line breaks and line bridges within a sing...
- Patent number 11,830,768
- Issue date Nov 28, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,784,121
- Issue date Oct 10, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including air gapping of gate spacers and other dielectrics...
- Patent number 11,769,814
- Issue date Sep 26, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer crystalline back gated thin film transistor
- Patent number 11,764,306
- Issue date Sep 19, 2023
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-Nitride devices on SOI substrates having a compliant layer
- Patent number 11,715,791
- Issue date Aug 1, 2023
- Intel Corporation
- Marko Radosavljevic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal and spacer patterning for pitch division with multiple line w...
- Patent number 11,710,636
- Issue date Jul 25, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core fill to reduce dishing and metal pillar fill to increase metal...
- Patent number 11,705,395
- Issue date Jul 18, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable vias for back end of line interconnects
- Patent number 11,670,588
- Issue date Jun 6, 2023
- Intel Corporation
- Christopher Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered lines for interconnect performance improvement and proces...
- Patent number 11,664,305
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) structure supporting high voltage appli...
- Patent number 11,664,270
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helmet structures for semiconductor interconnects
- Patent number 11,646,266
- Issue date May 9, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic memory device with ruthenium diffusion barrier
- Patent number 11,626,451
- Issue date Apr 11, 2023
- Intel Corporation
- Emily Walker
- G11 - INFORMATION STORAGE
Information Patent Grant
Peripheral inductors
- Patent number 11,616,014
- Issue date Mar 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...
- Publication number 20240304549
- Publication date Sep 12, 2024
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...
- Publication number 20240243052
- Publication date Jul 18, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS TO ENABLE INLINE CIRCUIT EDIT
- Publication number 20230369211
- Publication date Nov 16, 2023
- Intel Corporation
- Clifford J. ENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT
- Publication number 20230369206
- Publication date Nov 16, 2023
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE CIRCUIT EDIT
- Publication number 20230369207
- Publication date Nov 16, 2023
- Intel Corporation
- Clifford J. ENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CRYSTALLINE BACK GATED THIN FILM TRANSISTOR
- Publication number 20230352598
- Publication date Nov 2, 2023
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS
- Publication number 20230230919
- Publication date Jul 20, 2023
- Intel Corporation
- Nafees A. Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THERMOELECTRIC DEVICE TO MITIGATE INTEGRATED CIRCUIT HOT...
- Publication number 20230091603
- Publication date Mar 23, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...
- Publication number 20220238376
- Publication date Jul 28, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
- Publication number 20220216149
- Publication date Jul 7, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...
- Publication number 20220199516
- Publication date Jun 23, 2022
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEXTILE PATTERNING FOR SUBTRACTIVELY-PATTERNED SELF-ALIGNED INTERCO...
- Publication number 20220157619
- Publication date May 19, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
- Publication number 20220148917
- Publication date May 12, 2022
- Intel Corporation
- Carl NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY
- Publication number 20220130719
- Publication date Apr 28, 2022
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...
- Publication number 20220102268
- Publication date Mar 31, 2022
- Intel Corporation
- Urusa Alaan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES
- Publication number 20220093505
- Publication date Mar 24, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH LINE BREAKS AND LINE BRIDGES WITHIN A SING...
- Publication number 20220076995
- Publication date Mar 10, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...
- Publication number 20220051896
- Publication date Feb 17, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CRYSTALLINE BACK GATED THIN FILM TRANSISTOR
- Publication number 20210408299
- Publication date Dec 30, 2021
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...
- Publication number 20210407907
- Publication date Dec 30, 2021
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR...
- Publication number 20210407895
- Publication date Dec 30, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20210397084
- Publication date Dec 23, 2021
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS
- Publication number 20210351105
- Publication date Nov 11, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) STRUCTURE SUPPORTING HIGH VOLTAGE APPLI...
- Publication number 20210225696
- Publication date Jul 22, 2021
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...
- Publication number 20210225698
- Publication date Jul 22, 2021
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Advanced lithography and self-assembled devices

Integrated circuits and methods for forming thin film crystal layers

Selective metal removal for conductive interconnects in integrated...

Inductor/core assemblies for integrated circuits

Multi-layer crystalline back gated thin film transistor

Metal oxycarbide resists as leave behind plugs

Subtractively patterned interconnect structures for integrated circ...

Multi-height and multi-width interconnect line metallization for in...

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Lined photobucket structure for back end of line (BEOL) interconnec...

Differential hardmasks for modulation of electrobucket sensitivity

Vertically spaced intra-level interconnect line metallization for i...

Grating replication using helmets and topographically-selective dep...

Transistors with metal chalcogenide channel materials

Advanced lithography and self-assembled devices

Integrated circuits with line breaks and line bridges within a sing...

Integrated circuits and methods for forming integrated circuits

Capacitance reduction for semiconductor devices based on wafer bonding

Integrated circuit components with dummy structures

Device including air gapping of gate spacers and other dielectrics...

Multi-layer crystalline back gated thin film transistor

Group III-Nitride devices on SOI substrates having a compliant layer

Metal and spacer patterning for pitch division with multiple line w...

Core fill to reduce dishing and metal pillar fill to increase metal...

Selectable vias for back end of line interconnects

Staggered lines for interconnect performance improvement and proces...

Metal-insulator-metal (MIM) structure supporting high voltage appli...

Helmet structures for semiconductor interconnects

Magnetic memory device with ruthenium diffusion barrier

Peripheral inductors

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

DESIGNS TO ENABLE INLINE CIRCUIT EDIT

EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT

INLINE CIRCUIT EDIT

MULTI-LAYER CRYSTALLINE BACK GATED THIN FILM TRANSISTOR

METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS

INTEGRATED THERMOELECTRIC DEVICE TO MITIGATE INTEGRATED CIRCUIT HOT...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

GRATING REPLICATION USING HELMETS AND TOPOGRAPHICALLY-SELECTIVE DEP...

INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES

METAL LINES PATTERNED BY BOTTOM-UP FILL METALLIZATION FOR ADVANCED...

TEXTILE PATTERNING FOR SUBTRACTIVELY-PATTERNED SELF-ALIGNED INTERCO...

Integrated Circuits and Methods for Forming Thin Film Crystal Layers

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY

DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...

VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES

INTEGRATED CIRCUITS WITH LINE BREAKS AND LINE BRIDGES WITHIN A SING...

SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...

MULTI-LAYER CRYSTALLINE BACK GATED THIN FILM TRANSISTOR

MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR...

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS

METAL-INSULATOR-METAL (MIM) STRUCTURE SUPPORTING HIGH VOLTAGE APPLI...

DIELECTRIC HELMET-BASED APPROACHES FOR BACK END OF LINE (BEOL) INTE...