Kevin P. Grundy

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Modular antenna system
- Patent number 9,647,318
- Issue date May 9, 2017
- EchoStar Technologies LLC
- Kevin P. Grundy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface IC packaging structures
- Patent number 8,598,696
- Issue date Dec 3, 2013
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile discrete electronic components and applications of same
- Patent number 8,324,727
- Issue date Dec 4, 2012
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector having a housing with a conductor with a ramp section and...
- Patent number 8,313,333
- Issue date Nov 20, 2012
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory chain
- Patent number 8,244,993
- Issue date Aug 14, 2012
- Samsung Electronics Co., Ltd.
- Kevin P. Grundy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
ESD protection utilizing radiated thermal relief
- Patent number 8,199,450
- Issue date Jun 12, 2012
- Samsung Electronics Co., Ltd.
- Kevin P. Grundy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with conductors with a ramp to induce torsion
- Patent number 8,079,848
- Issue date Dec 20, 2011
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, direct path, stair-step, electronic connectors with imp...
- Patent number 8,047,855
- Issue date Nov 1, 2011
- Samsung Electronics Co., Ltd.
- Gary Yasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled impedance structures for high density interconnections
- Patent number 8,026,600
- Issue date Sep 27, 2011
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- G01 - MEASURING TESTING
Information Patent Grant
Tapered dielectric and conductor structures and applications thereof
- Patent number 7,973,391
- Issue date Jul 5, 2011
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory systems including memory devices coupled together in a daisy...
- Patent number 7,966,443
- Issue date Jun 21, 2011
- Samsung Electronics Co., Ltd.
- Kevin P. Grundy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-surface IC packaging structures and methods for their manufac...
- Patent number 7,919,355
- Issue date Apr 5, 2011
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Torsionally-induced contact-force conductors for electrical connect...
- Patent number 7,909,615
- Issue date Mar 22, 2011
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Torsionally-induced contact-force conductors for electrical connect...
- Patent number 7,845,986
- Issue date Dec 7, 2010
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection devices incorporating Fedundant contact...
- Patent number 7,837,477
- Issue date Nov 23, 2010
- Samsung Electronics Co., Ltd.
- Gary Yasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package structures having separate circuit interconnection struc...
- Patent number 7,750,446
- Issue date Jul 6, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface IC packaging structures and methods for their manufac...
- Patent number 7,737,545
- Issue date Jun 15, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface contact IC packaging structures and assemblies
- Patent number 7,732,904
- Issue date Jun 8, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile discrete electronic components and applications of same
- Patent number 7,701,323
- Issue date Apr 20, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect system without through-holes
- Patent number 7,652,381
- Issue date Jan 26, 2010
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection devices incorporating redundant contact...
- Patent number 7,651,382
- Issue date Jan 26, 2010
- Interconnect Portfolio LLC
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed, direct path, stair-step, electronic connectors with imp...
- Patent number 7,651,336
- Issue date Jan 26, 2010
- Interconnect Portfolio LLC
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal-segregating connector system
- Patent number 7,613,011
- Issue date Nov 3, 2009
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection devices incorporating redundant contact...
- Patent number 7,404,746
- Issue date Jul 29, 2008
- Interconnect Portfolio, LLC
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tapered dielectric and conductor structures and applications thereof
- Patent number 7,388,279
- Issue date Jun 17, 2008
- Interconnect Portfolio, LLC
- Joseph C. Fjelstad
- G01 - MEASURING TESTING
Information Patent Grant
Active connector
- Patent number 7,347,697
- Issue date Mar 25, 2008
- Novias, Inc.
- Kevin P. Grundy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC packaging interposer having controlled impedance or optical inte...
- Patent number 7,310,239
- Issue date Dec 18, 2007
- Silicon Pipe, Inc.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory chain
- Patent number 7,308,524
- Issue date Dec 11, 2007
- Silicon Pipe, Inc.
- Kevin P. Grundy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stair step printed circuit board structures for high speed signal t...
- Patent number 7,280,372
- Issue date Oct 9, 2007
- Silicon Pipe
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Partitioned integrated circuit package with central clock driver
- Patent number 7,279,783
- Issue date Oct 9, 2007
- Silicon Pipe, Inc.
- Joseph C Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING DYNAMIC RANGE COMPRESSION IMAGE P...
- Publication number 20170193638
- Publication date Jul 6, 2017
- Kevin Patrick GRUNDY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR OPTIMIZING DYNAMIC RANGE COMPRESSION IMAGE PR...
- Publication number 20160111063
- Publication date Apr 21, 2016
- Trusight, Inc.
- Kevin P. Grundy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SYSTEM AND METHOD FOR OPTIMIZING INTENSITY LEVELS FOR VIDEO ENCODING
- Publication number 20160112708
- Publication date Apr 21, 2016
- Trusight, Inc.
- Kevin P. Grundy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MODULAR ANTENNA SYSTEM
- Publication number 20130321232
- Publication date Dec 5, 2013
- DISH DIGITAL L.L.C.
- Kevin P. Grundy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECT...
- Publication number 20130078826
- Publication date Mar 28, 2013
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Torsionally-Induced Contact-Force Conductors for Electrical Connect...
- Publication number 20120149250
- Publication date Jun 14, 2012
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHAIN
- Publication number 20110252164
- Publication date Oct 13, 2011
- Kevin P. Grundy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-SURFACE IC PACKAGING STRUCTURES
- Publication number 20110215475
- Publication date Sep 8, 2011
- Interconnect Portfollo LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Torsionally-Induced Contact-Force Conductors for Electrical Connect...
- Publication number 20110171857
- Publication date Jul 14, 2011
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Torsionally-Induced Contact-Force Conductors for Electrical Connect...
- Publication number 20110065332
- Publication date Mar 17, 2011
- Interconnect Portfolio LLC
- Gary Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD Protection Utilizing Radiated Thermal Relief
- Publication number 20100284115
- Publication date Nov 11, 2010
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Surface IC Packaging Structures and Methods for their Manufac...
- Publication number 20100221871
- Publication date Sep 2, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Discrete Electronic Components and Applications of Same
- Publication number 20100165525
- Publication date Jul 1, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed, Direct Path, Stair-Step, Electronic Connectors with Imp...
- Publication number 20100151704
- Publication date Jun 17, 2010
- Interconnect Portfolio LLC
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect System without Through-Holes
- Publication number 20100127402
- Publication date May 27, 2010
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Interconnection Devices Incorporating Redundant Contact...
- Publication number 20100112829
- Publication date May 6, 2010
- Interconnect Portfolio LLC
- Gary Yasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Controlled Impedance Structures for High Density Interconnections
- Publication number 20090167334
- Publication date Jul 2, 2009
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- G01 - MEASURING TESTING
Information Patent Application
MEMORY CHAIN
- Publication number 20090119464
- Publication date May 7, 2009
- Kevin P. Grundy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Partitioned Integrated Circuit Package with Central Clock Driver
- Publication number 20090091017
- Publication date Apr 9, 2009
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed, Direct Path, Stair-Step, Electronic Connectors with Imp...
- Publication number 20090093173
- Publication date Apr 9, 2009
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF
- Publication number 20090027137
- Publication date Jan 29, 2009
- Joseph C. Fjelstad
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL INTERCONNECTION DEVICES INCORPORATING REDUNDANT CONTACT...
- Publication number 20080274654
- Publication date Nov 6, 2008
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PROTECTING DIGITAL RIGHTS OF COPYRI...
- Publication number 20080247543
- Publication date Oct 9, 2008
- Colin Kennedy Mick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR DISTRIBUTING A MULTIMEDIA FILE TO...
- Publication number 20080250120
- Publication date Oct 9, 2008
- Colin Kennedy Mick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIDEO NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH SPEED DISTRIB...
- Publication number 20080229374
- Publication date Sep 18, 2008
- Colin K. Mick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIGITAL MULTIMEDIA NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH...
- Publication number 20080229371
- Publication date Sep 18, 2008
- Colin K. Mick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR MANAGING A DIGITAL INVENTORY OF M...
- Publication number 20080228821
- Publication date Sep 18, 2008
- Colin K. Mick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Signal-Segregating Connector System
- Publication number 20070236901
- Publication date Oct 11, 2007
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical interconnection devices incorporating redundant contact...
- Publication number 20070178774
- Publication date Aug 2, 2007
- Gary Yasumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-surface IC packaging structures and methods for their manufac...
- Publication number 20060157846
- Publication date Jul 20, 2006
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS

Kevin P. Grundy

Person

Patents Grantslast 30 patents

Modular antenna system

Multi-surface IC packaging structures

Low profile discrete electronic components and applications of same

Connector having a housing with a conductor with a ramp section and...

Memory chain

ESD protection utilizing radiated thermal relief

Electrical connector with conductors with a ramp to induce torsion

High speed, direct path, stair-step, electronic connectors with imp...

Controlled impedance structures for high density interconnections

Tapered dielectric and conductor structures and applications thereof

Memory systems including memory devices coupled together in a daisy...

Multi-surface IC packaging structures and methods for their manufac...

Torsionally-induced contact-force conductors for electrical connect...

Torsionally-induced contact-force conductors for electrical connect...

Electrical interconnection devices incorporating Fedundant contact...

IC package structures having separate circuit interconnection struc...

Multi-surface IC packaging structures and methods for their manufac...

Multi-surface contact IC packaging structures and assemblies

Low profile discrete electronic components and applications of same

Interconnect system without through-holes

Electrical interconnection devices incorporating redundant contact...

High speed, direct path, stair-step, electronic connectors with imp...

Signal-segregating connector system

Electrical interconnection devices incorporating redundant contact...

Tapered dielectric and conductor structures and applications thereof

Active connector

IC packaging interposer having controlled impedance or optical inte...

Memory chain

Stair step printed circuit board structures for high speed signal t...

Partitioned integrated circuit package with central clock driver

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR CONTROLLING DYNAMIC RANGE COMPRESSION IMAGE P...

SYSTEM AND METHOD FOR OPTIMIZING DYNAMIC RANGE COMPRESSION IMAGE PR...

SYSTEM AND METHOD FOR OPTIMIZING INTENSITY LEVELS FOR VIDEO ENCODING

MODULAR ANTENNA SYSTEM

TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECT...

Torsionally-Induced Contact-Force Conductors for Electrical Connect...

MEMORY CHAIN

MULTI-SURFACE IC PACKAGING STRUCTURES

Torsionally-Induced Contact-Force Conductors for Electrical Connect...

Torsionally-Induced Contact-Force Conductors for Electrical Connect...

ESD Protection Utilizing Radiated Thermal Relief

Multi-Surface IC Packaging Structures and Methods for their Manufac...

Low Profile Discrete Electronic Components and Applications of Same

High Speed, Direct Path, Stair-Step, Electronic Connectors with Imp...

Interconnect System without Through-Holes

Electrical Interconnection Devices Incorporating Redundant Contact...

Controlled Impedance Structures for High Density Interconnections

MEMORY CHAIN

Partitioned Integrated Circuit Package with Central Clock Driver

High Speed, Direct Path, Stair-Step, Electronic Connectors with Imp...

TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF

ELECTRICAL INTERCONNECTION DEVICES INCORPORATING REDUNDANT CONTACT...

METHOD AND APPARATUS FOR PROTECTING DIGITAL RIGHTS OF COPYRI...

METHOD AND APPARATUS FOR DISTRIBUTING A MULTIMEDIA FILE TO...

VIDEO NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH SPEED DISTRIB...

DIGITAL MULTIMEDIA NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH...

METHOD AND APPARATUS FOR MANAGING A DIGITAL INVENTORY OF M...

Signal-Segregating Connector System

Electrical interconnection devices incorporating redundant contact...

Multi-surface IC packaging structures and methods for their manufac...