Kevin S. Petrarca

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Layered substrate structures with aligned optical access to electri...
- Patent number 12,178,142
- Issue date Dec 24, 2024
- International Business Machines Corporation
- Stephen M. Gates
Information Patent Grant
Create a protected layer for interconnects and devices in a package...
- Patent number 12,033,981
- Issue date Jul 9, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 10,784,200
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating a via in a semiconductor substrate
- Patent number 10,079,175
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip alignment mark exposing method enabling wafer level under...
- Patent number 9,824,925
- Issue date Nov 21, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating a via in a semiconductor substrate
- Patent number 9,728,450
- Issue date Aug 8, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protected through semiconductor via (TSV)
- Patent number 9,673,095
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking container
- Patent number 9,511,918
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Ira L. Allen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Protected through semiconductor via (TSV)
- Patent number 9,401,323
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively grown self-aligned fins for deep isolation integration
- Patent number 9,293,375
- Issue date Mar 22, 2016
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with a dual damascene wire and through-substrate...
- Patent number 9,093,503
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced capture pads for through semiconductor vias
- Patent number 9,040,418
- Issue date May 26, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tag with environmental sensor
- Patent number 9,030,295
- Issue date May 12, 2015
- International Business Machines Corporation
- Ira L. Allen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 8,999,764
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Front side wafer ID processing
- Patent number 8,822,141
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle carrier
- Patent number 8,815,475
- Issue date Aug 26, 2014
- International Business Machines Corporation
- Kevin S. Petrarca
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Self-aligned nano-scale device with parallel plate electrodes
- Patent number 8,802,990
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system to predict lithography focus error using simulate...
- Patent number 8,792,080
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Brian Christopher Sapp
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Enhanced capture pads for through semiconductor vias
- Patent number 8,772,949
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asset management infrastructure
- Patent number 8,692,649
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- G08 - SIGNALLING
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar module with overheat protection
- Patent number 8,665,575
- Issue date Mar 4, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated void fill for through silicon via
- Patent number 8,633,580
- Issue date Jan 21, 2014
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic solar cell device manufacture
- Patent number 8,614,115
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Lawrence A. Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated void fill for through silicon via
- Patent number 8,609,537
- Issue date Dec 17, 2013
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically contactable grids manufacture
- Patent number 8,574,950
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Lawrence A. Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Alignment marks to enable 3D integration
- Patent number 8,546,961
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for making photovoltaic solar cells
- Patent number 8,535,970
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Ranier Krauser
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing a photovoltaic cell
- Patent number 8,486,751
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Lawrence A. Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Self-aligned nano-scale device with parallel plate electrodes
- Patent number 8,476,530
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Lawrence A. Clevenger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK
- Publication number 20230402318
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAIL AT TIGHT CELL-TO-CELL SPACE
- Publication number 20230178433
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT BURIED POWER RAIL
- Publication number 20230154783
- Publication date May 18, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CONTAINING A VIA-TO-BURIED POWER RAIL CONTACT STRUCTURE O...
- Publication number 20230139929
- Publication date May 4, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...
- Publication number 20220189922
- Publication date Jun 16, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED SUBSTRATE STRUCTURES WITH ALIGNED OPTICAL ACCESS TO ELECTRI...
- Publication number 20220158068
- Publication date May 19, 2022
- International Business Machines Corporation
- Stephen M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20170256447
- Publication date Sep 7, 2017
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20160379818
- Publication date Dec 29, 2016
- GLOBALFOUNDRIES INC.
- CHRISTOPHER COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20160379876
- Publication date Dec 29, 2016
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ALIGNMENT MARK EXPOSING METHOD ENABLING WAFER LEVEL UNDER...
- Publication number 20160365281
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)
- Publication number 20160293487
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY GROWN SELF-ALIGNED FINS FOR DEEP ISOLATION INTEGRATION
- Publication number 20150311121
- Publication date Oct 29, 2015
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH A DUAL DAMASCENE WIRE AND THROUGH-SUBSTRATE...
- Publication number 20150194345
- Publication date Jul 9, 2015
- International Busines Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE WAFER ID PROCESSING
- Publication number 20140256130
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAG WITH ENVIRONMENTAL SENSOR
- Publication number 20140232519
- Publication date Aug 21, 2014
- International Business Machines Corporation
- Ira L. Allen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
- Publication number 20140124946
- Publication date May 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS
- Publication number 20140127904
- Publication date May 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...
- Publication number 20140071416
- Publication date Mar 13, 2014
- Choongyeun Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...
- Publication number 20140075396
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Choongyeun Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...
- Publication number 20140075399
- Publication date Mar 13, 2014
- Choongyeun Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-LOCKING CONTAINER
- Publication number 20130168395
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Ira L. Allen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Reticle Carrier
- Publication number 20130130162
- Publication date May 23, 2013
- International Business Machines Corporation
- Kevin S. Petrarca
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTEGRATED VOID FILL FOR THROUGH SILICON VIA
- Publication number 20130122702
- Publication date May 16, 2013
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY
- Publication number 20120304138
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED VOID FILL FOR THROUGH SILICON VIA
- Publication number 20120292786
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...
- Publication number 20120270351
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING COAXIAL THROUGH-SILICON VIA
- Publication number 20120258589
- Publication date Oct 11, 2012
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...
- Publication number 20120194792
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Brian Christopher Sapp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED NANO-SCALE DEVICE WITH PARALLEL PLATE ELECTRODES
- Publication number 20120189767
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Lawrence A. Clevenger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kevin S. Petrarca

Person

Patents Grantslast 30 patents

Layered substrate structures with aligned optical access to electri...

Create a protected layer for interconnects and devices in a package...

Ionizing radiation blocking in IC chip to reduce soft errors

Insulating a via in a semiconductor substrate

Flip chip alignment mark exposing method enabling wafer level under...

Insulating a via in a semiconductor substrate

Protected through semiconductor via (TSV)

Self-locking container

Protected through semiconductor via (TSV)

Selectively grown self-aligned fins for deep isolation integration

Semiconductor chip with a dual damascene wire and through-substrate...

Enhanced capture pads for through semiconductor vias

RFID tag with environmental sensor

Ionizing radiation blocking in IC chip to reduce soft errors

Front side wafer ID processing

Reticle carrier

Self-aligned nano-scale device with parallel plate electrodes

Method and system to predict lithography focus error using simulate...

Enhanced capture pads for through semiconductor vias

Asset management infrastructure

TSV pillar as an interconnecting structure

Solar module with overheat protection

Integrated void fill for through silicon via

Photovoltaic solar cell device manufacture

Integrated void fill for through silicon via

Electrically contactable grids manufacture

Alignment marks to enable 3D integration

Manufacturing process for making photovoltaic solar cells

Method of manufacturing a photovoltaic cell

Self-aligned nano-scale device with parallel plate electrodes

Patents Applicationslast 30 patents

VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK

BURIED POWER RAIL AT TIGHT CELL-TO-CELL SPACE

REPLACEMENT BURIED POWER RAIL

STRUCTURE CONTAINING A VIA-TO-BURIED POWER RAIL CONTACT STRUCTURE O...

CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...

LAYERED SUBSTRATE STRUCTURES WITH ALIGNED OPTICAL ACCESS TO ELECTRI...

INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

FLIP CHIP ALIGNMENT MARK EXPOSING METHOD ENABLING WAFER LEVEL UNDER...

PROTECTED THROUGH SEMICONDUCTOR VIA (TSV)

SELECTIVELY GROWN SELF-ALIGNED FINS FOR DEEP ISOLATION INTEGRATION

SEMICONDUCTOR CHIP WITH A DUAL DAMASCENE WIRE AND THROUGH-SUBSTRATE...

FRONT SIDE WAFER ID PROCESSING

RFID TAG WITH ENVIRONMENTAL SENSOR

ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS

ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS

METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...

METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...

METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...

SELF-LOCKING CONTAINER

Reticle Carrier

INTEGRATED VOID FILL FOR THROUGH SILICON VIA

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY

INTEGRATED VOID FILL FOR THROUGH SILICON VIA

LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...

METHOD OF FABRICATING COAXIAL THROUGH-SILICON VIA

METHOD AND SYSTEM TO PREDICT LITHOGRAPHY FOCUS ERROR USING SIMULATE...

SELF-ALIGNED NANO-SCALE DEVICE WITH PARALLEL PLATE ELECTRODES