Kevin T. Knadle

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,596,862
- Issue date Oct 6, 2009
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,325,299
- Issue date Feb 5, 2008
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively roughening conductors for high frequency printed wiring...
- Patent number 7,235,148
- Issue date Jun 26, 2007
- International Business Machines Corporation
- Richard Allen Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate
- Patent number 7,185,428
- Issue date Mar 6, 2007
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Treating copper surfaces for electronic applications
- Patent number 6,962,642
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Kevin T. Knadle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine line circuitization
- Patent number 6,822,332
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a reliable solder joint interconnection
- Patent number 6,672,500
- Issue date Jan 6, 2004
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively roughening conductors for high frequency printed wiring...
- Patent number 6,596,384
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Richard Allen Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with improved plated through hole fatigue life
- Patent number 6,423,905
- Issue date Jul 23, 2002
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a reliable BGA solder joint interconnection
- Patent number 6,293,455
- Issue date Sep 25, 2001
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a reliable BGA solder joint interconnection
- Patent number 6,138,893
- Issue date Oct 31, 2000
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A CIRCUITIZED SUBSTRATE
- Publication number 20080014409
- Publication date Jan 17, 2008
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MAKING A CIRCUITIZED SUBSTRATE
- Publication number 20070102396
- Publication date May 10, 2007
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Fine line circuitization
- Publication number 20040130003
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Treating copper surfaces for electronic applications
- Publication number 20040060729
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Kevin T. Knadle
- B32 - LAYERED PRODUCTS
Information Patent Application
Fine line circuitization
- Publication number 20040056330
- Publication date Mar 25, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B32 - LAYERED PRODUCTS
Information Patent Application
Selectively roughening conductors for high frequency printed wiring...
- Publication number 20040007313
- Publication date Jan 15, 2004
- International Business Machines Corporation
- Richard Allen Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for producing a reliable solder joint interconnection
- Publication number 20010045445
- Publication date Nov 29, 2001
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kevin T. Knadle

Person

Patents Grantslast 30 patents

Method of making a circuitized substrate

Method of making a circuitized substrate

Selectively roughening conductors for high frequency printed wiring...

Method of making a circuitized substrate

Treating copper surfaces for electronic applications

Method of fabricating printed circuit board with mixed metallurgy pads

Fine line circuitization

Method for producing a reliable solder joint interconnection

Selectively roughening conductors for high frequency printed wiring...

Printed circuit board with mixed metallurgy pads and method of fabr...

Printed wiring board with improved plated through hole fatigue life

Method for producing a reliable BGA solder joint interconnection

Method for producing a reliable BGA solder joint interconnection

Patents Applicationslast 30 patents

METHOD OF MAKING A CIRCUITIZED SUBSTRATE

METHOD OF MAKING A CIRCUITIZED SUBSTRATE

Fine line circuitization

Treating copper surfaces for electronic applications

Fine line circuitization

Selectively roughening conductors for high frequency printed wiring...

Printed circuit board with mixed metallurgy pads and method of fabr...

Printed circuit board with mixed metallurgy pads and method of fabr...

Method for producing a reliable solder joint interconnection