Kezia Cheng

Person

Lowell, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to improve front-side process uniformity by back-side metal...
- Patent number 10,982,322
- Issue date Apr 20, 2021
- Skyworks Solutions, Inc.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaging structures with improved adhesion and strength
- Patent number 10,971,418
- Issue date Apr 6, 2021
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rapid thermal anneal apparatus and method
- Patent number 10,840,114
- Issue date Nov 17, 2020
- Raytheon Company
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling the amount of radiation having a predetermin...
- Patent number 10,541,148
- Issue date Jan 21, 2020
- Raytheon Company
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures with improved adhesion and strength
- Patent number 10,453,763
- Issue date Oct 22, 2019
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Schottky contact structure for semiconductor devices and method for...
- Patent number 10,439,035
- Issue date Oct 8, 2019
- Raytheon Company
- Kamal Tabatabaie-Alavi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky contact structure for semiconductor devices and method for...
- Patent number 10,026,823
- Issue date Jul 17, 2018
- Raytheon Company
- Kamal Tabatabaie-Alavi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron radiation monitoring electrode system to prevent gold spit...
- Patent number 9,768,081
- Issue date Sep 19, 2017
- Skyworks Solutions, Inc.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods related to a sputtered titanium tungsten layer formed over...
- Patent number 9,576,906
- Issue date Feb 21, 2017
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnects having a titanium-platinum-titanium assembly b...
- Patent number 9,553,049
- Issue date Jan 24, 2017
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to a sputtered titanium tungsten layer...
- Patent number 9,443,803
- Issue date Sep 13, 2016
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron radiation monitoring system to prevent gold spitting and r...
- Patent number 9,068,918
- Issue date Jun 30, 2015
- Skyworks Solutions, Inc.
- Kezia Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for improving front-side process uniformity by...
- Patent number 8,956,979
- Issue date Feb 17, 2015
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnects having a titanium—titanium nitride assembly be...
- Patent number 8,878,362
- Issue date Nov 4, 2014
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron radiation monitoring system to prevent gold spitting and r...
- Patent number 8,373,427
- Issue date Feb 12, 2013
- Skyworks Solutions, Inc.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE HAVING...
- Publication number 20240258994
- Publication date Aug 1, 2024
- Skyworks Solutions, Inc.
- Kurt George Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING
- Publication number 20240112904
- Publication date Apr 4, 2024
- SKYWORKS GLOBAL PTE. LTD.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PIEZOELECTRIC FILM
- Publication number 20230113584
- Publication date Apr 13, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BULK ACOUSTIC WAVE DEVICE WITH ATOMIC LAYER...
- Publication number 20230109080
- Publication date Apr 6, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Stefan Bader
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICE WITH PIEZOELECTRIC LAYER FORMED BY ATOMIC...
- Publication number 20230108824
- Publication date Apr 6, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Stefan Bader
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICE WITH STACKED PIEZOELECTRIC LAYERS
- Publication number 20230109569
- Publication date Apr 6, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Stefan Bader
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE COMPRISING MULTI-LAYER INTERDIGITAL TR...
- Publication number 20230048476
- Publication date Feb 16, 2023
- Skyworks Solutions, Inc.
- Kezia Cheng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
- Publication number 20200013689
- Publication date Jan 9, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO IMPROVE FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METAL...
- Publication number 20190316250
- Publication date Oct 17, 2019
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR CONTROLLING THE AMOUNT OF RADIATION HAVING A PREDETERMIN...
- Publication number 20190198346
- Publication date Jun 27, 2019
- Raytheon Company
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHOTTKY CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FOR...
- Publication number 20180323274
- Publication date Nov 8, 2018
- Raytheon Company
- Kamal Tabatabaie-Alavi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
- Publication number 20180047650
- Publication date Feb 15, 2018
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER BONDING WITH IMPROVED STEP COVERAGE
- Publication number 20170365554
- Publication date Dec 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING USING A TRANSFERABLE STRUCTURE
- Publication number 20170345676
- Publication date Nov 30, 2017
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MICROMOLD AND PATTERN TRANSFER
- Publication number 20170243739
- Publication date Aug 24, 2017
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...
- Publication number 20170186694
- Publication date Jun 29, 2017
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER...
- Publication number 20160343667
- Publication date Nov 24, 2016
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON RADIATION MONITORING ELECTRODE SYSTEM TO PREVENT GOLD SPIT...
- Publication number 20150243567
- Publication date Aug 27, 2015
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS, DEVICES AND METHODS RELATED TO SOURCE LEVEL COMPENSATION F...
- Publication number 20150203959
- Publication date Jul 23, 2015
- SKYWORKS SOLUTIONS, INC.
- Kezia CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS TO IMPROVE FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METAL...
- Publication number 20150129130
- Publication date May 14, 2015
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER INTERCONNECTS HAVING A TITANIUM-TITANIUM NITRIDE ASSEMBLY BE...
- Publication number 20130234333
- Publication date Sep 12, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS HAVING A TITANIUM-PLATINUM-TITANIUM ASSEMBLY B...
- Publication number 20130228924
- Publication date Sep 5, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...
- Publication number 20130221528
- Publication date Aug 29, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING FRONT-SIDE PROCESS UNIFORMITY BY...
- Publication number 20130143411
- Publication date Jun 6, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND R...
- Publication number 20130069622
- Publication date Mar 21, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND R...
- Publication number 20110193576
- Publication date Aug 11, 2011
- Kezia Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kezia Cheng

Person

Patents Grantslast 30 patents

Methods to improve front-side process uniformity by back-side metal...

Packaging structures with improved adhesion and strength

Rapid thermal anneal apparatus and method

Method for controlling the amount of radiation having a predetermin...

Packaging structures with improved adhesion and strength

Schottky contact structure for semiconductor devices and method for...

Schottky contact structure for semiconductor devices and method for...

Electron radiation monitoring electrode system to prevent gold spit...

Methods related to a sputtered titanium tungsten layer formed over...

Copper interconnects having a titanium-platinum-titanium assembly b...

Devices and methods related to a sputtered titanium tungsten layer...

Electron radiation monitoring system to prevent gold spitting and r...

Systems and methods for improving front-side process uniformity by...

Copper interconnects having a titanium—titanium nitride assembly be...

Electron radiation monitoring system to prevent gold spitting and r...

Patents Applicationslast 30 patents

ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE HAVING...

PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING

METHOD FOR FORMING A PIEZOELECTRIC FILM

METHOD OF MANUFACTURING BULK ACOUSTIC WAVE DEVICE WITH ATOMIC LAYER...

BULK ACOUSTIC WAVE DEVICE WITH PIEZOELECTRIC LAYER FORMED BY ATOMIC...

BULK ACOUSTIC WAVE DEVICE WITH STACKED PIEZOELECTRIC LAYERS

SURFACE ACOUSTIC WAVE DEVICE COMPRISING MULTI-LAYER INTERDIGITAL TR...

PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH

METHODS TO IMPROVE FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METAL...

METHOD FOR CONTROLLING THE AMOUNT OF RADIATION HAVING A PREDETERMIN...

SCHOTTKY CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FOR...

PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH

POLYMER BONDING WITH IMPROVED STEP COVERAGE

WAFER LEVEL PACKAGING USING A TRANSFERABLE STRUCTURE

3D MICROMOLD AND PATTERN TRANSFER

DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...

METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER...

ELECTRON RADIATION MONITORING ELECTRODE SYSTEM TO PREVENT GOLD SPIT...

SYSTEMS, DEVICES AND METHODS RELATED TO SOURCE LEVEL COMPENSATION F...

SYSTEMS TO IMPROVE FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METAL...

COPPER INTERCONNECTS HAVING A TITANIUM-TITANIUM NITRIDE ASSEMBLY BE...

COPPER INTERCONNECTS HAVING A TITANIUM-PLATINUM-TITANIUM ASSEMBLY B...

DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...

SYSTEMS AND METHODS FOR IMPROVING FRONT-SIDE PROCESS UNIFORMITY BY...

ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND R...

ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND R...