Khang Choong Yong

Person

Puchong, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Self-equalized and self-crosstalk-compensated 3D transmission line...
- Patent number 11,955,436
- Issue date Apr 9, 2024
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern-edged metal-plane resonance-suppression
- Patent number 11,729,900
- Issue date Aug 15, 2023
- Intel Corporation
- Stephen Harvey Hall
- G05 - CONTROLLING REGULATING
Information Patent Grant
RFI free picture frame metal stiffener
- Patent number 11,658,127
- Issue date May 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gyratory sensing system to enhance wearable device user experience...
- Patent number 11,614,811
- Issue date Mar 28, 2023
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Slot antenna on a printed circuit board (PCB)
- Patent number 11,552,403
- Issue date Jan 10, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gyratory sensing system to enhance wearable device user experience...
- Patent number 11,422,642
- Issue date Aug 23, 2022
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 11,393,760
- Issue date Jul 19, 2022
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board to board interconnect
- Patent number 11,304,299
- Issue date Apr 12, 2022
- Intel Corporation
- Chee Ling Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crystal oscillator interconnect architecture with noise immunity
- Patent number 11,290,059
- Issue date Mar 29, 2022
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Pattern-edged metal-plane resonance-suppression
- Patent number 11,277,903
- Issue date Mar 15, 2022
- Intel Corporation
- Stephen Harvey Hall
- G05 - CONTROLLING REGULATING
Information Patent Grant
Slot antenna on a printed circuit board (PCB)
- Patent number 11,211,714
- Issue date Dec 28, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible shield for semiconductor devices
- Patent number 11,177,226
- Issue date Nov 16, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit EMI enclosure
- Patent number 11,178,768
- Issue date Nov 16, 2021
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device, system and method to promote the integrity of signal commun...
- Patent number 11,153,968
- Issue date Oct 19, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 11,114,421
- Issue date Sep 7, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gyratory sensing system to enhance wearable device user experience...
- Patent number 11,061,492
- Issue date Jul 13, 2021
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gyratory sensing system to enhance wearable device user experience...
- Patent number 10,996,773
- Issue date May 4, 2021
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D high-inductive ground plane for crosstalk reduction
- Patent number 10,973,116
- Issue date Apr 6, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having an impedance-boosting channel
- Patent number 10,971,440
- Issue date Apr 6, 2021
- Intel Coropration
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line design with routing-over-void compensation
- Patent number 10,856,407
- Issue date Dec 1, 2020
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 10,796,999
- Issue date Oct 6, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board to board interconnect
- Patent number 10,772,206
- Issue date Sep 8, 2020
- Intel Corporation
- Chee Ling Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded semiconductor package architectures and methods of assemblin...
- Patent number 10,734,318
- Issue date Aug 4, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having inductive lateral interconnects
- Patent number 10,734,333
- Issue date Aug 4, 2020
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber weave-sandwiched differential pair routing technique
- Patent number 10,716,209
- Issue date Jul 14, 2020
- Intel Corporation
- Bok Eng Cheah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference (EMI) shield
- Patent number 10,701,796
- Issue date Jun 30, 2020
- Intel Corporation
- Tin Poay Chuah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mutual inductance suppressor for crosstalk immunity enhancement
- Patent number 10,652,999
- Issue date May 12, 2020
- Intel Corporation
- Khang Choong Yong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended stiffener for platform miniaturization
- Patent number 10,643,983
- Issue date May 5, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION
- Publication number 20220304143
- Publication date Sep 22, 2022
- Intel Corporation
- Stephen Harvey Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...
- Publication number 20220137726
- Publication date May 5, 2022
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)
- Publication number 20220052458
- Publication date Feb 17, 2022
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20210366883
- Publication date Nov 25, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...
- Publication number 20210263599
- Publication date Aug 26, 2021
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20200411438
- Publication date Dec 31, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFI FREE PICTURE FRAME METAL STIFFENER
- Publication number 20200411448
- Publication date Dec 31, 2020
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD TO BOARD INTERCONNECT
- Publication number 20200404787
- Publication date Dec 24, 2020
- Intel Corporation
- Chee Ling Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISAGGREGATED DIE INTERCONNECTION WITH ON-SILICON CAVITY BRIDGE
- Publication number 20200357744
- Publication date Nov 12, 2020
- Intel Corporation
- Khang Choong YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-EQUALIZED AND SELF-CROSSTALK-COMPENSATED 3D TRANSMISSION LINE...
- Publication number 20200343194
- Publication date Oct 29, 2020
- Intel Corporation
- Khang Choong YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION
- Publication number 20200314999
- Publication date Oct 1, 2020
- Stephen Harvey Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE CUSHION TO SUPPRESS POWER PLANE RESONANCE
- Publication number 20200314998
- Publication date Oct 1, 2020
- Intel Corporation
- Khang Choong YONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY
- Publication number 20200274491
- Publication date Aug 27, 2020
- Intel Corporation
- Khang Choong YONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...
- Publication number 20200225771
- Publication date Jul 16, 2020
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...
- Publication number 20200209987
- Publication date Jul 2, 2020
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIBER WEAVE-SANDWICHED DIFFERENTIAL PAIR ROUTING TECHNIQUE
- Publication number 20200137886
- Publication date Apr 30, 2020
- Intel Corporation
- Bok Eng Cheah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS FOR SIGNAL INTEGRITY PROTECTION TECHNIQUE
- Publication number 20200126928
- Publication date Apr 23, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SHIELD FOR SEMICONDUCTOR DEVICES AND METHODS
- Publication number 20200091093
- Publication date Mar 19, 2020
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20190378828
- Publication date Dec 12, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)
- Publication number 20190348766
- Publication date Nov 14, 2019
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD TO BOARD INTERCONNECT
- Publication number 20190342996
- Publication date Nov 7, 2019
- Intel Corporation
- Chee Ling Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20190304914
- Publication date Oct 3, 2019
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PACKAGE INTEGRATED STIFFENER ANTENNA
- Publication number 20190221529
- Publication date Jul 18, 2019
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MUTUAL INDUCTANCE SUPPRESSOR FOR CROSSTALK IMMUNITY ENHANCEMENT
- Publication number 20190215953
- Publication date Jul 11, 2019
- Intel Corporation
- Khang Choong YONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D HIGH-INDUCTIVE GROUND PLANE FOR CROSSTALK REDUCTION
- Publication number 20190208620
- Publication date Jul 4, 2019
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL
- Publication number 20190181080
- Publication date Jun 13, 2019
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY
- Publication number 20190158024
- Publication date May 23, 2019
- Intel Corporation
- Khang Choong YONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FOLDED SEMICONDUCTOR PACKAGE ARCHITECTURES AND METHODS OF ASSEMBLIN...
- Publication number 20190148269
- Publication date May 16, 2019
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INDUCTIVE LATERAL INTERCONNECTS
- Publication number 20190131257
- Publication date May 2, 2019
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...
- Publication number 20190103357
- Publication date Apr 4, 2019
- Intel Corporation
- Min Suet Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Khang Choong Yong

Person

Patents Grantslast 30 patents

Self-equalized and self-crosstalk-compensated 3D transmission line...

Devices and methods for signal integrity protection technique

Pattern-edged metal-plane resonance-suppression

RFI free picture frame metal stiffener

Disaggregated die interconnection with on-silicon cavity bridge

Gyratory sensing system to enhance wearable device user experience...

Slot antenna on a printed circuit board (PCB)

Gyratory sensing system to enhance wearable device user experience...

Floating-bridge interconnects and methods of assembling same

Board to board interconnect

Crystal oscillator interconnect architecture with noise immunity

Pattern-edged metal-plane resonance-suppression

Slot antenna on a printed circuit board (PCB)

Flexible shield for semiconductor devices

Flexible printed circuit EMI enclosure

Device, system and method to promote the integrity of signal commun...

Integrating system in package (SiP) with input/output (IO) board fo...

Gyratory sensing system to enhance wearable device user experience...

Gyratory sensing system to enhance wearable device user experience...

3D high-inductive ground plane for crosstalk reduction

Semiconductor package having an impedance-boosting channel

Transmission line design with routing-over-void compensation

Floating-bridge interconnects and methods of assembling same

Board to board interconnect

Folded semiconductor package architectures and methods of assemblin...

Semiconductor package having inductive lateral interconnects

Fiber weave-sandwiched differential pair routing technique

Electromagnetic interference (EMI) shield

Mutual inductance suppressor for crosstalk immunity enhancement

Extended stiffener for platform miniaturization

Patents Applicationslast 30 patents

PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION

GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...

SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

RFI FREE PICTURE FRAME METAL STIFFENER

BOARD TO BOARD INTERCONNECT

DISAGGREGATED DIE INTERCONNECTION WITH ON-SILICON CAVITY BRIDGE

SELF-EQUALIZED AND SELF-CROSSTALK-COMPENSATED 3D TRANSMISSION LINE...

PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION

IMPEDANCE CUSHION TO SUPPRESS POWER PLANE RESONANCE

CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY

GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...

GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE...

FIBER WEAVE-SANDWICHED DIFFERENTIAL PAIR ROUTING TECHNIQUE

DEVICES AND METHODS FOR SIGNAL INTEGRITY PROTECTION TECHNIQUE

FLEXIBLE SHIELD FOR SEMICONDUCTOR DEVICES AND METHODS

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)

BOARD TO BOARD INTERCONNECT

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

ON-PACKAGE INTEGRATED STIFFENER ANTENNA

MUTUAL INDUCTANCE SUPPRESSOR FOR CROSSTALK IMMUNITY ENHANCEMENT

3D HIGH-INDUCTIVE GROUND PLANE FOR CROSSTALK REDUCTION

SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL

CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY

FOLDED SEMICONDUCTOR PACKAGE ARCHITECTURES AND METHODS OF ASSEMBLIN...

SEMICONDUCTOR PACKAGE HAVING INDUCTIVE LATERAL INTERCONNECTS

METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...