Khanh Tran

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-based electronic component packaging
- Patent number 10,211,172
- Issue date Feb 19, 2019
- Maxim Integrated Products, Inc.
- Anuranjan Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for adhesive control between a substrate and a die
- Patent number 10,056,294
- Issue date Aug 21, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor with vertical diode junctions
- Patent number 9,882,075
- Issue date Jan 30, 2018
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out and heterogeneous packaging of electronic components
- Patent number 9,704,809
- Issue date Jul 11, 2017
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having trench capacitor structure integrated t...
- Patent number 9,608,130
- Issue date Mar 28, 2017
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capacitor integrated therein
- Patent number 9,520,462
- Issue date Dec 13, 2016
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capacitor integrated therein
- Patent number 9,196,672
- Issue date Nov 24, 2015
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors and methods for integrated circuits
- Patent number 8,847,365
- Issue date Sep 30, 2014
- Maxim Integrated Products, Inc.
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors having inductor axis parallel to substrate surface
- Patent number 8,344,478
- Issue date Jan 1, 2013
- Maxim Integrated Products, Inc.
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimum cost method for forming high density passive capacitors for...
- Patent number 7,943,473
- Issue date May 17, 2011
- Maxim Integrated Products, Inc.
- Joseph Paul Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Globally planarized backend compatible thin film resistor contact/i...
- Patent number 6,607,962
- Issue date Aug 19, 2003
- Maxim Integrated Products, Inc.
- Viktor Zekeriya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-BASED ELECTRONIC COMPONENT PACKAGING
- Publication number 20150262944
- Publication date Sep 17, 2015
- Maxim Integrated Products, Inc.
- Anuranjan Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR ADHESIVE CONTROL BETWEEN A SUBSTRATE AND A DIE
- Publication number 20150155264
- Publication date Jun 4, 2015
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR WITH VERTICAL DIODE JUNCTIONS
- Publication number 20140264711
- Publication date Sep 18, 2014
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS
- Publication number 20140252655
- Publication date Sep 11, 2014
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR INTEGRATED THEREIN
- Publication number 20130175666
- Publication date Jul 11, 2013
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TRENCH CAPACITOR STRUCTURE INTEGRATED T...
- Publication number 20130161792
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductors and Methods for Integrated Circuits
- Publication number 20130071983
- Publication date Mar 21, 2013
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductors and Methods for Integrated Circuits
- Publication number 20110095395
- Publication date Apr 28, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Joseph P. Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Minimum Cost Method for Forming High Density Passive Capacitors for...
- Publication number 20100178747
- Publication date Jul 15, 2010
- MAXIM INTEGRATED PRODUCTS, INC.
- Joseph Paul Ellul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Globally planarized backend compatible thin film resistor contact/i...
- Publication number 20030030107
- Publication date Feb 13, 2003
- Viktor Zekeriya
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wafer-based electronic component packaging

Techniques for adhesive control between a substrate and a die

Light sensor with vertical diode junctions

Fan-out and heterogeneous packaging of electronic components

Semiconductor device having trench capacitor structure integrated t...

Semiconductor device having capacitor integrated therein

Semiconductor device having capacitor integrated therein

Inductors and methods for integrated circuits

Inductors having inductor axis parallel to substrate surface

Minimum cost method for forming high density passive capacitors for...

Globally planarized backend compatible thin film resistor contact/i...

Patents Applicationslast 30 patents

WAFER-BASED ELECTRONIC COMPONENT PACKAGING

TECHNIQUES FOR ADHESIVE CONTROL BETWEEN A SUBSTRATE AND A DIE

LIGHT SENSOR WITH VERTICAL DIODE JUNCTIONS

FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE HAVING CAPACITOR INTEGRATED THEREIN

SEMICONDUCTOR DEVICE HAVING TRENCH CAPACITOR STRUCTURE INTEGRATED T...

Inductors and Methods for Integrated Circuits

Inductors and Methods for Integrated Circuits

Minimum Cost Method for Forming High Density Passive Capacitors for...

Globally planarized backend compatible thin film resistor contact/i...