Khay Chwan Saw

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe, semiconductor package and method
- Patent number 12,218,038
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,021,000
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lead tip inspection feature
- Patent number 11,587,800
- Issue date Feb 21, 2023
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 11,296,000
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to lead interconnect in encapsulant of molded semiconductor pa...
- Patent number 10,796,981
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 10,741,466
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with C-wing and gull-wing leads
- Patent number 10,325,837
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20230049564
- Publication date Feb 16, 2023
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20220037222
- Publication date Feb 3, 2022
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20210391298
- Publication date Dec 16, 2021
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Lead Tip Inspection Feature
- Publication number 20210366732
- Publication date Nov 25, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20200350222
- Publication date Nov 5, 2020
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20200321276
- Publication date Oct 8, 2020
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20200321269
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Semiconductor Package and Method
- Publication number 20200051898
- Publication date Feb 13, 2020
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20190157173
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with C-Wing and Gull-Wing Leads
- Publication number 20190139869
- Publication date May 9, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS

Khay Chwan Saw

Person

Patents Grantslast 30 patents

Leadframe, semiconductor package and method

Semiconductor package with metal posts from structured leadframe

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor package with lead tip inspection feature

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Formation of conductive connection tracks in package mold body usin...

Pressure sensor having a lidless/laminate structure

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Chip to lead interconnect in encapsulant of molded semiconductor pa...

Formation of conductive connection tracks in package mold body usin...

Molded semiconductor package with C-wing and gull-wing leads

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

Semiconductor Package with Lead Tip Inspection Feature

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

Semiconductor Packages and Methods for Manufacturing Thereof

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

Semiconductor Package with Lead Tip Inspection Feature

Pressure Sensor

Formation of Conductive Connection Tracks in Package Mold Body Usin...

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Pa...

Leadframe, Semiconductor Package and Method

Formation of Conductive Connection Tracks in Package Mold Body Usin...

Molded Semiconductor Package with C-Wing and Gull-Wing Leads