Kian Teng ENG

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,881,863
- Issue date Jan 30, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,589,875
- Issue date Mar 7, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,136,142
- Issue date Sep 15, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,716,873
- Issue date May 6, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
- Patent number 8,592,258
- Issue date Nov 26, 2013
- United Test and Assembly Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball contact and method
- Patent number 6,514,845
- Issue date Feb 4, 2003
- Texas Instruments Incorporated
- Kian Teng Eng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical ball grid array integrated circuit package
- Patent number 6,420,782
- Issue date Jul 16, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,387,729
- Issue date May 14, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,365,833
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical ball grid array integrated circuit package
- Patent number 6,320,126
- Issue date Nov 20, 2001
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and flat plate molding process for integ...
- Patent number 6,177,723
- Issue date Jan 23, 2001
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
- Patent number 6,087,203
- Issue date Jul 11, 2000
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridging method of interconnects for integrated circuit packages
- Patent number 6,084,306
- Issue date Jul 4, 2000
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided single inline memory module
- Patent number 5,998,860
- Issue date Dec 7, 1999
- Texas Instruments Incorporated
- Boon Pew Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density single inline memory module
- Patent number 5,956,233
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible pin location integrated circuit package
- Patent number 5,952,611
- Issue date Sep 14, 1999
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module apparatus having dual sided substrate
- Patent number 5,798,564
- Issue date Aug 25, 1998
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170148722
- Publication date May 25, 2017
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150380346
- Publication date Dec 31, 2015
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140227832
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20120034738
- Publication date Feb 9, 2012
- QIMONDA AG
- Denver Paul C. CASTILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120001306
- Publication date Jan 5, 2012
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHRINK PACKAGE ON BOARD
- Publication number 20100102436
- Publication date Apr 29, 2010
- United Test & Assembly Center Ltd.
- Kian Teng ENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20090194871
- Publication date Aug 6, 2009
- UTAC - United Test and Assembly Test Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVOIDING ELECTRICAL SHORTS IN PACKAGING
- Publication number 20090165815
- Publication date Jul 2, 2009
- United Test & Assembly Center Ltd.
- Debbie Tuerca ALCALA
- B08 - CLEANING
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
- Publication number 20090008796
- Publication date Jan 8, 2009
- United Test & Assembly Center Ltd.
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adhering and sealing a silicon chip in an integrated cir...
- Publication number 20020001882
- Publication date Jan 3, 2002
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS

Kian Teng ENG

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor package and method of attaching semiconductor dies to...

Copper on organic solderability preservative (OSP) interconnect and...

Solder ball contact and method

Vertical ball grid array integrated circuit package

Method for adhering and sealing a silicon chip in an integrated cir...

Integrated circuit package

Vertical ball grid array integrated circuit package

Integrated circuit package and flat plate molding process for integ...

Method for adhering and sealing a silicon chip in an integrated cir...

Bridging method of interconnects for integrated circuit packages

Double sided single inline memory module

High density single inline memory module

Flexible pin location integrated circuit package

Multiple chip module apparatus having dual sided substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SHRINK PACKAGE ON BOARD

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

AVOIDING ELECTRICAL SHORTS IN PACKAGING

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Method for adhering and sealing a silicon chip in an integrated cir...